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20 条记录 (耗时 0.024 秒)

    Submount for light emitting device
    2.
    发明申请
    Submount for light emitting device 失效
    发光装置底座

    公开(公告)号：US20060249744A1

    公开(公告)日：2006-11-09

    申请号：US11372204

    申请日：2006-03-10

    申请人： Hyung-kun Kim ,  Su-hee Chae ,  Tae-hoon Jang

    发明人： Hyung-kun Kim ,  Su-hee Chae ,  Tae-hoon Jang

    IPC分类号： H01L33/00

    CPC分类号： H01L23/15 ,  H01L23/49811 ,  H01L23/49838 ,  H01L33/62 ,  H01L2224/10175

    摘要： A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the first bonding layer and on the second bonding layer, respectively; a first solder and a second solder which are formed on the first barrier layer and on the second barrier layer, respectively; and a first blocking layer and a second blocking layer which are formed around the first barrier layer and the second barrier layer, blocking the melted first solder and the melted second solder from overflowing during a flip chip process.

    摘要翻译： 提供了一种用于发光器件封装的基座。 基座包括基板; 分别形成在所述基板上的第一接合层和第二接合层; 分别形成在第一接合层和第二接合层上的第一阻挡层和第二阻挡层; 分别形成在第一阻挡层和第二阻挡层上的第一焊料和第二焊料; 以及形成在第一阻挡层和第二阻挡层周围的第一阻挡层和第二阻挡层，在倒装芯片工艺期间阻挡熔化的第一焊料和熔化的第二焊料溢出。

    Submount for light emitting device
    3.
    发明授权
    Submount for light emitting device 失效
    发光装置底座

    公开(公告)号：US07276740B2

    公开(公告)日：2007-10-02

    申请号：US11372204

    申请日：2006-03-10

    申请人： Hyung-kun Kim ,  Su-hee Chae ,  Tae-hoon Jang

    发明人： Hyung-kun Kim ,  Su-hee Chae ,  Tae-hoon Jang

    IPC分类号： H01L33/00

    CPC分类号： H01L23/15 ,  H01L23/49811 ,  H01L23/49838 ,  H01L33/62 ,  H01L2224/10175

    摘要： A submount for a light emitting device package is provided. The submount includes a substrate; a first bonding layer and a second bonding layer which are separately formed on the substrate; a first barrier layer and a second barrier layer which are formed on the first bonding layer and on the second bonding layer, respectively; a first solder and a second solder which are formed on the first barrier layer and on the second barrier layer, respectively; and a first blocking layer and a second blocking layer which are formed around the first barrier layer and the second barrier layer, blocking the melted first solder and the melted second solder from overflowing during a flip chip process.

    摘要翻译： 提供了一种用于发光器件封装的基座。 基座包括基板; 分别形成在所述基板上的第一接合层和第二接合层; 分别形成在第一接合层和第二接合层上的第一阻挡层和第二阻挡层; 分别形成在第一阻挡层和第二阻挡层上的第一焊料和第二焊料; 以及形成在第一阻挡层和第二阻挡层周围的第一阻挡层和第二阻挡层，在倒装芯片工艺期间阻挡熔化的第一焊料和熔化的第二焊料溢出。

    Heat dissipating structure and light emitting device having the same
    4.
    发明申请
    Heat dissipating structure and light emitting device having the same 审中-公开
    散热结构和具有该散热结构的发光器件

    公开(公告)号：US20060249745A1

    公开(公告)日：2006-11-09

    申请号：US11387864

    申请日：2006-03-24

    申请人： Su-hee Chae ,  Tae-hoon Jang ,  Hyung-kun Kim ,  Youn-joon Sung

    发明人： Su-hee Chae ,  Tae-hoon Jang ,  Hyung-kun Kim ,  Youn-joon Sung

    IPC分类号： H01L33/00

    CPC分类号： H01L33/647 ,  B82Y20/00 ,  H01L33/642 ,  H01S5/02236 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02492 ,  H01S5/22 ,  H01S5/34333

    摘要： A heat dissipating structure is flip-chip bonded to a light-emitting element and facilitates heat dissipation. The heat dissipating structure includes: a submount facing the light-emitting element and having at least one groove; a conductive material layer filled into at least a portion of the at least one groove; and a solder layer interposed between the light-emitting element and the submount for bonding. The heat dissipating structure and the light-emitting device having the same allow efficient dissipation of heat generated in the light-emitting element during operation.

