Gate controlled floating well vertical MOSFET
    2.
    发明授权
    Gate controlled floating well vertical MOSFET 失效
    门控浮动阱垂直MOSFET

    公开(公告)号:US07102914B2

    公开(公告)日:2006-09-05

    申请号:US10708381

    申请日:2004-02-27

    IPC分类号: G11C11/24 G11C11/34

    摘要: A novel transistor structure for a DRAM cell includes two deep trenches, one trench including a vertical storage cell for storing the data and the second trench including a vertical control cell for controlling the p-well voltage, which, in effect, places part of the p-well in a floating condition thus decreasing the threshold voltage as compared to when the vertical pass transistor is in an off-state. This enables the transistor to exhibit increased gate overdrive and drive current during an active wordline voltage commonly applied to both gates of the storage and control cells.

    摘要翻译: 用于DRAM单元的新型晶体管结构包括两个深沟槽,一个沟槽包括用于存储数据的垂直存储单元,第二沟槽包括用于控制p阱电压的垂直控制单元,其实际上将部分 p阱处于浮置状态,从而与垂直传输晶体管处于截止状态时相比降低阈值电压。 这使得晶体管能够在通常施加到存储和控制单元的两个栅极的有效字线电压期间表现出增加的栅极过驱动和驱动电流。

    Dynamic threshold voltage MOSFET on SOI
    3.
    发明授权
    Dynamic threshold voltage MOSFET on SOI 有权
    SOI上的动态阈值电压MOSFET

    公开(公告)号:US07045873B2

    公开(公告)日:2006-05-16

    申请号:US10728750

    申请日:2003-12-08

    IPC分类号: H01L29/00

    CPC分类号: H01L29/783

    摘要: Provision of a body control contact adjacent a transistor and between the transistor and a contact to the substrate or well in which the transistor is formed allows connection and disconnection of the substrate of the transistor to and from a zero (ground) or substantially arbitrary low voltage in accordance with control signals applied to the gate of the transistor to cause the transistor to exhibit a variable threshold which maintains good performance at low supply voltages and reduces power consumption/dissipation which is particularly advantageous in portable electronic devices. Floating body effects (when the transistor substrate in disconnected from a voltage source in the “on” state) are avoided since the substrate is discharged when the transistor is switched to the “off” state. The transistor configuration can be employed with both n-type and p-type transistors which may be in complementary pairs.

    摘要翻译: 提供与晶体管相邻并且晶体管与形成晶体管的衬底或阱的接触之间的身体控制接触允许晶体管的衬底与零(接地)或基本上任意的低电压的连接和断开 根据施加到晶体管的栅极的控制信号,使晶体管呈现可变阈值,其在低电源电压下保持良好的性能,并降低了在便携式电子设备中特别有利的功耗/耗散。 避免浮体效应(当晶体管基板与电压源处于“导通”状态断开时),因为当晶体管切换到“关闭”状态时,衬底被放电。 晶体管配置可以与可以互补对的n型和p型晶体管一起使用。

    Gate controlled floating well vertical MOSFET
    4.
    发明申请
    Gate controlled floating well vertical MOSFET 审中-公开
    门控浮动阱垂直MOSFET

    公开(公告)号:US20060258060A1

    公开(公告)日:2006-11-16

    申请号:US11487809

    申请日:2006-07-17

    IPC分类号: H01L21/339

    摘要: A novel transistor structure for a DRAM cell includes two deep trenches, one trench including a vertical storage cell for storing the data and the second trench including a vertical control cell for controlling the p-well voltage, which, in effect, places part of the p-well in a floating condition thus decreasing the threshold voltage as compared to when the vertical pass transistor is in an off-state. This enables the transistor to exhibit increased gate over-drive and drive current during an active wordline voltage commonly applied to both gates of the storage and control cells.

    摘要翻译: 用于DRAM单元的新型晶体管结构包括两个深沟槽,一个沟槽包括用于存储数据的垂直存储单元,第二沟槽包括用于控制p阱电压的垂直控制单元,其实际上将部分 p阱处于浮置状态,从而与垂直传输晶体管处于截止状态时相比降低阈值电压。 这使得晶体管在通常施加到存储和控制单元的两个门的有效字线电压期间表现出增加的栅极过驱动和驱动电流。

    GATE CONTROLLED FLOATING WELL VERTICAL MOSFET
    5.
    发明申请
    GATE CONTROLLED FLOATING WELL VERTICAL MOSFET 失效
    门控浮动井垂直MOSFET

    公开(公告)号:US20050190590A1

    公开(公告)日:2005-09-01

    申请号:US10708381

    申请日:2004-02-27

    摘要: A novel transistor structure for a DRAM cell includes two deep trenches, one trench including a vertical storage cell for storing the data and the second trench including a vertical control cell for controlling the p-well voltage, which, in effect, places part of the p-well in a floating condition thus decreasing the threshold voltage as compared to when the vertical pass transistor is in an off-state. This enables the transistor to exhibit increased gate overdrive and drive current during an active wordline voltage commonly applied to both gates of the storage and control cells.

