公开(公告)号：US07786303B2

公开(公告)日：2010-08-31

申请号：US10575304

申请日：2004-11-09

Applicant: Heiko Brunner ,  Wolfgang Dahms ,  Udo Grieser ,  Olanda Grieser, legal representative ,  Christopher Grieser, legal representative

Inventor： Heiko Brunner ,  Wolfgang Dahms ,  Udo Grieser

IPC: C07D241/26

CPC classification number: C25D3/38 ,  C07D241/46

Abstract: For manufacturing particularly uniform and mirror bright copper coatings that are leveled and ductile as well using a relatively high current density, halogenated or pseudohalogenated monomeric pheanzinium compounds or a purity at least 85 mole-% and having the general chemical formula (I) are utilized in which R1, R2, R3, R4, R7′, R7″, R8, R9, X and A have the significations denoted in the claims. The compounds are prepared by diazotizing a suited starting compound prior to halogenating or pseudohalogenating it in the presence of mineral acid, diazotization means and halide or pseudohalide, with the reaction steps being run in one single vessel.

Abstract translation: 对于使用相对高的电流密度制造特别均匀的和镜面光亮的铜涂层，使用卤化或假卤化单体pheanzinium化合物或纯度至少为85摩尔％并具有一般化学式（I）的化学式 其中R1，R2，R3，R4，R7'，R7“，R8，R9，X和A具有权利要求中记载的含义。 在无机酸，重氮化装置和卤化物或拟卤化物存在下卤化或假卤化之前，通过重氮化合适的起始化合物来制备化合物，反应步骤在一个单一的容器中进行。

公开(公告)号：US06723385B1

公开(公告)日：2004-04-20

申请号：US10129705

申请日：2000-09-05

Applicant: Udo Grieser ,  Heinrich Meyer ,  Uwe Hauf

Inventor： Udo Grieser ,  Heinrich Meyer ,  Uwe Hauf

IPC: B05D300

CPC classification number: H05K3/389 ,  C23C22/52 ,  C23C22/83 ,  C23F1/18 ,  H05K3/383 ,  H05K3/4611 ,  H05K2203/0796 ,  H05K2203/124

Abstract: A process to pretreat copper surfaces for tight bonding to organic substrates as those found in multilayer printed circuit boards includes first treating the copper with a solution containing hydrogen peroxide, and at least one acid, and at least one nitrogen-containing five-member heterocyclic compound which does not contain sulfur, selenium or tellurium atoms in the heterocycle. Thereafter the copper surfaces are brought into contact with a second solution containing at least one adhesion-promoting compound from the group consisting of sufinic acid, selinic acid, telluric acid, and heterocyclic compounds that contain at least one sulfur, and/or selenium and/or tellurium atom in the heterocycie and also sulfonium, selenonium and telluronium salts.

Abstract translation: 预处理铜表面以与多层印刷电路板中发现的铜表面紧密结合的方法包括首先用含有过氧化氢的溶液和至少一种酸和至少一种含氮五元杂环化合物处理铜 其在杂环中不含硫，硒或碲原子。 此后，使铜表面与含有至少一种粘附促进化合物的第二溶液接触，所述粘合促进化合物包括由齐墩果酸，联苯二酸，碲酸和含有至少一个硫和/或硒和/或硒的杂环化合物组成的组， 或碲原子，还有锍，硒和碲鎓盐。

公开(公告)号：US20070108062A1

公开(公告)日：2007-05-17

申请号：US10575304

申请日：2004-11-09

Applicant: Heiko Brunner ,  Wolfgang Dahms ,  Udo Grieser ,  Olanda Grieser ,  Christopher Grieser

Inventor： Heiko Brunner ,  Wolfgang Dahms ,  Udo Grieser ,  Olanda Grieser ,  Christopher Grieser

IPC: C25D3/38

CPC classification number: C25D3/38 ,  C07D241/46

Abstract: For manufacturing particularly uniform and mirror bright copper coatings that are leveled and ductile as well using a relatively high current density, halogenated or pseudohalogenated monomeric pheanzinium compounds or a purity at least 85 mole-% and having the general chemical formula (I) are utilized in which R1, R2, R3, R4, R7′, R7″, R8, R9, X and A have the significations denoted in the claims. The compounds are prepared by diazotizing a suited starting compound prior to halogenating or pseudohalogenating it in the presence of mineral acid, diazotization means and halide or pseudohalide, with the reaction steps being run in one single vessel.

