Abstract:
A molding method of blow-molding a hollow tank body with a built-in component is provided. The method molds the hollow tank body by molding the sheet parisons in the half molds. After the moving cooperation of the half molds, an expanding mechanism of a pre-molding template device, the template half plates and the bases, the half molds are respectively leaned against the closed template half plates, and the sheet parisons are leaned against the half molds by blowing and/or sucking so as to be pre-molded. The tank body is molded after placing the component into it. A pre-molding template device is also provided. An expanding mechanism and the template half plates are mounted on the bases, and the bases are mounted on a rail bracket, the bases are driven by a power device to move on the rail bracket.
Abstract:
A method for molding a two-piece blow molded hollow tank by using auxiliary male molds includes the following steps: 1) blanking two parisons; 2) closing mold halves of a mold and a pre-molding template; 3) pre-stretching the molten parisons by using auxiliary male molds in the pre-molding template; 4) performing internal high-pressure blow molding, and pre-molding two housing portions; 5) opening the mold, and withdrawing the pre-molding template; 6) moving in a component built-in mechanism to perform built-in component connection; 7) moving out the component built-in mechanism; 8) closing the mold for the second time and finally blow molding a hollow tank; and 9) opening the mold and taking out the product.
Abstract:
A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.
Abstract:
A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.
Abstract:
A MEMS mirror for a laser printing application includes providing a CMOS substrate including a pair of electrodes, and providing a reflecting mirror moveable over the substrate and the electrodes. Voltages applied to the electrodes create an electrostatic force causing an end of the mirror to be attracted to the substrate. A precise position of the mirror can be detected and controlled by sensing a change in capacitance between the mirror ends and the underlying electrodes.
Abstract:
Micro-electromechanical devices include a temperature-compensation capacitor and a thin-film bulk acoustic resonator having a first terminal electrically coupled to an electrode of the temperature-compensation capacitor. The temperature-compensation capacitor includes a bimorph beam having a first electrode thereon and a second electrode extending opposite the first electrode. This bimorph beam is configured to yield an increase in spacing between the first and second electrodes in response to an increase in temperature of the micro-electromechanical device. This increase in spacing between the first and second electrodes leads to a decrease in capacitance of the temperature-compensation capacitor. Advantageously, this decrease in capacitance can be used to counteract a negative temperature coefficient of frequency associated with the thin-film bulk acoustic resonator, and thereby render the resonant frequency of the micro-electromechanical device more stable in response to temperature fluctuations.
Abstract:
A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.
Abstract:
A method of decoding audio data representing an audio clip, said method comprising the steps of selecting one of a predetermined number of frequency bands; decoding a portion of the audio data representing said audio clip according to the selected frequency band, wherein a remaining portion of the audio data representing said audio clip is discarded; and converting the decoded portion of audio data into sample data representing the decoded audio data.
Abstract:
An optical deflection device for a display application. The optical deflection device includes a semiconductor substrate including an upper surface region and one or more electrode devices provided overlying the upper surface region. The optical deflection device also includes a hinge device including a silicon material and coupled to the upper surface region. The optical deflection device further includes a spacing defined between the upper surface region and the hinge device and a mirror structure including a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion and overlying the hinge device.