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1.发明授权Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit 有权聚乙烯基铵化合物，其制造方法，含有所述化合物的酸性溶液和电沉积铜沉积物的方法公开(公告)号：US08114263B2
公开(公告)日：2012-02-14
申请号：US11816717
申请日：2006-03-01
申请人： Wolfgang Dahms , Udo Grieser , Olanda Grieser, legal representative , Christopher Grieser, legal representative , Philip Hartmann
发明人： Wolfgang Dahms , Udo Grieser , Philip Hartmann
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , C08F8/02 , C08F8/44 , C08F226/02 , C08F2800/10 , H05K3/423
摘要： The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyinylammonium compound corresponding to the general chemical formula (1): as well as to polyvinylammonium compounds of the general chemical formula (1), wherein one of the monomer units or both having indices I and m are present in the neutral form.
摘要翻译： 本发明涉及一种聚乙烯基铵化合物，涉及一种制备所述化合物的方法，至少含有所述聚乙烯基铵化合物的酸性水溶液用于电沉积铜沉积物以及使用所述酸性水溶液电沉积铜沉积物的方法 ，对应于通式（1）的所述聚乙烯基铵化合物：以及一般化学式（1）的聚乙烯基铵化合物，其中一个单体单元或两个具有指数I和m的两者均以中性形式存在。
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2.发明授权Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds 有权用于电解沉积含有卤化或假卤代单体吩嗪化合物的铜沉积物的酸性浴公开(公告)号：US07786303B2
公开(公告)日：2010-08-31
申请号：US10575304
申请日：2004-11-09
申请人： Heiko Brunner , Wolfgang Dahms , Udo Grieser , Olanda Grieser, legal representative , Christopher Grieser, legal representative
发明人： Heiko Brunner , Wolfgang Dahms , Udo Grieser
IPC分类号： C07D241/26
CPC分类号： C25D3/38 , C07D241/46
摘要： For manufacturing particularly uniform and mirror bright copper coatings that are leveled and ductile as well using a relatively high current density, halogenated or pseudohalogenated monomeric pheanzinium compounds or a purity at least 85 mole-% and having the general chemical formula (I) are utilized in which R1, R2, R3, R4, R7′, R7″, R8, R9, X and A have the significations denoted in the claims. The compounds are prepared by diazotizing a suited starting compound prior to halogenating or pseudohalogenating it in the presence of mineral acid, diazotization means and halide or pseudohalide, with the reaction steps being run in one single vessel.
摘要翻译： 对于使用相对高的电流密度制造特别均匀的和镜面光亮的铜涂层，使用卤化或假卤化单体pheanzinium化合物或纯度至少为85摩尔％并具有一般化学式（I）的化学式 其中R1，R2，R3，R4，R7'，R7“，R8，R9，X和A具有权利要求中记载的含义。 在无机酸，重氮化装置和卤化物或拟卤化物存在下卤化或假卤化之前，通过重氮化合适的起始化合物来制备化合物，反应步骤在一个单一的容器中进行。
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3.发明授权Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit 有权低聚菲嗪化合物和酸浴的混合物，用于电沉积铜沉积物公开(公告)号：US07872130B2
公开(公告)日：2011-01-18
申请号：US10538286
申请日：2003-12-09
申请人： Heiko Brunner , Wolfgang Dahms , Thomas Moritz , Akif Özkök , Udo Grieser , Olanda Grieser, legal representative , Christopher Grieser, legal representative
发明人： Heiko Brunner , Wolfgang Dahms , Thomas Moritz , Akif Özkök , Udo Grieser
IPC分类号： C07D241/46
CPC分类号： C25D3/38 , C25D7/12 , H01L21/2885 , H05K3/423
摘要： For the reproducible manufacturing of particularly uniform and brilliant i.e., highly bright copper coatings that are leveled and ductile as well, a copper plating bath is utilized that contains as an additive a mixture of oligomeric phenazinium compounds. The mixture contains at least one phenazinium compound selected from the group comprising compounds containing two monomeric units and compounds containing three monomeric units having the general chemical formulae and set forth in the patent claims and in the specification as well as further oligomeric phenazinium compounds.
