Method for production of a read-only-memory cell arrangement having
vertical MOS transistors
    1.
    发明授权
    Method for production of a read-only-memory cell arrangement having vertical MOS transistors 失效
    用于制造具有垂直MOS晶体管的只读存储单元布置方法

    公开(公告)号:US5744393A

    公开(公告)日:1998-04-28

    申请号:US836175

    申请日:1997-04-17

    CPC分类号: H01L27/112

    摘要: A method for production of a read-only-memory cell arrangement having vertical MOS transistors is provided. In order to produce a read-only-memory cell arrangement which has first memory cells having a vertical MOS transistor and second memory cells which do not have a vertical MOS transistor, holes provided with a gate dielectric and a gate electrode are etched in a silicon substrate with a layer sequencing corresponding to a source, a channel and a drain for the first memory cells. Insulation trenches whose separation is preferably equal to their width are produced for insulation of adjacent memory cells.

    摘要翻译: PCT No.PCT / DE95 / 01365 Sec。 371日期1997年04月17日 102(e)日期1997年4月17日PCT提交1995年10月5日PCT公布。 出版物WO96 / 13064 日期:1996年5月2日提供具有垂直MOS晶体管的只读存储单元布置方法。 为了产生具有垂直MOS晶体管的第一存储单元和不具有垂直MOS晶体管的第二存储单元的只读存储单元布置,在栅极电介质和栅电极中设置的孔被蚀刻在硅 具有对应于第一存储器单元的源极,沟道和漏极的层序列的衬底。 为了绝缘相邻的存储单元而产生绝缘沟槽,其隔离优选等于其宽度。

    Method of producing a read-only storage cell arrangement
    2.
    发明授权
    Method of producing a read-only storage cell arrangement 失效
    制造只读存储单元布置的方法

    公开(公告)号:US5998261A

    公开(公告)日:1999-12-07

    申请号:US973701

    申请日:1997-12-08

    CPC分类号: H01L27/11517 H01L27/115

    摘要: An electrically writable and erasable read-only memory cell arrangement fabricated in a semiconductor substrate, preferably of monocrystalline silicon, or in a silicon layer of an SOI substrate. A cell array with memory cells is provided on a main surface of the semiconductor substrate. Each memory cell comprises an MOS transistor, vertical to the main surface and comprising, in addition to the source/drain region and a channel region arranged in-between, a first dielectric, a floating gate, a second dielectric and a control gate. A plurality of essentially parallel strip-shaped trenches are provided in the cell array. The vertical MOS transistors are arranged on the flanks of the trenches. The memory cells are in each case arranged on opposite flanks of the trenches.

    摘要翻译: PCT No.PCT / DE96 / 01117 Sec。 371 1997年12月8日第 102(e)日期1997年12月8日PCT提交1996年6月25日PCT公布。 第WO97 / 02599号公报 日期1997年1月23日在半导体衬底(优选单晶硅)或SOI衬底的硅层中制造的电可写和可擦除的只读存储单元布置。 具有存储单元的单元阵列设置在半导体基板的主表面上。 每个存储单元包括垂直于主表面的MOS晶体管,并且除了源极/漏极区域和布置在其之间的沟道区域之外还包括第一电介质,浮动栅极,第二电介质和控制栅极。 多个基本上平行的带状沟槽设置在单元阵列中。 垂直MOS晶体管布置在沟槽的侧面。 存储单元在每种情况下都布置在沟槽的相对侧面上。

    Read-only memory cell arrangement and method for its production
    3.
    发明授权
    Read-only memory cell arrangement and method for its production 失效
    只读存储单元布置及其生产方法

    公开(公告)号:US5920778A

    公开(公告)日:1999-07-06

    申请号:US913740

    申请日:1997-09-23

    IPC分类号: H01L21/8246 H01L27/112

    CPC分类号: H01L27/11273 H01L27/112

    摘要: In a read-only memory cell arrangement having first memory cells which contain a vertical MOS transistor, and having second memory cells which do not contain vertical MOS transistors, the memory cells are arranged along opposite flanks of strip-shaped parallel insulation trenches (16). The width of the insulation trenches (16) is preferably equal to their separation, so that the memory cell arrangement can be produced with a space requirement of 2F.sup.2 per memory cell, F being the minimum structure size in the respective technology.

