公开(公告)号：US20050205979A1

公开(公告)日：2005-09-22

申请号：US11129596

申请日：2005-05-13

申请人： Won Shin ,  Do Chun ,  Seon Lee ,  Il Shim ,  Vincent DiCaprio

发明人： Won Shin ,  Do Chun ,  Seon Lee ,  Il Shim ,  Vincent DiCaprio

IPC分类号： H01L23/12 ,  H01L23/02 ,  H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/18

CPC分类号： H01L24/97 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor package and method for fabricating the same is disclosed. In one embodiment, the semiconductor package includes a circuit board, at least two semiconductor chips, electric connection means, an encapsulant, and a plurality of conductive balls. The circuit board has a resin layer and a circuit pattern. The resin layer is provided with an opening at its center portion. The circuit pattern is formed on at least one of upper and lower surfaces of the resin layer and includes one or more bond fingers and ball lands exposed to the outside. The semiconductor chips have a plurality of input/output pads on an active surface thereof. The semiconductor chips are stacked at a position of the opening of the circuit board, with at least one of the chips being within the opening. Alternatively, both chips are in the opening. The electric connection means connects the input/output pads of the semiconductor chips to the bond fingers of the circuit board. The encapsulant surrounds the semiconductor chips so as to protect the chips from the external environment. The conductive balls are fusion-bonded on the ball lands of the circuit board.

摘要翻译： 公开了半导体封装及其制造方法。 在一个实施例中，半导体封装包括电路板，至少两个半导体芯片，电连接装置，密封剂和多个导电球。 电路板具有树脂层和电路图案。 树脂层在其中心部分设置有开口。 电路图案形成在树脂层的上表面和下表面中的至少一个上，并且包括暴露于外部的一个或多个粘合指状物和球状区域。 半导体芯片在其有效表面上具有多个输入/输出焊盘。 半导体芯片堆叠在电路板的开口的位置，其中至少一个芯片在开口内。 或者，两个芯片都在开口中。 电连接装置将半导体芯片的输入/输出焊盘连接到电路板的键合指状物。 密封剂围绕半导体芯片，以保护芯片免受外部环境的影响。 导电球熔接在电路板的球面上。