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公开(公告)号：US08865499B2
公开(公告)日：2014-10-21
申请号：US13805630
申请日：2011-07-07
申请人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
发明人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
IPC分类号： H01L21/00
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/096 , B81C1/00309 , H01L2224/16225 , H01L2924/15151 , H01L2924/16151 , H04R1/086 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/006
摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (S01) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (S01) is closed; and a second sound inlet opening (S02) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (S01) is prepared but closed.
摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中换能器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（S01）; 进行麦克风的功能测试; 第一声音入口（S01）关闭; 并且在盖中产生第二声音入口（S02）。 本发明还涉及由该方法产生的麦克风，其中第一声音入口开口（S01）准备但关闭。
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2.发明申请公开(公告)号：US20110233690A1
公开(公告)日：2011-09-29
申请号：US12999421
申请日：2009-06-16
申请人： Gregor Feiertag , Hans Krueger , Anton Leidl , Alois Stelzl
发明人： Gregor Feiertag , Hans Krueger , Anton Leidl , Alois Stelzl
CPC分类号： G01L19/141 , H01L25/165 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/09701 , H01L2924/00
摘要： On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.
摘要翻译： 在载体（1）上，一个粘合层（4），ASIC芯片（2）和传感器芯片（3）彼此排列。 提供了用于将芯片彼此电连接的芯片间连接（5），并且提供ASIC连接（6）用于外部电连接集成在ASIC芯片中的电路。
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公开(公告)号：US20130140656A1
公开(公告)日：2013-06-06
申请号：US13805630
申请日：2011-07-07
申请人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
发明人： Wolfgang Pahl , Hans Krueger , Gregor Feiertag , Alois Stelzl , Anton Leidl , Stefan Seitz
CPC分类号： B81B7/0061 , B81B2201/0257 , B81B2207/096 , B81C1/00309 , H01L2224/16225 , H01L2924/15151 , H01L2924/16151 , H04R1/086 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/006
摘要： The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO1) is produced in the carrier (TR); a functional test of the microphone is carried out; the first sound inlet opening (SO1) is closed; and a second sound inlet opening (SO2) is created in the cover. The present invention further relates to a microphone resulting from the method, in which the first sound inlet opening (SO1) is prepared but closed.
摘要翻译： 本发明涉及一种用于制造麦克风的方法，其中传感器元件（WE）安装在载体（TR）上; 换能器元件（WE）和载体（TR）之间布置有覆盖物，使得换能器元件（WE）被封闭在盖体和载体（TR）之间; 在载体（TR）中产生第一声音入口（SO1）; 进行麦克风的功能测试; 第一声音入口开口（SO1）关闭; 并且在盖中产生第二声音入口开口（SO2）。 本发明还涉及一种由该方法产生的麦克风，其中第一声音入口开口（SO1）准备但关闭。
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4.发明授权公开(公告)号：US08580613B2
公开(公告)日：2013-11-12
申请号：US12999421
申请日：2009-06-16
申请人： Gregor Feiertag , Hans Krueger , Anton Leidl , Alois Stelzl
发明人： Gregor Feiertag , Hans Krueger , Anton Leidl , Alois Stelzl
IPC分类号： H01L21/00
CPC分类号： G01L19/141 , H01L25/165 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/09701 , H01L2924/00
摘要： On a carrier (1) an adhesion layer (4), an ASIC chip (2) and a sensor chip (3) are arranged one above another. An interchip connection (5) is provided for electrically connecting the chips among one another, and an ASIC connection (6) is provided for externally electrically connecting the circuit integrated in the ASIC chip.
摘要翻译： 在载体（1）上，一个粘合层（4），ASIC芯片（2）和传感器芯片（3）彼此排列。 提供了用于将芯片彼此电连接的芯片间连接（5），并且提供ASIC连接（6）用于外部电连接集成在ASIC芯片中的电路。
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公开(公告)号：US08404516B2
公开(公告)日：2013-03-26
申请号：US12627707
申请日：2009-11-30
申请人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
发明人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
IPC分类号： H01L21/00
CPC分类号： B81C1/00269 , B81B7/0058 , B81C2203/0136 , B81C2203/019 , H01L24/14 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1461 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.
摘要翻译： 载体基板具有安装位置，在顶侧具有多个电连接焊盘，并且在下侧上与其连接的外部触点。 金属框架包围安装位置的连接垫。 MEMS芯片在下侧具有电触点。 MEMS芯片以这样的方式被放置在载体基板的安装位置上，使得MEMS芯片在金属框架上的下侧的边缘区域被安置。 使用倒装芯片工艺，MEMS芯片的电触点通过凸块连接到载体衬底的连接焊盘，金属框架连接到MEMS芯片，使得在MEMS芯片和载体衬底之间形成闭合腔 。
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公开(公告)号：US07552532B2
公开(公告)日：2009-06-30
申请号：US10484942
申请日：2002-06-14
申请人： Alois Stelzl , Hans Krueger , Gregor Feiertag , Ernst Christl
发明人： Alois Stelzl , Hans Krueger , Gregor Feiertag , Ernst Christl
IPC分类号： H05K13/00
CPC分类号： H01L24/97 , H01L21/50 , H01L23/10 , H01L23/552 , H01L2224/16225 , H01L2224/16235 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01061 , H01L2924/01072 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12042 , H01L2924/3025 , Y10T29/4913 , Y10T29/49146 , Y10T29/49147 , Y10T29/49171 , Y10T29/49176 , Y10T29/49789 , H01L2224/81 , H01L2924/00
摘要： A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to a carrier comprising electrical connection surfaces, such that a front of the chip bearing component structures facing the carrier is arranged to clear it, covering a back of the chip with a film made of synthetic material, such that edges of the film overlap the chip; tightly bonding the film and carrier in an entire edge region around the chip; structuring the film such that the film is removed around the edge region in a continuous strip parallel to the edge region; and applying a hermetically sealing layer over the film, such that this layer hermetically terminates with the carrier in a contact region outside of the edge region.
