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    VEHICLE COOLING SYSTEM
    1.
    发明申请
    VEHICLE COOLING SYSTEM 审中-公开
    车辆冷却系统

    公开(公告)号：US20130319038A1

    公开(公告)日：2013-12-05

    申请号：US14000311

    申请日：2012-02-21

    申请人： Yasuhiro Kawase ,  Yuichi Ohno ,  Kazuhide Uchida ,  Yoshiaki Kawakami ,  Yuki Jojima ,  Eizo Takahashi ,  Kousuke Sato

    发明人： Yasuhiro Kawase ,  Yuichi Ohno ,  Kazuhide Uchida ,  Yoshiaki Kawakami ,  Yuki Jojima ,  Eizo Takahashi ,  Kousuke Sato

    IPC分类号： F25B1/00

    CPC分类号： F25B1/00 ,  B60H1/00278 ,  B60H1/323 ,  B60H2001/00307 ,  B60H2001/00949 ,  B60H2001/3298 ,  F25B5/04 ,  F25B31/006 ,  F25B2341/0012 ,  F25B2600/2511

    摘要： A cooling system includes a compressor that circulates refrigerant; a condenser that condenses the refrigerant; an expansion valve that reduces a pressure of the refrigerant that has been condensed by the condenser; an evaporator that vaporizes the refrigerant that has been reduced in pressure by the expansion valve; a refrigerant passage through which the refrigerant flows from an outlet of the condenser toward an inlet of the expansion valve, and that includes a passage forming portion that forms part of the refrigerant passage; a second passage that is connected in parallel with the passage forming portion; a cooling portion that is provided in the second passage and cools a heat source using the refrigerant; and an expansion valve that is arranged upstream of the cooling portion in the second passage.

    摘要翻译： 冷却系统包括使制冷剂循环的压缩机; 冷凝器冷凝制冷剂; 膨胀阀，其减小由冷凝器冷凝的制冷剂的压力; 使通过膨胀阀减压的制冷剂蒸发的蒸发器; 制冷剂通道，制冷剂从冷凝器的出口朝向膨胀阀的入口流动，并且包括形成部分制冷剂通道的通道形成部分; 与通道形成部分并联连接的第二通道; 冷却部，其设置在所述第二通路中，并使用所述制冷剂冷却热源; 以及布置在第二通道中的冷却部分的上游的膨胀阀。

    Fluid machine for Rankine cycle
    2.
    发明申请
    Fluid machine for Rankine cycle 有权
    兰金循环流体机

    公开(公告)号：US20070175212A1

    公开(公告)日：2007-08-02

    申请号：US11641202

    申请日：2006-12-18

    申请人： Keiichi Uno ,  Hironori Asa ,  Yasuhiro Takeuchi ,  Hiroshi Ogawa ,  Hiroshi Kishita ,  Kazuhide Uchida ,  Yasuhiro Kawase ,  Atsushi Inaba

    发明人： Keiichi Uno ,  Hironori Asa ,  Yasuhiro Takeuchi ,  Hiroshi Ogawa ,  Hiroshi Kishita ,  Kazuhide Uchida ,  Yasuhiro Kawase ,  Atsushi Inaba

    IPC分类号： F01C1/02 ,  F04B1/06 ,  F02G1/04 ,  F01K23/10

    CPC分类号： F01K25/06 ,  F01C1/0215 ,  F01C13/04 ,  F01K21/005 ,  F01K25/04 ,  F04C2240/45

    摘要： It is an object to provide a fluid machine, which is simple in structure and in which lubricating oil containing smaller amount of the working fluid is supplied to sliding portions of an expansion device. The fluid machine has the expansion device for generating a driving force by expansion of the working fluid, which contains the lubricating oil and is heated to a gas phase condition. The fluid machine further has an electric power generating device driven by the driving force of the expansion device and generating electric power. An oil pooling portion is formed in a fluid passage, through which the working fluid discharged from the expansion device flows, such that the lubricating oil contained in the working fluid is brought into contact with at least one of sliding portions of the expansion device and the electric power generating device. And a heating unit is provided to heat the working fluid in the oil pooling portion.

    摘要翻译： 本发明的目的是提供一种流体机械，其结构简单，并且将含有较少量的工作流体的润滑油供应到膨胀装置的滑动部分。 流体机械具有用于通过膨胀包含润滑油并被加热到气相状态的工作流体产生驱动力的膨胀装置。 流体机械还具有由膨胀装置的驱动力驱动并产生电力的发电装置。 在液体通道中形成有一个集油部分，从膨胀装置排出的工作流体通过该流体通道流动，使得包含在工作流体中的润滑油与膨胀装置的滑动部分和 发电装置。 并且提供加热单元以加热储油部分中的工作流体。

    Fluid machine for rankine cycle
    3.
    发明授权
    Fluid machine for rankine cycle 有权
    血液循环机

