摘要:
Embodiments of the invention provide a semiconductor device and a related method of fabricating a semiconductor device. In one embodiment, the invention provides a semiconductor device comprising a first gate electrode comprising a lower silicon pattern and an upper silicon pattern and disposed on an active region of a semiconductor substrate, wherein the upper silicon pattern has the same crystal structure as the lower silicon pattern and the active region is defined by a device isolation layer. The semiconductor device further comprises a gate insulating layer disposed between the active region and the first gate electrode.
摘要:
A semiconductor memory device can include select transistors and cell transistors on a semiconductor substrate. An insulation layer covers the select transistors and the cell transistors. The bit lines are in the insulation layer and are electrically connected to respective ones of the select transistors. The bit lines are arranged along at least two different parallel planes having different heights relative to the semiconductor substrate.
摘要:
A nonvolatile memory device includes a device isolating layer disposed at a substrate to define an active region and a floating gate disposed on the active region. The floating gate includes a flat portion and a pair of wall portions. The pair of wall portions extend upward from both edges of the flat portion adjacent to the device isolating layer and face each other. The nonvolatile memory device further includes a tunnel insulating layer interposed between the floating gate and the active region. Moreover, the wall portions and the flat portion are formed of a single layer, and the thickness of the flat portion is larger than a width of the wall portions.
摘要:
There are provided a memory transistor having a select transistor with asymmetric gate electrode structure and an inverted T-shaped floating gates and a method for forming the same. A gate electrode of the select transistor adjacent to a memory transistor has substantially an inverted T-shaped figure, whereas the gate electrode of the select transistor opposite to the memory transistor has nearly a box-shaped figure. In order to form the floating gate of the memory transistor in shape of the inverted T, a region for the select transistor is closed when opening a region for the memory transistor.
摘要:
Non-volatile memory devices include memory cells therein with reduced cell-to-cell coupling capacitance. These memory cells include floating gate electrodes with open-ended wraparound shapes that operate to reduce the cell-to-cell coupling capacitance in a bit line direction, while still maintaining a high coupling ratio between control and floating gate electrodes within each memory cell.
摘要:
A semiconductor memory device can include select transistors and cell transistors on a semiconductor substrate. An insulation layer covers the select transistors and the cell transistors. The bit lines are in the insulation layer and are electrically connected to respective ones of the select transistors. The bit lines are arranged along at least two different parallel planes having different heights relative to the semiconductor substrate.
摘要:
Embodiments of the invention provide a semiconductor device and a related method of fabricating a semiconductor device. In one embodiment, the invention provides a semiconductor device comprising a first gate electrode comprising a lower silicon pattern and an upper silicon pattern and disposed on an active region of a semiconductor substrate, wherein the upper silicon pattern has the same crystal structure as the lower silicon pattern and the active region is defined by a device isolation layer. The semiconductor device further comprises a gate insulating layer disposed between the active region and the first gate electrode.
摘要:
An flash memory device includes a block of NAND cell units, each NAND cell unit in the block includes n memory cell transistors MC controlled by a plurality of n wordlines, and is connected in series between a string selection transistor SST connected to a bitline and a ground selection transistor GST. While a programming voltage Vpgm is applied to a selected wordline WL , a cutoff voltage Vss is applied to a nearby unselected wordline closer to the ground selection transistor GST to isolate a first local channel Ch1 from a second local channel Ch2. As the location i of the selected wordline WL increases close to the SST, the second channel potential Vch2 tends to increase excessively, causing errors. The excessive increase of Vch2 is prevented by modifying the voltages applied to string select lines (SSL) and/or to the bit lines (BL), or the pass voltages Vpass applied to the unselected wordlines (WL location i is equal or greater than a predetermined (stored) location number x. If incremental step pulse programming (ISPP) is implemented, the applied voltages are modified only if the ISPP loop count j is equal or greater than a predetermined (stored) critical loop number y.
摘要:
Provided is a nonvolatile memory device and a fabrication method. The nonvolatile memory device includes an active region defined in a semiconductor substrate, a gate insulating layer formed on the active region and a plurality of gate patterns formed on the gate insulating layer, and crossing over the active region. The gate insulating layer includes a discharge region in a predetermined portion between the gate patterns, the discharge region having a lesser thickness than that of the gate insulating layer under the gate pattern, because a thickness portion of the gate insulating layer is removed to form the discharge region.
摘要:
Provided is a nonvolatile memory device and a fabrication method. The nonvolatile memory device includes an active region defined in a semiconductor substrate, a gate insulating layer formed on the active region and a plurality of gate patterns formed on the gate insulating layer, and crossing over the active region. The gate insulating layer includes a discharge region in a predetermined portion between the gate patterns, the discharge region having a lesser thickness than that of the gate insulating layer under the gate pattern, because a thickness portion of the gate insulating layer is removed to form the discharge region.