Abstract translation: 对于使用相对高的电流密度制造特别均匀的和镜面光亮的铜涂层，使用卤化或假卤化单体pheanzinium化合物或纯度至少为85摩尔％并具有一般化学式（I）的化学式 其中R 1，R 2，R 3，R 4，R 7，O， R 7，R 8，R 9，R 9，X和A具有权利要求中记载的含义。 在无机酸，重氮化装置和卤化物或拟卤化物存在下卤化或假卤化之前，通过重氮化合适的起始化合物来制备化合物，反应步骤在一个单一的容器中进行。

公开(公告)号：US06593249B2

公开(公告)日：2003-07-15

申请号：US09852384

申请日：2001-05-10

Applicant: Heinrich Meyer ,  Udo Grieser

Inventor： Heinrich Meyer ,  Udo Grieser

IPC: H01L2131

CPC classification number: H01L21/31 ,  G03F7/202 ,  H05K3/0032 ,  H05K3/0076 ,  H05K3/061 ,  H05K3/4644 ,  H05K2203/135

Abstract: A method of reproducibly manufacturing circuit carriers with very fine circuit structures, more specifically with structure widths of 50 &mgr;m and less, is described in which a substrate provided with a base metal surface is provided, a layer of varnish is applied onto the substrate by an electrophoretic method, the layer of varnish is ablated in at least parts of the regions that do not correspond to the metal pattern to be formed, the base metal surface being laid bare, the bare base metal surface is etched, the layer of varnish being ablated by means of ultraviolet irradiation, more specifically with an ultraviolet laser beam.

Abstract translation: 描述了一种可重复地制造具有非常精细的电路结构的电路载体的方法，更具体地说，其结构宽度为50um以下，其中提供了具有贱金属表面的基板，通过一个 电泳方法中，在不对应于要形成的金属图案的区域的至少一部分中，清漆层被烧蚀，贱金属表面被裸露，裸露的贱金属表面被蚀刻，清漆层被烧蚀 通过紫外线照射更具体地使用紫外线激光束。

公开(公告)号：US06562149B1

公开(公告)日：2003-05-13

申请号：US09601494

申请日：2000-08-22

Applicant: Udo Grieser ,  Heinrich Meyer

Inventor： Udo Grieser ,  Heinrich Meyer

IPC: C23C2248

CPC classification number: C23F1/18 ,  C23C22/52 ,  C23C22/83 ,  H05K3/383 ,  H05K3/389 ,  H05K3/4611 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The invention concerns processes and solutions for the preliminary treatment of copper surfaces which are subsequently to be firmly bonded to organic substrates. The solution is used, in particular, for firmly bonding laminated multilayered printed circuit boards and for firmly bonding resists to the copper surfaces of printed circuit boards. The solutions contain (a) hydrogen peroxide; (b) at least one acid; (c) at least one nitrogen-containing, five-membered heterocyclic compound which does not contain any sulphur, selenium or tellurium atom in the heterocycle; and (d) at least one adhesive compound from the group consisting of sulfinic acids, seleninic acids, tellurinic acids, heterocyclic compounds containing at least one sulphur, selenium and/or tellurium atom in the heterocycle, and sulfonium, selenonium and telluronium salts having the general formula (A), in which A stands for S, Se or Te; R1, R2 and R3 stand for alkyl, substituted alkyl, alkenyl, phenyl, substituted phenyl, benzyl, cycloalkyl, substituted cycloalkyl, R1, R2 and R3 being the same or different; and X− stands for an anion of an inorganic or organic acid or hydroxide, provided that the acid selected to constitute component (b) is not identical to the sulfinic, seleninic or tellurinic acids selected as component (d).

