公开(公告)号：US08350264B2

公开(公告)日：2013-01-08

申请号：US12835764

申请日：2010-07-14

申请人： Yan Zun Li ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

发明人： Yan Zun Li ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

IPC分类号： H01L29/04

CPC分类号： H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

摘要： An antifuse is provided having a unitary monocrystalline semiconductor body including first and second semiconductor regions each having the same first conductivity type, and a third semiconductor region between the first and second semiconductor regions which has a second conductivity type opposite from the first conductivity type. An anode and a cathode can be electrically connected with the first semiconductor region. A conductive region including a metal, a conductive compound of a metal or an alloy of a metal can contact the first semiconductor region and extend between the cathode and the anode. The antifuse can further include a contact electrically connected with the second semiconductor region. In this way, the antifuse can be configured such that the application of a programming voltage between the anode and the cathode heats the first semiconductor region sufficiently to reach a temperature which drives a dopant outwardly therefrom, causing an edge of the first semiconductor region to move closer to an adjacent edge of the second semiconductor region, thus permanently reducing electrical resistance between the first and second semiconductor regions by one or more orders of magnitude.

摘要翻译： 提供一种具有单一单晶半导体本体的反熔丝，该单体半导体本体包括具有相同的第一导电类型的第一和第二半导体区域以及具有与第一导电类型相反的第二导电类型的第一和第二半导体区域之间的第三半导体区域。 阳极和阴极可以与第一半导体区域电连接。 包括金属，金属的导电化合物或金属的合金的导电区域可以接触第一半导体区域并在阴极和阳极之间延伸。 反熔丝还可以包括与第二半导体区域电连接的触点。 以这种方式，反熔丝可被配置为使得在阳极和阴极之间施加编程电压将第一半导体区域充分加热以达到从其向外驱动掺杂剂的温度，从而使第一半导体区域的边缘移动 更靠近第二半导体区域的相邻边缘，从而将第一和第二半导体区域之间的电阻永久地减小一个或多个数量级。

公开(公告)号：US20130063202A1

公开(公告)日：2013-03-14

申请号：US13612938

申请日：2012-09-13

申请人： Yan Zun Li ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

发明人： Yan Zun Li ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

IPC分类号： H01L23/544 ,  H01H37/76

CPC分类号： H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

摘要： An antifuse has first and second semiconductor regions having one conductivity type and a third semiconductor region therebetween having an opposite conductivity type. A conductive region contacting the first region has a long dimension in a second direction transverse to the direction of a long dimension of a gate. An antifuse anode is spaced apart from the first region in the second direction and a contact is connected with the second region. Applying a programming voltage between the anode and the contact with gate bias sufficient to fully turn on field effect transistor operation of the antifuse heats the first region to drive a dopant outwardly, causing an edge of the first region to move closer to an edge of the second region and reduce electrical resistance between the first and second regions by an one or more orders of magnitude.

摘要翻译： 反熔丝具有一个导电类型的第一和第二半导体区域和它们之间具有相反导电类型的第三半导体区域。 接触第一区域的导电区域在横向于栅极的长尺寸方向的第二方向上具有长尺寸。 反熔丝阳极在第二方向上与第一区域间隔开，并且触点与第二区域连接。 在阳极和接触之间施加编程电压，栅极偏压足以完全导通反熔丝的场效应晶体管操作加热第一区域以向外驱动掺杂剂，导致第一区域的边缘更接近于 并且将第一和第二区域之间的电阻降低一个或多个数量级。

公开(公告)号：US08569755B2

公开(公告)日：2013-10-29

申请号：US13612938

申请日：2012-09-13

申请人： Yan Zun Li ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

发明人： Yan Zun Li ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

IPC分类号： H01L29/04

CPC分类号： H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

摘要： An antifuse has first and second semiconductor regions having one conductivity type and a third semiconductor region therebetween having an opposite conductivity type. A conductive region contacting the first region has a long dimension in a second direction transverse to the direction of a long dimension of a gate. An antifuse anode is spaced apart from the first region in the second direction and a contact is connected with the second region. Applying a programming voltage between the anode and the contact with gate bias sufficient to fully turn on field effect transistor operation of the antifuse heats the first region to drive a dopant outwardly, causing an edge of the first region to move closer to an edge of the second region and reduce electrical resistance between the first and second regions by an one or more orders of magnitude.