    摘要翻译: 用于DRAM单元的新型晶体管结构包括两个深沟槽,一个沟槽包括用于存储数据的垂直存储单元,第二沟槽包括用于控制p阱电压的垂直控制单元,其实际上将部分 p阱处于浮置状态,从而与垂直传输晶体管处于截止状态时相比降低阈值电压。 这使得晶体管能够在通常施加到存储和控制单元的两个栅极的有效字线电压期间表现出增加的栅极过驱动和驱动电流。

    Dynamic threshold voltage MOSFET on SOI
    6.
    发明申请
    Dynamic threshold voltage MOSFET on SOI 有权
    SOI上的动态阈值电压MOSFET

    公开(公告)号:US20050121699A1

    公开(公告)日:2005-06-09

    申请号:US10728750

    申请日:2003-12-08

    CPC分类号: H01L29/783

    摘要: Provision of a body control contact adjacent a transistor and between the transistor and a contact to the substrate or well in which the transistor is formed allows connection and disconnection of the substrate of the transistor to and from a zero (ground) or substantially arbitrary low voltage in accordance with control signals applied to the gate of the transistor to cause the transistor to exhibit a variable threshold which maintains good performance at low supply voltages and reduces power consumption/dissipation which is particularly advantageous in portable electronic devices. Floating body effects (when the transistor substrate in disconnected from a voltage source in the “on” state) are avoided since the substrate is discharged when the transistor is switched to the “off” state. The transistor configuration can be employed with both n-type and p-type transistors which may be in complementary pairs.

    摘要翻译: 提供与晶体管相邻并且晶体管与形成晶体管的衬底或阱的接触之间的身体控制接触允许晶体管的衬底与零(接地)或基本上任意的低电压的连接和断开 根据施加到晶体管的栅极的控制信号,使晶体管呈现可变阈值,其在低电源电压下保持良好的性能,并降低了在便携式电子设备中特别有利的功耗/耗散。 避免浮体效应(当晶体管基板与电压源处于“导通”状态断开时),因为当晶体管切换到“关闭”状态时,衬底被放电。 晶体管配置可以与可以互补对的n型和p型晶体管一起使用。

    Self-aligned drain/channel junction in vertical pass transistor DRAM cell design for device scaling
    7.
    发明授权
    Self-aligned drain/channel junction in vertical pass transistor DRAM cell design for device scaling 有权
    垂直传输晶体管中的自对准漏极/沟道结DRAM器件设计用于器件缩放

    公开(公告)号:US06930004B2

    公开(公告)日:2005-08-16

    申请号:US10604731

    申请日:2003-08-13

    摘要: A method of formation of a deep trench vertical transistor is provided. A deep trench with a sidewall in a doped semiconductor substrate is formed. The semiconductor substrate includes a counterdoped drain region in the surface thereof and a channel alongside the sidewall. The drain region has a top level and a bottom level. A counterdoped source region is formed in the substrate juxtaposed with the sidewall below the channel. A gate oxide layer is formed on the sidewalls of the trench juxtaposed with a gate conductor. Perform the step of recessing the gate conductor below the bottom level of the drain region followed by performing angled ion implantation at an angle θ+δ with respect to vertical of a counterdopant into the channel below the source region and performing angled ion implantation at an angle θ with respect to vertical of a dopant into the channel below the source.

    摘要翻译: 提供了形成深沟槽垂直晶体管的方法。 在掺杂半导体衬底中形成具有侧壁的深沟槽。 半导体衬底在其表面中包括反向漏极区域和沿着侧壁的通道。 漏极区域具有顶层和底层。 反向掺杂的源极区域形成在与通道下方的侧壁并置的衬底中。 栅极氧化层形成在与栅极导体并置的沟槽的侧壁上。 执行将栅极导体凹入低于漏极区域的底部电平的步骤,然后相对于反向掺杂物的垂直角进行成角度的离子注入进入源极区域下方的沟道,并以一定角度进行成角度的离子注入 θ相对于掺杂剂的垂直方向到源下方的通道。

    SELF-ALIGNED DRAIN/CHANNEL JUNCTION IN VERTICAL PASS TRANSISTOR DRAM CELL DESIGN FOR DEVICE SCALING
    8.
    发明申请
    SELF-ALIGNED DRAIN/CHANNEL JUNCTION IN VERTICAL PASS TRANSISTOR DRAM CELL DESIGN FOR DEVICE SCALING 有权
    用于设备放大的垂直通用晶体管DRAM单元设计中的自对准漏极/通道结