Abstract translation: 本发明涉及用于铜表面的初步处理的方法和解决方案，其随后将牢固地结合到有机基底上。 特别地，该溶液用于牢固地粘结层叠的多层印刷电路板，并将抗蚀剂牢固地粘合到印刷电路板的铜表面。 溶液含有（a）过氧化氢; （b）至少一种酸; （c）至少一种在杂环中不含硫，硒或碲原子的含氮五元杂环化合物; 和（d）至少一种由亚磺酸，硒酸，碲酸，杂环中含有至少一个硫，硒和/或碲原子的杂环化合物组成的组，以及锍，硒和碲鎓盐，其具有 通式（A），其中A代表S，Se或Te; R1，R2和R3代表烷基，取代的烷基，烯基，苯基，取代的苯基，苄基，环烷基，取代的环烷基，R1，R2和R3相同或不同; 并且X代表无机或有机酸或氢氧化物的阴离子，条件是选自构成组分（b）的酸与选自组分（d）的亚磺酸，硒化或碲酸反应不同。

公开(公告)号：US07153449B2

公开(公告)日：2006-12-26

申请号：US10311395

申请日：2001-07-06

Applicant: Uwe Hauf ,  Harry Fuerhaupter ,  Alexey Stiop ,  Udo Grieser

Inventor： Uwe Hauf ,  Harry Fuerhaupter ,  Alexey Stiop ,  Udo Grieser

IPC: C09K13/00

CPC classification number: H05K3/383 ,  C23C22/52 ,  C23F1/18 ,  H05K3/064 ,  H05K3/28 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein R1 and R2=alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R3=R1, R1—O, R1—S, amino or substituted amino, wherein R1 and R2 may especially be phenyl or substituted phenyl.

Abstract translation: 本发明涉及一种处理铜表面的方法和方法，所述铜表面与含有过氧化氢和至少一种五元杂环化合物的酸性处理液接触，另外还包括至少一种微结构修饰 选自包含硫醇A，二硫化物B，硫化物C和硫代酰胺D的组分，其具有以下各自的通式：其中R 1和R 2 =烷基，烯基，芳基 ，芳烷基，特别是苄基，环烷基及其衍生物，R 3是R 1，R 1 -O，R 1， 其中R 1和R 2可以特别是苯基或取代的苯基。

公开(公告)号：US06652728B1

公开(公告)日：2003-11-25

申请号：US09786242

申请日：2001-06-25

Applicant: Birgit Sonntag ,  Udo Grieser ,  Barrie Sydney James

Inventor： Birgit Sonntag ,  Udo Grieser ,  Barrie Sydney James

IPC: C25D322

CPC classification number: C25D3/22 ,  C25D3/565

Abstract: An aqueous alkaline cyanide-free bath for the galvanic deposition of zinc or zinc alloy coatings on substrate surfaces is described, which contains in addition to a source of zinc ions and optionally a source of further metal ions, also hydroxide ions and a polymer of the general formula A that is soluble in the bath as well as optionally conventional additives. The bath may furthermore contain a quaternary derivative of a pyridine-3-carboxylic acid of the formula B and/or a quaternary derivative of a pyridine-3-carboxylic acid of the formula C A process for the galvanic deposition of zinc coatings and zinc alloy coatings using the aforedescribed bath is also described. By using the baths according to the invention it is possible to produce coatings that exhibit a uniform layer thickness combined with a high gloss, and which do not exhibit any tendency to exfoliate.

Abstract translation: 描述了用于在基底表面上电镀锌或锌合金涂层的碱性无氰水溶液，其还包含锌离子源和任选的其它金属离子源，还包含氢氧根离子和 可溶于浴的通式A以及任选的常规添加剂。 该浴还可以含有式B的吡啶-3-羧酸的季衍生物和/或式CA方法的吡啶-3-羧酸的季衍生物，用于电镀锌涂层和锌合金涂层 还描述了使用上述浴。通过使用根据本发明的浴，可以生产出具有与高光泽度结合的均匀层厚度并且不表现出任何脱落倾向的涂层。