摘要翻译： 反熔丝具有一个导电类型的第一和第二半导体区域和它们之间具有相反导电类型的第三半导体区域。 接触第一区域的导电区域在横向于栅极的长尺寸方向的第二方向上具有长尺寸。 反熔丝阳极在第二方向上与第一区域间隔开，并且触点与第二区域连接。 在阳极和接触之间施加编程电压，栅极偏压足以完全导通反熔丝的场效应晶体管操作加热第一区域以向外驱动掺杂剂，导致第一区域的边缘更接近于 并且将第一和第二区域之间的电阻降低一个或多个数量级。

公开(公告)号：US20120012977A1

公开(公告)日：2012-01-19

申请号：US12835764

申请日：2010-07-14

申请人： Yan Zun Li ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

发明人： Yan Zun Li ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

IPC分类号： H01L23/525 ,  H01L21/768

CPC分类号： H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

摘要： An antifuse is provided having a unitary monocrystalline semiconductor body including first and second semiconductor regions each having the same first conductivity type, and a third semiconductor region between the first and second semiconductor regions which has a second conductivity type opposite from the first conductivity type. An anode and a cathode can be electrically connected with the first semiconductor region. A conductive region including a metal, a conductive compound of a metal or an alloy of a metal can contact the first semiconductor region and extend between the cathode and the anode. The antifuse can further include a contact electrically connected with the second semiconductor region. In this way, the antifuse can be configured such that the application of a programming voltage between the anode and the cathode heats the first semiconductor region sufficiently to reach a temperature which drives a dopant outwardly therefrom, causing an edge of the first semiconductor region to move closer to an adjacent edge of the second semiconductor region, thus permanently reducing electrical resistance between the first and second semiconductor regions by one or more orders of magnitude.

摘要翻译： 提供一种具有单一单晶半导体本体的反熔丝，该单体半导体本体包括具有相同的第一导电类型的第一和第二半导体区域以及具有与第一导电类型相反的第二导电类型的第一和第二半导体区域之间的第三半导体区域。 阳极和阴极可以与第一半导体区域电连接。 包括金属，金属的导电化合物或金属的合金的导电区域可以接触第一半导体区域并在阴极和阳极之间延伸。 反熔丝还可以包括与第二半导体区域电连接的触点。 以这种方式，反熔丝可被配置为使得在阳极和阴极之间施加编程电压将第一半导体区域充分加热以达到从其向外驱动掺杂剂的温度，从而使第一半导体区域的边缘移动 更靠近第二半导体区域的相邻边缘，从而将第一和第二半导体区域之间的电阻永久地减小一个或多个数量级。

公开(公告)号：US08519507B2

公开(公告)日：2013-08-27

申请号：US12493616

申请日：2009-06-29

申请人： Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

发明人： Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

IPC分类号： H01L23/52

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electrically programmable fuse that includes an anode contact region and a cathode contact region are formed of a polysilicon layer having a silicide layer formed thereon, and a fuse link conductively connecting the cathode contact region with the anode contact region, which is programmable by applying a programming current, and a plurality of anisometric contacts formed on the silicide layer of the cathode contact region or on both the silicide layer of the cathode contact region and the anode contact region in a predetermined configuration, respectively.

摘要翻译： 包括阳极接触区域和阴极接触区域的电可编程熔丝由其上形成有硅化物层的多晶硅层和导电连接阴极接触区域与阳极接触区域的熔丝链形成，该熔丝链可通过应用 编程电流，以及分别形成在阴极接触区域的硅化物层上或在阴极接触区域和阳极接触区域的硅化物层上以预定构造形成的多个不规则接触。

公开(公告)号：US08629049B2

公开(公告)日：2014-01-14

申请号：US13420724

申请日：2012-03-15

申请人： Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

发明人： Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

IPC分类号： H01L21/44

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fabrication method for fabricating an electrically programmable fuse method includes depositing a polysilicon layer on a substrate, patterning an anode contact region, a cathode contact region and a fuse link conductively connecting the cathode contact region with the anode contact region, which is programmable by applying a programming current, depositing a silicide layer on the polysilicon layer, and forming a plurality of anisometric contacts on the silicide layer of the cathode contact region and the anode contact region in a predetermined configuration, respectively.

摘要翻译： 制造电可编程熔丝法的制造方法包括在衬底上沉积多晶硅层，图案化阳极接触区域，阴极接触区域和将阴极接触区域与阳极接触区域导电连接的熔断体，其可通过应用 编程电流，在多晶硅层上沉积硅化物层，以及在预定构型中分别在阴极接触区域和阳极接触区域的硅化物层上形成多个不规则接触。

公开(公告)号：US20120171857A1

公开(公告)日：2012-07-05

申请号：US13420724

申请日：2012-03-15

申请人： Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

发明人： Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran

IPC分类号： H01L21/768

CPC分类号： H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fabrication method for fabricating an electrically programmable fuse method includes depositing a polysilicon layer on a substrate, patterning an anode contact region, a cathode contact region and a fuse link conductively connecting the cathode contact region with the anode contact region, which is programmable by applying a programming current, depositing a silicide layer on the polysilicon layer, and forming a plurality of anisometric contacts on the silicide layer of the cathode contact region and the anode contact region in a predetermined configuration, respectively.

