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公开(公告)号：US08432007B2
公开(公告)日：2013-04-30
申请号：US13075936
申请日：2011-03-30
申请人： Anton Leidl , Hans Krueger , Alois Stelzl , Wolfgang Pahl , Stefan Seitz
发明人： Anton Leidl , Hans Krueger , Alois Stelzl , Wolfgang Pahl , Stefan Seitz
IPC分类号： H01L29/84
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译： 本文描述了微机电系统（MEMS）封装。 封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。 封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。
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公开(公告)号：US20110186943A1
公开(公告)日：2011-08-04
申请号：US13075936
申请日：2011-03-30
申请人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
发明人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译： 本文描述了微机电系统（MEMS）封装。 封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。 封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。
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公开(公告)号：US08865499B2
公开(公告)日：2014-10-21
申请号：US13805630
申请日：2011-07-07
申请人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
发明人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
IPC分类号： H01L21/00
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/096 , B81C1/00309 , H01L2224/16225 , H01L2924/15151 , H01L2924/16151 , H04R1/086 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/006
摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.
摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中换能器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（S01）; 进行麦克风的功能测试; 第一声音入口（S01）关闭; 并且在盖中产生第二声音入口（S02）。 本发明还涉及由该方法产生的麦克风，其中第一声音入口开口（S01）准备但关闭。
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公开(公告)号：US08169041B2
公开(公告)日：2012-05-01
申请号：US12092439
申请日：2006-11-06
申请人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
发明人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
IPC分类号： H01L29/84
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译： 本文描述了微机电系统（MEMS）封装。 封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。 封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。
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公开(公告)号：US20130140656A1
公开(公告)日：2013-06-06
申请号：US13805630
申请日：2011-07-07
申请人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
发明人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/096 , B81C1/00309 , H01L2224/16225 , H01L2924/15151 , H01L2924/16151 , H04R1/086 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/006
摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO1) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (SO1) is closed; and a second sound inlet opening (SO2) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (SO1) is prepared but closed.
摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中传感器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（SO1）; 进行麦克风的功能测试; 第一声音入口开口（SO1）关闭; 并且在盖中产生第二声音入口开口（SO2）。 本发明还涉及一种由该方法产生的麦克风，其中第一声音入口开口（SO1）准备但关闭。
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公开(公告)号：US20090001553A1
公开(公告)日：2009-01-01
申请号：US12092439
申请日：2006-11-06
申请人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
发明人： Wolfgang Pahl , Anton Leidl , Stefan Seitz , Hans Krueger , Alois Stelzl
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译： 本文描述了微机电系统（MEMS）封装。 封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。 封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。
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7.发明申请公开(公告)号：US20110233690A1
公开(公告)日：2011-09-29
申请号：US12999421
申请日：2009-06-16
申请人： Gregor Feiertag , Hans Krueger , Anton Leidl , Alois Stelzl
发明人： Gregor Feiertag , Hans Krueger , Anton Leidl , Alois Stelzl
CPC分类号： G01L19/141 , H01L25/165 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/09701 , H01L2924/00
摘要： On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.
摘要翻译： 在载体（1）上，一个粘合层（4），ASIC芯片（2）和传感器芯片（3）彼此排列。 提供了用于将芯片彼此电连接的芯片间连接（5），并且提供ASIC连接（6）用于外部电连接集成在ASIC芯片中的电路。
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8.发明授权公开(公告)号：US08580613B2
公开(公告)日：2013-11-12
申请号：US12999421
申请日：2009-06-16
申请人： Gregor Feiertag , Hans Krueger , Anton Leidl , Alois Stelzl
发明人： Gregor Feiertag , Hans Krueger , Anton Leidl , Alois Stelzl
IPC分类号： H01L21/00
CPC分类号： G01L19/141 , H01L25/165 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/09701 , H01L2924/00
摘要： On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.
摘要翻译： 在载体（1）上，一个粘合层（4），ASIC芯片（2）和传感器芯片（3）彼此排列。 提供了用于将芯片彼此电连接的芯片间连接（5），并且提供ASIC连接（6）用于外部电连接集成在ASIC芯片中的电路。
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公开(公告)号：US09647196B2
公开(公告)日：2017-05-09
申请号：US14007074
申请日：2012-03-28
申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl , Wolfgang Pahl , Robert Koch
发明人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl , Wolfgang Pahl , Robert Koch
IPC分类号： H01L41/053 , B81C1/00 , H03H9/10 , H01L41/25 , H01L23/00
CPC分类号： H01L41/053 , B81B2207/095 , B81C1/00301 , H01L24/11 , H01L41/25 , H01L2224/1134 , H01L2924/01322 , H01L2924/12042 , H01L2924/1461 , H03H9/1071 , Y10T29/42 , H01L2924/00 , H01L2924/00014
摘要： A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.
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公开(公告)号：US20140111062A1
公开(公告)日：2014-04-24
申请号：US14007074
申请日：2012-03-28
申请人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl , Wolfgang Pahl , Robert Koch
发明人： Christian Bauer , Hans Krueger , Juergen Portmann , Alois Stelzl , Wolfgang Pahl , Robert Koch
IPC分类号： H01L41/053 , H01L41/25
CPC分类号： H01L41/053 , B81B2207/095 , B81C1/00301 , H01L24/11 , H01L41/25 , H01L2224/1134 , H01L2924/01322 , H01L2924/12042 , H01L2924/1461 , H03H9/1071 , Y10T29/42 , H01L2924/00 , H01L2924/00014
摘要： A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.
摘要翻译： 提出了由两个压电晶片组成的密封晶片级封装，其优选在材料方面是相同的及其制造方法。 两个晶片之间的电气和机械连接通过框架结构和支柱实现，其框架结构和支柱分布在两个晶片之间的部分结构借助于连接层进行晶片结合。
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