摘要翻译： 提供了一种用于产生电子部件的密封封装的方法，其可以是光学和至少部分透光的部件或表面波部件，包括将基于芯片的部件附接并电接触到包括电连接 表面，使得面向载体的芯片轴承部件结构的前部布置成将其清除，用合成材料制成的膜覆盖芯片的后部，使得膜的边缘与芯片重叠; 在芯片周围的整个边缘区域紧密地结合薄膜和载体; 构造膜，使得膜在与边缘区域平行的连续条带中围绕边缘区域移除; 以及在所述膜上施加气密密封层，使得所述层在所述边缘区域外部的接触区域中与所述载体气密地终止。
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公开(公告)号：US20100127377A1
公开(公告)日：2010-05-27
申请号：US12627707
申请日：2009-11-30
申请人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
发明人： Christian Bauer , Gregor Feiertag , Hans Krueger , Alois Stelzl
IPC分类号： H01L23/485 , H01L21/98
CPC分类号： B81C1/00269 , B81B7/0058 , B81C2203/0136 , B81C2203/019 , H01L24/14 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/1461 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate.
摘要翻译： 载体基板具有安装位置，在顶侧具有多个电连接焊盘，并且在下侧上与其连接的外部触点。 金属框架包围安装位置的连接垫。 MEMS芯片在下侧具有电触点。 MEMS芯片以这样的方式被放置在载体基板的安装位置上，使得MEMS芯片在金属框架上的下侧的边缘区域被安置。 使用倒装芯片工艺，MEMS芯片的电触点通过凸块连接到载体衬底的连接焊盘，金属框架连接到MEMS芯片，使得在MEMS芯片和载体衬底之间形成闭合腔 。
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公开(公告)号：US07388281B2
公开(公告)日：2008-06-17
申请号：US10523875
申请日：2003-06-23
申请人： Hans Krueger , Jürgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
发明人： Hans Krueger , Jürgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
CPC分类号： H03H9/0557 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10157 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15313 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H03H9/059 , H03H9/1071 , H03H9/1078 , Y10T29/49146 , H01L2924/00 , H01L2924/00014
摘要： The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.
摘要翻译： 本发明涉及一种封装的部件，其包括载体基板和位于载体基板顶部上的至少一个芯片，并且通过导电连接与其电连接。 芯片的封装是用密封或介电层完成的。 由于密封或电介质层和导电连接的膨胀系数不同，在导电连接中会发生变化的温度应力，这可导致导电连接的裂纹，断裂甚至中断。 为了机械地减轻应力从变化的温度（特别是在极端热负荷下）的导电连接，提出载体基板设置有环绕芯片的支撑元件，其用于支撑密封或介电层，以及 /或相应地选择封装的材料和布置。
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公开(公告)号：US20060151203A1
公开(公告)日：2006-07-13
申请号：US10523875
申请日：2003-06-23
申请人： Hans Krueger , Jurgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
发明人： Hans Krueger , Jurgen Portmann , Karl Nicolaus , Gregor Feiertag , Alois Stelzl
CPC分类号： H03H9/0557 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10157 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15313 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H03H9/059 , H03H9/1071 , H03H9/1078 , Y10T29/49146 , H01L2924/00 , H01L2924/00014
摘要： The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.
摘要翻译： 本发明涉及一种封装的部件，其包括载体基板和位于载体基板顶部上的至少一个芯片，并且通过导电连接与其电连接。 芯片的封装是用密封或介电层完成的。 由于密封或电介质层和导电连接的膨胀系数不同，在导电连接中会发生变化的温度应力，这可导致导电连接的裂纹，断裂甚至中断。 为了机械地减轻应力从变化的温度（特别是在极端热负荷下）的导电连接，提出载体基板设置有环绕芯片的支撑元件，其用于支撑密封或介电层，以及 /或相应地选择封装的材料和布置。
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公开(公告)号：US08432007B2
公开(公告)日：2013-04-30
申请号：US13075936
申请日：2011-03-30
申请人： Anton Leidl , Hans Krueger , Alois Stelzl , Wolfgang Pahl , Stefan Seitz
发明人： Anton Leidl , Hans Krueger , Alois Stelzl , Wolfgang Pahl , Stefan Seitz
IPC分类号： H01L29/84
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/07811 , H01L2924/1461 , H01L2924/3025 , H04R1/04 , H04R19/005 , H01L2924/00014 , H01L2924/00
摘要： A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
摘要翻译： 本文描述了微机电系统（MEMS）封装。 封装包括具有顶侧的载体衬底，安装在载体衬底的顶侧上的MEMS芯片以及在载体衬底的顶侧上或上方嵌入载体衬底中的至少一个芯片组件。 封装还包括覆盖MEMS芯片和芯片部件的薄金属屏蔽层，并与载体基板的顶侧形成密封。
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