摘要翻译： 对于特别均匀和辉煌的可重复制造，即均匀且延性良好的高亮度铜涂层，使用含有低聚菲嗪鎓化合物的混合物作为添加剂的镀铜浴。 该混合物含有至少一种选自含有两个单体单元的化合物的组合的化合物和含有三个单体单元的化合物，所述化合物具有在专利权利要求书和说明书中阐述的具有一般化学式I和II的化合物，以及进一步的 低聚菲嗪化合物。
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4.发明申请Polyvinylammonium Compound, Method of Manufacturing Same, Acidic Solution Containing Said Compound and Method of Electrolytically Depositing a Copper Deposit 有权聚乙烯铵化合物，其制造方法，含有所述化合物的酸性溶液和电沉积铜沉积物的方法公开(公告)号：US20080210569A1
公开(公告)日：2008-09-04
申请号：US11816717
申请日：2006-03-01
CPC分类号： C25D3/38 , C08F8/02 , C08F8/44 , C08F226/02 , C08F2800/10 , H05K3/423
摘要： The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyinylammonium compound corresponding to the general chemical formula (1): as well as to polyvinylammonium compounds of the general chemical formula (1), wherein one of the monomer units or both having indices l and m are present in the neutral form.
摘要翻译： 本发明涉及一种聚乙烯基铵化合物，涉及一种制备所述化合物的方法，至少含有所述聚乙烯基铵化合物的酸性水溶液用于电沉积铜沉积物以及使用所述酸性水溶液电沉积铜沉积物的方法 ，对应于通式（1）的所述聚乙烯基铵化合物：以及一般化学式（1）的聚乙烯基铵化合物，其中一个单体单元或两个具有指数l和m的两者均以中性形式存在。
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5.发明申请Acidic bath for electrolytically depositing a copper deposit containing halogenated or pseudohalogenated monomeric phenazinium compounds 有权用于电解沉积含有卤化或假卤代单体吩嗪化合物的铜沉积物的酸性浴公开(公告)号：US20070108062A1
公开(公告)日：2007-05-17
申请号：US10575304
申请日：2004-11-09
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , C07D241/46
摘要： For manufacturing particularly uniform and mirror bright copper coatings that are leveled and ductile as well using a relatively high current density, halogenated or pseudohalogenated monomeric pheanzinium compounds or a purity at least 85 mole-% and having the general chemical formula (I) are utilized in which R1, R2, R3, R4, R7′, R7″, R8, R9, X and A have the significations denoted in the claims. The compounds are prepared by diazotizing a suited starting compound prior to halogenating or pseudohalogenating it in the presence of mineral acid, diazotization means and halide or pseudohalide, with the reaction steps being run in one single vessel.
摘要翻译： 对于使用相对高的电流密度制造特别均匀的和镜面光亮的铜涂层，使用卤化或假卤化单体pheanzinium化合物或纯度至少为85摩尔％并具有一般化学式（I）的化学式 其中R 1，R 2，R 3，R 4，R 7，O， R 7，R 8，R 9，R 9，X和A具有权利要求中记载的含义。 在无机酸，重氮化装置和卤化物或拟卤化物存在下卤化或假卤化之前，通过重氮化合适的起始化合物来制备化合物，反应步骤在一个单一的容器中进行。
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6.发明申请Acid plating bath and method for the electolytic deposition of satin nickel deposits 有权酸性电镀浴和缎纹镍沉积物的电解沉积方法公开(公告)号：US20050150774A1
公开(公告)日：2005-07-14
申请号：US10515412
申请日：2003-05-15
摘要： The plating bath for the deposition of satin nickel deposits according to the present invention contains at least one quarternary ammonium compound and at least one polyether, the at least one polyether having at least one strongly hydrophobic side chain. As compared to prior art plating baths, this acid plating bath has the advantage that it enables a long period of operation or heating and cooling cycles or filtration cycles, makes it possible to perform the filtration needed for continually operating the bath without using active carbon, requires a lower concentration of nickel than prior art baths to produce the satin gloss finish and has a reduced sensitivity to wetting agents that have been dragged in.
摘要翻译： 根据本发明的用于沉积缎纹镍沉积物的电镀浴包含至少一种季铵化合物和至少一种聚醚，所述至少一种聚醚具有至少一个强疏水侧链。 与现有技术的电镀浴相比，该酸性电镀浴的优点是能够长时间的操作或加热和冷却循环或过滤循环，使得可以进行连续操作浴而不使用活性炭所需的过滤， 需要比现有技术浴更低的镍浓度以产生缎光泽光洁度，并且对被拖入的润湿剂的敏感性降低。
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公开(公告)号：US06425996B1
公开(公告)日：2002-07-30
申请号：US09581379
申请日：2000-07-28
申请人： Wolfgang Dahms , Michael Jonat , Gerd Senge , Detley Nitsche
发明人： Wolfgang Dahms , Michael Jonat , Gerd Senge , Detley Nitsche
IPC分类号： C25D338
CPC分类号： C25D3/38 , C08G73/0286
摘要： For the uniform electrolytic deposition of copper coatings, especially on printed circuit boards, an aqueous deposition bath is used which contains as constituents at least one source of copper ions, at least one compound increasing the electrical conductivity of the deposition bath as well as at least one additive, at least one transformation product, formed from epihalohydrins, dihalohydrins or respectively 1-halogen-2,3-propanediols and polyamidoamines being contained as the additive. The polyamidoamines are formed by the condensation reaction of dicarboxylic acids with polyalkylene polyamines. When copper coatings are deposited from this bath, copper layers of uniform layer thickness can be deposited.