    摘要翻译: PCT No.PCT / DE96 / 00614 Sec。 371日期1997年9月23日 102(e)1997年9月23日PCT PCT 1996年4月9日PCT公布。 公开号WO96 / 3351300 日期1996年10月24日在具有包含垂直MOS晶体管的第一存储单元且具有不包含垂直MOS晶体管的第二存储单元的只读存储单元布置中,存储单元沿着带状平行的相对侧布置 绝缘沟槽(16)。 绝缘沟槽(16)的宽度优选等于它们的间隔,使得可以以每个存储单元的空间要求为2F2来生产存储单元布置,F是相应技术中的最小结构尺寸。

    Integrated CMOS circuit configuration, and production of same
    5.
    发明授权
    Integrated CMOS circuit configuration, and production of same 有权
    集成CMOS电路配置,生产相同

    公开(公告)号:US06518628B1

    公开(公告)日:2003-02-11

    申请号:US09423864

    申请日:1999-11-15

    IPC分类号: H01L2976

    CPC分类号: H01L27/0922

    摘要: An integrated CMOS circuit arrangement and a method of manufacturing same, which includes both a first MOS transistor and a second MOS transistor complementary thereto, wherein one of the MOS transistors is arranged at the floor of a trench and the other is arranged at the principal surface of a semiconductor substrate. The MOS transistors are arranged relative to one another such that a current flow through the MOS transistors respectively occurs substantially parallel to a sidewall of the trench that is arranged between the MOS transistors.

    摘要翻译: 一种集成CMOS电路装置及其制造方法,其包括第一MOS晶体管和与其互补的第二MOS晶体管,其中MOS晶体管中的一个布置在沟槽的底部,而另一个布置在主表面 的半导体衬底。 MOS晶体管相对于彼此布置,使得流过MOS晶体管的电流分别基本上平行于布置在MOS晶体管之间的沟槽的侧壁。

    Read-only memory cell array and process for manufacturing it
    6.
    发明授权
    Read-only memory cell array and process for manufacturing it 失效
    只读存储单元阵列及其制造过程

    公开(公告)号:US5920099A

    公开(公告)日:1999-07-06

    申请号:US913332

    申请日:1997-09-11

    IPC分类号: H01L21/8246 H01L27/112

    CPC分类号: H01L27/1126 H01L27/112

    摘要: A read-only memory cell array has a plurality of individual memory cells which each have a MOS transistor and which are arranged in rows running in parallel. In this context, adjacent rows run alternately at the bottom of the longitudinal trenches (6) and between adjacent longitudinal trenches (6) respectively and are insulated with respect to one another. The read-only memory cell array can be manufactured by self-aligning process steps with an area of 2 F.sup.2 (F: minimum structure size) being required per memory cell.

    摘要翻译: PCT No.PCT / DE96 / 00380 Sec。 371日期:1997年9月11日 102(e)1997年9月11日PCT PCT 1996年3月4日PCT公布。 公开号WO96 / 29739 日期1996年9月26日只读存储单元阵列具有多个单独的存储单元,每个单独存储单元具有MOS晶体管并且并行排列。 在这种情况下,相邻的行分别在纵向沟槽(6)的底部和相邻的纵向沟槽(6)之间交替地延伸并相对于彼此绝缘。 只读存储单元阵列可以通过每个存储单元需要2 F2(F:最小结构尺寸)面积的自对准工艺步骤来制造。

    Method of producing and arrangement containing self-amplifying dynamic
MOS transistor memory cells
    7.
    发明授权
    Method of producing and arrangement containing self-amplifying dynamic MOS transistor memory cells 失效
    包含自放大动态MOS晶体管存储单元的制造和布置方法

    公开(公告)号:US5710072A

    公开(公告)日:1998-01-20

    申请号:US737236

    申请日:1996-11-18

    摘要: To produce an arrangement containing self-amplifying dynamic MOS transistor memory cells which each comprise a selection transistor, a memory transistor and a diode structure, the selection transistor and the memory transistor being connected in series via a common nodal point and the diode structure being connected between the common nodal point and the gate electrode (10) of the memory transistor, the selection transistor and the memory transistor are formed as vertical MOS transistors. For this purpose a vertical sequence of suitably doped zones (2, 3, 4) in which trenches (5, 6) are produced and which are provided with gate dielectric (7, 8) and gate electrode (9, 10) is produced, in particular, by LPCVD epitaxy or by molecular-beam epitaxy.