公开(公告)号：US08114263B2

公开(公告)日：2012-02-14

申请号：US11816717

申请日：2006-03-01

Applicant: Wolfgang Dahms ,  Udo Grieser ,  Olanda Grieser, legal representative ,  Christopher Grieser, legal representative ,  Philip Hartmann

Inventor： Wolfgang Dahms ,  Udo Grieser ,  Philip Hartmann

IPC: C25D3/38

CPC classification number: C25D3/38 ,  C08F8/02 ,  C08F8/44 ,  C08F226/02 ,  C08F2800/10 ,  H05K3/423

Abstract: The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyinylammonium compound corresponding to the general chemical formula (1): as well as to polyvinylammonium compounds of the general chemical formula (1), wherein one of the monomer units or both having indices I and m are present in the neutral form.

Abstract translation: 本发明涉及一种聚乙烯基铵化合物，涉及一种制备所述化合物的方法，至少含有所述聚乙烯基铵化合物的酸性水溶液用于电沉积铜沉积物以及使用所述酸性水溶液电沉积铜沉积物的方法 ，对应于通式（1）的所述聚乙烯基铵化合物：以及一般化学式（1）的聚乙烯基铵化合物，其中一个单体单元或两个具有指数I和m的两者均以中性形式存在。

公开(公告)号：US07872130B2

公开(公告)日：2011-01-18

申请号：US10538286

申请日：2003-12-09

Applicant: Heiko Brunner ,  Wolfgang Dahms ,  Thomas Moritz ,  Akif Özkök ,  Udo Grieser ,  Olanda Grieser, legal representative ,  Christopher Grieser, legal representative

Inventor： Heiko Brunner ,  Wolfgang Dahms ,  Thomas Moritz ,  Akif Özkök ,  Udo Grieser

IPC: C07D241/46

CPC classification number: C25D3/38 ,  C25D7/12 ,  H01L21/2885 ,  H05K3/423

Abstract: For the reproducible manufacturing of particularly uniform and brilliant i.e., highly bright copper coatings that are leveled and ductile as well, a copper plating bath is utilized that contains as an additive a mixture of oligomeric phenazinium compounds. The mixture contains at least one phenazinium compound selected from the group comprising compounds containing two monomeric units and compounds containing three monomeric units having the general chemical formulae and set forth in the patent claims and in the specification as well as further oligomeric phenazinium compounds.

Abstract translation: 对于特别均匀和辉煌的可重复制造，即均匀且延性良好的高亮度铜涂层，使用含有低聚菲嗪鎓化合物的混合物作为添加剂的镀铜浴。 该混合物含有至少一种选自含有两个单体单元的化合物的组合的化合物和含有三个单体单元的化合物，所述化合物具有在专利权利要求书和说明书中阐述的具有一般化学式I和II的化合物，以及进一步的 低聚菲嗪化合物。

公开(公告)号：US20080210569A1

公开(公告)日：2008-09-04

申请号：US11816717

申请日：2006-03-01

Applicant: Wolfgang Dahms ,  Udo Grieser ,  Olanda Grieser ,  Christopher Grieser ,  Philip Hartmann

Inventor： Wolfgang Dahms ,  Udo Grieser ,  Olanda Grieser ,  Christopher Grieser ,  Philip Hartmann

IPC: C25D3/38 ,  C08K3/10

CPC classification number: C25D3/38 ,  C08F8/02 ,  C08F8/44 ,  C08F226/02 ,  C08F2800/10 ,  H05K3/423

Abstract: The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyinylammonium compound corresponding to the general chemical formula (1): as well as to polyvinylammonium compounds of the general chemical formula (1), wherein one of the monomer units or both having indices l and m are present in the neutral form.

Abstract translation: 本发明涉及一种聚乙烯基铵化合物，涉及一种制备所述化合物的方法，至少含有所述聚乙烯基铵化合物的酸性水溶液用于电沉积铜沉积物以及使用所述酸性水溶液电沉积铜沉积物的方法 ，对应于通式（1）的所述聚乙烯基铵化合物：以及一般化学式（1）的聚乙烯基铵化合物，其中一个单体单元或两个具有指数l和m的两者均以中性形式存在。