摘要翻译： 对于铜涂层的均匀电解沉积，特别是在印刷电路板上，使用含水沉积浴，其含有至少一种铜离子源，至少一种增加沉积浴的电导率的化合物以及至少 一种添加剂，由表卤代醇，二卤代醇或分别为1-卤素-2,3-丙二醇和聚酰胺胺形成的至少一种转化产物作为添加剂。 聚酰胺胺通过二羧酸与聚亚烷基多胺的缩合反应形成。 当铜镀层沉积时，可沉积均匀层厚的铜层。
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8.发明授权
公开(公告)号：US5433840A
公开(公告)日：1995-07-18
申请号：US193016
申请日：1994-04-06
申请人： Wolfgang Dahms , Horst Westphal , Michael Jonat
发明人： Wolfgang Dahms , Horst Westphal , Michael Jonat
CPC分类号： C25D3/38
摘要： An aqueous acid bath for the galvanic deposition of bright, ductile and smooth copper coats which is suitable for decorative purposes as well as for strengthening the conductors of printed circuits. The bath is characterized by a content of polyalkylene glycol ether. When combined with thio compounds containing water-soluble groups, these additions produce an electrolyte with excellent stability. Polymeric phenazonium compounds, polymeric nitrogen compounds and/or thio compounds containing nitrogen may also be successfully combined, in addition, depending on the desired properties.
摘要翻译： PCT No.PCT / DE92 / 00605 Sec。 371日期1994年4月6日 102（e）日期1994年4月6日PCT提交1992年7月22日PCT公布。 出版物WO93 / 03204 日期：1993年2月18日。一种用于电镀沉积光亮，韧性和光滑的铜外套的含水酸浴，其适用于装饰目的以及用于加强印刷电路的导体。 该浴的特征在于聚亚烷基二醇醚的含量。 当与含有水溶性基团的硫代化合物组合时，这些添加剂产生具有优异稳定性的电解质。 另外，根据所需的性质，也可以成功地组合聚合的吩嗪化合物，含氮的聚合氮化合物和/或硫代化合物。
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9.发明授权
公开(公告)号：US4624857A
公开(公告)日：1986-11-25
申请号：US698422
申请日：1985-02-04
申请人： Wolfgang Dahms
发明人： Wolfgang Dahms
摘要： In a method for an automatic control of the galvanic deposition of copper coatings in acid copper bath by measuring a maximal current density and a continual dosing of gloss additives to the bath, the maximal current density is measured by cyclically measuring an actual voltage in the bath and compensating for eventual deviations of the actual voltage from the nominal value by an automatic dosing of the additives by means of dosing devices.
摘要翻译： 在通过测量最大电流密度和向浴中持续添加光泽添加剂来自动控制酸性铜浴中铜涂层的电镀沉积的方法中，通过循环测量浴中的实际电压来测量最大电流密度 并通过定量给料装置自动计量添加剂来补偿实际电压与标称值的最终偏差。
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10.发明授权
公开(公告)号：US5849171A
公开(公告)日：1998-12-15
申请号：US720890
申请日：1996-10-04
申请人： Wolfgang Dahms , Horst Westphal
发明人： Wolfgang Dahms , Horst Westphal
IPC分类号： C25D3/38
CPC分类号： C25D3/38
摘要： An aqueous acid bath for galvanic precipitation of copper is disclosed. The copper plating composition comprises at least one polymer phenazonium compound and .beta.-naphtholalkoxylate. A method for using such a bath for deposition of copper coatings is also disclosed. The resultant copper coatings are smooth and bright with substantially no fine roughness or pitting.
摘要翻译： 公开了一种用于电沉积铜的含水酸浴。 铜电镀组合物包含至少一种聚合物苯扎嗪化合物和β-萘酚烷氧基化物。 还公开了一种使用这种浴来沉积铜涂层的方法。 所得到的铜涂层光滑和明亮，基本上没有细微的粗糙度或点蚀。
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