    摘要翻译： 散热结构被倒装贴合到发光元件上并且有利于散热。 散热结构包括：面向发光元件并具有至少一个凹槽的基座; 填充到所述至少一个凹槽的至少一部分中的导电材料层; 以及插入在发光元件和用于接合的基座之间的焊料层。 散热结构和具有该散热结构的发光装置允许在操作期间有效地散发在发光元件中产生的热量。

    Submount of a multi-beam laser diode module
    9.
    发明授权
    Submount of a multi-beam laser diode module 有权
    多光束激光二极管模块的底座

    公开(公告)号：US07522649B2

    公开(公告)日：2009-04-21

    申请号：US11808174

    申请日：2007-06-07

    申请人： Kyoung-ho Ha ,  Tae-hoon Jang ,  Hyung-kun Kim

    发明人： Kyoung-ho Ha ,  Tae-hoon Jang ,  Hyung-kun Kim

    IPC分类号： H01S5/00

    CPC分类号： H01S5/4031 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/22

    摘要： Example embodiments may provide a submount in to which a multi-beam laser diode may be flip-chip bonded and a multi-beam laser diode module including the submount. The submount may include a first submount and a second submount. The first submount may include a first substrate, a plurality of first solder layers formed on the first substrate corresponding to electrodes of the multi-beam laser diode, and a plurality of via holes that may penetrate the first substrate and may be filled with conductive materials to electrically connect to the first solder layers. The electrodes may be bonded to the first solder layers. The second submount may include a second substrate under the first substrate and a plurality of bonding pads corresponding to the number of electrodes formed on the second substrate to electrically connect to the conductive materials filled in the via holes.

    摘要翻译： 示例性实施例可以提供一个子基座，多子束激光二极管可以被倒装接合到其上，并且包括该子基座的多光束激光二极管模块。 子安装板可以包括第一子安装座和第二子安装座。 第一基座可以包括第一基板，形成在对应于多光束激光二极管的电极的第一基板上的多个第一焊料层和可以穿透第一基板的多个通孔，并且可以填充导电材料 以电连接到第一焊料层。 电极可以结合到第一焊料层。 第二基座可以包括在第一基板下面的第二基板和对应于形成在第二基板上的电极的数量的多个接合焊盘，以电连接到填充在通孔中的导电材料。

    Submount of a multi-beam laser diode module
    10.
    发明申请
    Submount of a multi-beam laser diode module 有权
    多光束激光二极管模块的底座

    公开(公告)号：US20070286252A1

    公开(公告)日：2007-12-13

    申请号：US11808174

    申请日：2007-06-07

    申请人： Kyoung-ho Ha ,  Tae-hoon Jang ,  Hyung-kun Kim

    发明人： Kyoung-ho Ha ,  Tae-hoon Jang ,  Hyung-kun Kim

    IPC分类号： H01S5/00

    CPC分类号： H01S5/4031 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/22

    摘要： Example embodiments may provide a submount in to which a multi-beam laser diode may be flip-chip bonded and a multi-beam laser diode module including the submount. The submount may include a first submount and a second submount. The first submount may include a first substrate, a plurality of first solder layers formed on the first substrate corresponding to electrodes of the multi-beam laser diode, and a plurality of via holes that may penetrate the first substrate and may be filled with conductive materials to electrically connect to the first solder layers. The electrodes may be bonded to the first solder layers. The second submount may include a second substrate under the first substrate and a plurality of bonding pads corresponding to the number of electrodes formed on the second substrate to electrically connect to the conductive materials filled in the via holes.

    摘要翻译： 示例性实施例可以提供一个子基座，多子束激光二极管可以被倒装接合到其上，并且包括该子基座的多光束激光二极管模块。 子安装板可以包括第一子安装座和第二子安装座。 第一基座可以包括第一基板，形成在对应于多光束激光二极管的电极的第一基板上的多个第一焊料层和可以穿透第一基板的多个通孔，并且可以填充导电材料 以电连接到第一焊料层。 电极可以结合到第一焊料层。 第二基座可以包括在第一基板下面的第二基板和对应于形成在第二基板上的电极的数量的多个接合焊盘，以电连接到填充在通孔中的导电材料。