    摘要翻译: PCT No.PCT / EP95 / 01656 Sec。 371日期:1996年11月18日 102(e)1996年11月18日PCT PCT 1995年5月2日PCT公布。 公开号WO95 / 31828 日期:1995年11月23日为了制造包含自放大动态MOS晶体管存储单元的布置,每个包括选择晶体管,存储晶体管和二极管结构,选择晶体管和存储晶体管通过公共节点串联连接, 二极管结构连接在存储晶体管的公共节点和栅电极(10)之间,选择晶体管和存储晶体管形成为垂直MOS晶体管。 为此,产生其中产生沟槽(5,6)并且设置有栅极电介质(7,8)和栅电极(9,10))的适当掺杂区(2,3,4)的垂直序列, 特别是通过LPCVD外延或通过分子束外延。

    Electrically programmable memory cell arrangement and method for its
manufacture
    9.
    发明授权
    Electrically programmable memory cell arrangement and method for its manufacture 失效
    电可编程存储单元布置及其制造方法

    公开(公告)号:US5959328A

    公开(公告)日:1999-09-28

    申请号:US779446

    申请日:1997-01-07

    CPC分类号: H01L27/11568 H01L27/115

    摘要: An electrically programmable memory cell arrangement has a plurality of individual memory cells that respectively has an MOS transistor with a gate dielectric with traps, and which are arranged in rows that run in parallel. Adjacent rows thereby respectively run in alternating fashion on the bottom of the longitudinal trenches (5) and between adjacent longitudinal trenches (5) and are insulated against one another. The memory cell arrangement can be manufactured by means of self-adjusting process steps with a surface requirement per memory cell of 2 F.sup.2 (F: minimum structural size).

    摘要翻译: 电可编程存储单元布置具有多个单独的存储单元,它们分别具有带栅极电介质的MOS晶体管,并具有陷阱,并且它们排列成并行的行。 因此,相邻的行分别以纵向沟槽(5)的底部和相邻的纵向沟槽(5)之间交替地延伸并彼此绝缘。 可以通过自调整工艺步骤制造存储单元布置,每个存储单元的表面要求为2×2(F:最小结构尺寸)。

    DRAM cell arrangement and method for its manufacture
    10.
    发明授权
    DRAM cell arrangement and method for its manufacture 失效
    DRAM单元布置及其制造方法

    公开(公告)号:US5736761A

    公开(公告)日:1998-04-07

    申请号:US645503

    申请日:1996-05-14

    CPC分类号: H01L27/10876 H01L27/10823

    摘要: The DRAM cell arrangement has one vertical MOS transistor per memory cell, whose first source/drain region adjoins a trenched bitline (5), whose gate electrode (13) is connected with a trenched wordline and whose second source/drain region (3) adjoins a substrate main surface (1). A capacitor dielectric (16), which is in particular a ferroelectric or paraelectric layer, is arranged on at least the second source/drain region and a capacitor plate (17) is arranged on the dielectric, so that the second source/drain region (3) acts additionally as a memory node. The DRAM cell arrangement can be manufactured with a memory cell surface of 4 F.sup.2.

    摘要翻译: DRAM单元布置对每个存储单元具有一个垂直MOS晶体管,其第一源极/漏极区域邻接沟槽位线(5),其栅极电极(13)与沟槽字线连接,并且其第二源极/漏极区域(3)邻接 基板主表面(1)。 至少在第二源极/漏极区域上布置有特别是铁电体或者顺电层的电容器电介质(16),并且电容器板(17)布置在电介质上,使得第二源极/漏极区域 3)另外作为存储器节点。 可以利用4F2的存储单元表面来制造DRAM单元布置。