    公开(公告)号:US20050037561A1

    公开(公告)日:2005-02-17

    申请号:US10604731

    申请日:2003-08-13

    摘要: A method of formation of a deep trench vertical transistor is provided. A deep trench with a sidewall in a doped semiconductor substrate is formed. The semiconductor substrate includes a counterdoped drain region in the surface thereof and a channel alongside the sidewall. The drain region has a top level and a bottom level. A counterdoped source region is formed in the substrate juxtaposed with the sidewall below the channel. A gate oxide layer is formed on the sidewalls of the trench juxtaposed with a gate conductor. Perform the step of recessing the gate conductor below the bottom level of the drain region followed by performing angled ion implantation at an angle θ+δ with respect to vertical of a counterdopant into the channel below the source region and performing angled ion implantation at an angle θ with respect to vertical of a dopant into the channel below the source region

    摘要翻译: 提供了形成深沟槽垂直晶体管的方法。 在掺杂半导体衬底中形成具有侧壁的深沟槽。 半导体衬底在其表面中包括反向漏极区域和沿着侧壁的通道。 漏极区域具有顶层和底层。 反向掺杂的源极区域形成在与通道下方的侧壁并置的衬底中。 栅极氧化层形成在与栅极导体并置的沟槽的侧壁上。 执行将栅极导体凹入低于漏极区域的底部电平的步骤,然后相对于反向掺杂物的垂直角进行成角度的离子注入进入源极区域下方的沟道,并以一定角度进行成角度的离子注入 相对于掺杂剂的垂直方向在源极区域下方的沟道中

    Structure and Method to Form EDRAM on SOI Substrate
    9.
    发明申请
    Structure and Method to Form EDRAM on SOI Substrate 有权
    在SOI衬底上形成EDRAM的结构和方法

    公开(公告)号:US20100283093A1

    公开(公告)日:2010-11-11

    申请号:US12437242

    申请日:2009-05-07

    IPC分类号: H01L27/10 H01L21/02

    摘要: A memory device is provided that in one embodiment includes a trench capacitor located in a semiconductor substrate including an outer electrode provided by the semiconductor substrate, an inner electrode provided by a conductive fill material, and a node dielectric layer located between the outer electrode and the inner electrode; and a semiconductor device positioned centrally over the trench capacitor. The semiconductor device includes a source region, a drain region, and a gate structure, in which the semiconductor device is formed on a semiconductor layer that is separated from the semiconductor substrate by a dielectric layer. A first contact is present extending from an upper surface of the semiconductor layer into electrical contact with the semiconductor substrate, and a second contact from the drain region of the semiconductor device in electrical contact to the conductive material within the at least one trench.

    摘要翻译: 提供了一种存储器件,其在一个实施例中包括位于半导体衬底中的沟槽电容器,该半导体衬底包括由半导体衬底提供的外部电极,由导电填充材料提供的内部电极,以及位于外部电极和 内电极 以及位于沟槽电容器上方的半导体器件。 半导体器件包括源极区,漏极区和栅极结构,其中半导体器件形成在通过介电层与半导体衬底分离的半导体层上。 存在从半导体层的上表面延伸到与半导体衬底电接触的第一接触,以及从半导体器件的漏极区域与至少一个沟槽内的导电材料电接触的第二接触。

    STRUCTURE AND METHOD TO FORM EDRAM ON SOI SUBSTRATE
    10.
    发明申请
    STRUCTURE AND METHOD TO FORM EDRAM ON SOI SUBSTRATE 有权
    在SOI衬底上形成EDRAM的结构和方法

    公开(公告)号:US20120171827A1

    公开(公告)日:2012-07-05

    申请号:US13417900

    申请日:2012-03-12

    IPC分类号: H01L21/8242

    摘要: A memory device is provided that in one embodiment includes a trench capacitor located in a semiconductor substrate including an outer electrode provided by the semiconductor substrate, an inner electrode provided by a conductive fill material, and a node dielectric layer located between the outer electrode and the inner electrode; and a semiconductor device positioned centrally over the trench capacitor. The semiconductor device includes a source region, a drain region, and a gate structure, in which the semiconductor device is formed on a semiconductor layer that is separated from the semiconductor substrate by a dielectric layer. A first contact is present extending from an upper surface of the semiconductor layer into electrical contact with the semiconductor substrate, and a second contact from the drain region of the semiconductor device in electrical contact to the conductive material within the at least one trench.

    摘要翻译: 提供了一种存储器件,其在一个实施例中包括位于半导体衬底中的沟槽电容器,该半导体衬底包括由半导体衬底提供的外部电极,由导电填充材料提供的内部电极,以及位于外部电极和 内电极 以及位于沟槽电容器上方的半导体器件。 半导体器件包括源极区,漏极区和栅极结构,其中半导体器件形成在通过介电层与半导体衬底分离的半导体层上。 存在从半导体层的上表面延伸到与半导体衬底电接触的第一接触,以及从半导体器件的漏极区域与至少一个沟槽内的导电材料电接触的第二接触。