摘要:
A granulator, having: a granulation unit having a bottom floor with a perforated plate as its bottom part; an upper air-supplying pipe for supplying a fluidizing air to the bottom floor of the granulation unit; a lower air-supplying pipe; air-spouting pipes, each of which is branched from the lower air-supplying pipe, and has an opening in the bottom floor of the perforated plate, for jetting the air into the granulation unit; and spray nozzles for spraying a granulation raw material liquid, which each are provided in the center of an air outlet of the air-spouting pipe, or a granulator, having: the bottom floor; the air-supplying pipe; and spray nozzles for spraying a granulation raw material liquid, which each are provided in an opening in the bottom floor of the perforated plate, and use a high-pressure atomizing air as an auxiliary gas, wherein, in each granulator, the spray nozzles are formed in triangular arrangement.
摘要:
A granulator, having a granulation unit having a bottom floor with a perforated plate as its bottom part; an upper air-supplying pipe for supplying a fluidizing air to the bottom of the granulation unit; a lower air-supplying pipe; air-spouting pipes, each of which is branched from the lower air-supplying pipe, and has an opening in the bottom of the perforated plate, for jetting the air into the granulation unit; and spray nozzles for spraying a granulation raw material liquid, which each are provided in the center of an air outlet of the air-spouting pipe, or having: the bottom; the air-supplying pipe; and spray nozzles for spraying a granulation raw material liquid each of which are provided in an opening in the bottom of the perforated plate, and use a high-pressure atomizing air as an auxiliary gas, with the spray nozzles being provided in a triangular arrangement.
摘要:
A granulator, having a granulation unit having a bottom floor with a perforated plate as its bottom part; an upper air-supplying pipe for supplying a fluidizing air to the bottom floor of the granulation unit; a lower air-supplying pipe; air-spouting pipes, each of which is branched from the lower air-supplying pipe, and has an opening in the bottom floor of the perforated plate, for jetting the air into the granulation unit; and spray nozzles for spraying a granulation raw material liquid, which each are provided in the center of an air outlet of the air-spouting pipe, or a granulator, having: the bottom floor; the air-supplying pipe; and spray nozzles for spraying a granulation raw material liquid each of which are provided in an opening in the bottom floor of the perforated plate, and use a high-pressure atomizing air as an auxiliary gas, wherein, in each granulator, the spray nozzles are provided in a triangular arrangement.
摘要:
The present invention provides a medicinal agent and a method for each of various testing or the like, which enable the treatment and prevention, particularly preventive treatment, of Th3 march-related diseases. The present invention also provides a pharmaceutical composition for treating and/or preventing Th3 march-related diseases, which comprises zinc, calcium and phosphorus and additionally comprises pumpkin seeds and corn silk, and which preferably can activate the DNA repairing ability of a zinc finger, particularly the ability of repairing defect or mutation of DNA for a filaggrin gene, of a zinc finger.
摘要:
A reactor including a reactor vessel and heat exchange tubes provided in the reactor vessel. The reactor vessel includes a tubesheet and is configured to receive a reaction fluid. The tubesheet has a first plate member configured to contact the reaction fluid and a second plate member configured to not contact the reaction fluid. Heat exchange tubes are provided in the reactor vessel and fixed to the first plate member. The heat exchange tubes are configured to receive a heat exchange medium. At least a portion of the first plate member configured to contact the reaction fluid is made of a metal that has a high corrosion-resistance against the reaction liquid, and the second plate member is made of a metal that has a low corrosion-resistance against the reaction liquid. The second plate member is detachably fixed to a remainder of the reactor vessel.
摘要:
A semiconductor manufacturing apparatus, when a barrier film and a copper film are formed along a recess in an insulating film by using an alloy layer of copper and addictive metal, e.g., Mn, and copper wiring is embedded therein, reduces Mn in the copper film to suppress an increase in wiring resistance. A vacuum transfer module is connected, through a load lock chamber, to a loader module for transferring a wafer with respect to a carrier. A formic acid treatment module supplying formic acid vapor as an organic acid to the wafer and a module forming a film of Cu, e.g., by CVD are connected to the vacuum transfer module to configure an apparatus manufacturing a semiconductor. The wafer W subjected to alloy layer formation and then, e.g., to annealing is transferred into the apparatus, and treatment with formic acid is performed followed by Cu film formation.
摘要:
To provide a lithographic printing plate precursor which generates no stains in the non-image area and is also excellent in development latitude. Disclosed is a lithographic printing plate precursor comprising a support and a photosensitive layer, said lithographic printing plate precursor further comprising a subbing layer containing a maleamic acid (co)polymer, in which at least one hydrogen atom on a nitrogen atom is substituted with an onium group, provided between the photosensitive layer and the support.
摘要:
In a process and an apparatus for synthesizing urea which synthesize urea from ammonia and carbon dioxide, the operating condition can be grasped easily and with good accuracy. A process for synthesizing urea which includes: a reaction step of obtaining a urea synthesis solution which contains urea, unreacted ammonia, unreacted carbon dioxide and water by causing ammonia and carbon dioxide to react with each other; a stripping step of separating a gas mixture containing the unreacted ammonia and the unreacted carbon dioxide by stripping the urea synthesis solution by using at least a portion of raw material carbon dioxide; a condensing step of obtaining a condensed liquid by condensing the gas mixture in an absorbing medium while cooling the gas mixture; a recycling step of recycling the condensed liquid to the reaction step; and a step of measuring the density of the condensed liquid online. An apparatus for carrying out this process is provided.
摘要:
It is intended to enable more smooth operation in an apparatus for synthesizing urea by circumventing the downward flow of a urea synthesis solution which is a gas-liquid two-phase flow and stabilizing the flow of the urea synthesis solution still remaining the gas-liquid two-phase flow and to reduce energy loss by giving smaller flow resistance. The present invention provides an apparatus for synthesizing urea including: a synthesis reactor for reacting NH3 with CO2 to obtain a urea synthesis solution containing urea, unreacted NH3, unreacted CO2, and water; a stripper for stripping the urea synthesis solution with use of at least a part of raw material CO2 to separate a gas mixture containing the unreacted NH3 and the unreacted CO2; a vertical submerged condenser having a shell and tube structure for condensing the gas mixture in an absorbing medium on the shell side while cooling the gas mixture with a cooling medium passing through the tube side; and recycling means for recycling a liquid obtained from this condenser to the synthesis reactor, wherein the synthesis reactor is a horizontal type, and wherein piping for sending the urea synthesis solution from the synthesis reactor to the stripper runs substantially horizontally and/or upward.
摘要:
An adhesion between a Cu diffusion barrier film and a Cu wiring in a semiconductor device is improved and reliability of the semiconductor device is improved. A film forming method for forming a Cu film on a substrate to be processed is provided with a first process of forming an adhesion film on the Cu diffusion barrier film formed on the substrate to be processed, and a second process of forming a Cu film on the adhesion film. The adhesion film includes Pd.