摘要翻译： 制造电可编程熔丝法的制造方法包括在衬底上沉积多晶硅层，图案化阳极接触区域，阴极接触区域和将阴极接触区域与阳极接触区域导电连接的熔断体，其可通过应用 编程电流，在多晶硅层上沉积硅化物层，以及在预定构型中分别在阴极接触区域和阳极接触区域的硅化物层上形成多个不规则接触。

公开(公告)号：US08004060B2

公开(公告)日：2011-08-23

申请号：US11946938

申请日：2007-11-29

申请人： Deok-kee Kim ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran ,  Kenneth J. Stein

发明人： Deok-kee Kim ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran ,  Kenneth J. Stein

IPC分类号： H01L29/00

CPC分类号： H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

摘要： A metal layer and a semiconductor layer are sequentially deposited on a substrate. The semiconductor layer and the metal layer are lithographically patterned to form a stack of a semiconductor portion and a metal gate portion, which is preferably performed concurrently with formation of at least one metal gate stack. In one embodiment, the size of the semiconductor portion is reduced and a metal semiconductor alloy portion is formed on the semiconductor portion by metallization. In a first electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the metal semiconductor alloy portion and the metal gate portion. In another embodiment, two disjoined metal semiconductor alloy portions are formed on the semiconductor portion. In a second electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the two previously disjoined metal semiconductor alloy portions.

摘要翻译： 金属层和半导体层顺序地沉积在基板上。 半导体层和金属层被光刻图案化以形成半导体部分和金属栅极部分的堆叠，其优选地与至少一个金属栅极叠层的形成同时进行。 在一个实施例中，半导体部分的尺寸减小，并且金属半导体合金部分通过金属化形成在半导体部分上。 在由此形成的第一电反熔丝中，金属半导体合金部分可以电铸以在金属半导体合金部分和金属栅极部分之间形成短路。 在另一个实施例中，在半导体部分上形成两个非接合的金属半导体合金部分。 在由此形成的第二电反熔丝中，金属半导体合金部分可以被电铸以在两个先前接合的金属半导体合金部分之间形成短路。

公开(公告)号：US20090141533A1

公开(公告)日：2009-06-04

申请号：US11946938

申请日：2007-11-29

申请人： Deok-kee Kim ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran ,  Kenneth J. Stein

发明人： Deok-kee Kim ,  Chandrasekharan Kothandaraman ,  Dan Moy ,  Norman W. Robson ,  John M. Safran ,  Kenneth J. Stein

IPC分类号： G11C17/08 ,  H01L27/20 ,  H01L21/768

CPC分类号： H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

摘要： A metal layer and a semiconductor layer are sequentially deposited on a substrate. The semiconductor layer and the metal layer are lithographically patterned to form a stack of a semiconductor portion and a metal gate portion, which is preferably performed concurrently with formation of at least one metal gate stack. In one embodiment, the size of the semiconductor portion is reduced and a metal semiconductor alloy portion is formed on the semiconductor portion by metallization. In a first electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the metal semiconductor alloy portion and the metal gate portion. In another embodiment, two disjoined metal semiconductor alloy portions are formed on the semiconductor portion. In a second electrical antifuse formed thereby, the metal semiconductor alloy portion may be electromigrated to form a short between the two previously disjoined metal semiconductor alloy portions.

摘要翻译： 金属层和半导体层顺序地沉积在基板上。 半导体层和金属层被光刻图案化以形成半导体部分和金属栅极部分的堆叠，其优选地与至少一个金属栅极叠层的形成同时进行。 在一个实施例中，半导体部分的尺寸减小，并且金属半导体合金部分通过金属化形成在半导体部分上。 在由此形成的第一电反熔丝中，金属半导体合金部分可以电铸以在金属半导体合金部分和金属栅极部分之间形成短路。 在另一个实施例中，在半导体部分上形成两个非接合的金属半导体合金部分。 在由此形成的第二电反熔丝中，金属半导体合金部分可以被电铸以在两个先前接合的金属半导体合金部分之间形成短路。

公开(公告)号：US08975910B2

公开(公告)日：2015-03-10

申请号：US13457692

申请日：2012-04-27

申请人： Troy L. Graves-Abe ,  Benjamin A. Himmel ,  Chandrasekharan Kothandaraman ,  Norman W. Robson

发明人： Troy L. Graves-Abe ,  Benjamin A. Himmel ,  Chandrasekharan Kothandaraman ,  Norman W. Robson

IPC分类号： G01R31/26 ,  H01L21/28 ,  H01L21/768 ,  H01L21/66 ,  G01R31/28

CPC分类号： H01L22/14 ,  G01R31/2853 ,  H01L21/76898 ,  H01L2924/00 ,  H01L2924/0002

摘要： A TSV structure, method of making the TSV structure and methods of testing the TSV structure. The structure including: a trench extending from a top surface of a semiconductor substrate to a bottom surface of the semiconductor substrate, the trench surrounding a core region of the semiconductor substrate; a dielectric liner on all sidewalls of the trench; and an electrical conductor filling all remaining space in the trench, the dielectric liner electrically isolating the electrical conductor from the semiconductor substrate and from the core region.

摘要翻译： TSV结构，制造TSV结构的方法和TSV结构测试方法。 该结构包括：从半导体衬底的顶表面延伸到半导体衬底的底表面的沟槽，沟槽围绕半导体衬底的芯区; 在沟槽的所有侧壁上的电介质衬垫; 以及电导体填充沟槽中的所有剩余空间，电介质衬垫将电导体与半导体衬底和芯区域电隔离。