    公开(公告)号：US07870733B2

    公开(公告)日：2011-01-18

    申请号：US11641202

    申请日：2006-12-18

    申请人： Keiichi Uno ,  Hironori Asa ,  Yasuhiro Takeuchi ,  Hiroshi Ogawa ,  Hiroshi Kishita ,  Kazuhide Uchida ,  Yasuhiro Kawase ,  Atsushi Inaba

    发明人： Keiichi Uno ,  Hironori Asa ,  Yasuhiro Takeuchi ,  Hiroshi Ogawa ,  Hiroshi Kishita ,  Kazuhide Uchida ,  Yasuhiro Kawase ,  Atsushi Inaba

    IPC分类号： F01K13/02

    CPC分类号： F01K25/06 ,  F01C1/0215 ,  F01C13/04 ,  F01K21/005 ,  F01K25/04 ,  F04C2240/45

    摘要： It is an object to provide a fluid machine, which is simple in structure and in which lubricating oil containing smaller amount of the working fluid is supplied to sliding portions of an expansion device. The fluid machine has the expansion device for generating a driving force by expansion of the working fluid, which contains the lubricating oil and is heated to a gas phase condition. The fluid machine further has an electric power generating device driven by the driving force of the expansion device and generating electric power. An oil pooling portion is formed in a fluid passage, through which the working fluid discharged from the expansion device flows, such that the lubricating oil contained in the working fluid is brought into contact with at least one of sliding portions of the expansion device and the electric power generating device. And a heating unit is provided to heat the working fluid in the oil pooling portion.

    摘要翻译： 本发明的目的是提供一种流体机械，其结构简单，并且将含有较少量的工作流体的润滑油供应到膨胀装置的滑动部分。 流体机械具有用于通过膨胀包含润滑油并被加热到气相状态的工作流体产生驱动力的膨胀装置。 流体机械还具有由膨胀装置的驱动力驱动并产生电力的发电装置。 在液体通道中形成有一个集油部分，从膨胀装置排出的工作流体通过该流体通道流动，使得包含在工作流体中的润滑油与膨胀装置的滑动部分和 发电装置。 并且提供加热单元以加热储油部分中的工作流体。

    Air conditioner for vehicle
    6.
    发明申请
    Air conditioner for vehicle 审中-公开
    汽车空调

    公开(公告)号：US20100281901A1

    公开(公告)日：2010-11-11

    申请号：US12799905

    申请日：2010-05-04

    申请人： Yasuhiro Kawase ,  Yukikatsu Ozaki ,  Mitsuo Inagaki

    发明人： Yasuhiro Kawase ,  Yukikatsu Ozaki ,  Mitsuo Inagaki

    IPC分类号： F25B27/00 ,  B60H3/00 ,  F25B41/00 ,  F25B13/00 ,  F25B43/00 ,  F28D1/00

    CPC分类号： F25B25/005 ,  B60H1/00885 ,  B60H1/20 ,  B60H1/32284 ,  B60H2001/00928 ,  B60H2001/00949 ,  F25B2339/047

    摘要： In an air conditioner for a vehicle, in a heating operation for heating a vehicle compartment, when heating capacity is obtained by flowing a coolant through an inside of an indoor heat exchanger, the coolant flows directly in the inside of the indoor heat exchanger to heat air to be supplied to the vehicle compartment. In contrast, when the heating capacity is not obtained by flowing the coolant through the inside of the indoor heat exchanger, the coolant flows through a first water-refrigerant heat exchanger and a refrigerant in a heat pump cycle circulates so that heat of the coolant is absorbed by the refrigerant in the first water-refrigerant heat exchanger, and the air is heated in the indoor heat exchanger by using heat of the refrigerant that has absorbed the heat of the coolant.

    摘要翻译： 在车辆用空调机中，在车辆的加热用加热动作中，当通过室内热交换器的内部流动冷却剂而获得加热量时，冷却剂直接在室内热交换器的内部流动 供应到车厢的空气。 相反，当通过室内热交换器的内部流动冷却剂而不能获得加热能力时，冷却剂流过第一水 - 制冷剂热交换器，并且热泵循环中的制冷剂循环，使得冷却剂的热量 被第一水 - 制冷剂热交换器中的制冷剂吸收，并且通过吸收了冷却剂的热量的制冷剂的热量在室内热交换器中对空气进行加热。

    Protective Film Structure of Metal Member, Metal Component Employing Protective Film Structure, and Equipment for Producing Semiconductor or Flat-Plate Display Employing Protective Film Structure
    7.
    发明申请
    Protective Film Structure of Metal Member, Metal Component Employing Protective Film Structure, and Equipment for Producing Semiconductor or Flat-Plate Display Employing Protective Film Structure 有权
    金属部件的保护膜结构，使用保护膜结构的金属部件以及使用保护膜结构的半导体或平板显示器的生产设备

    公开(公告)号：US20090142588A1

    公开(公告)日：2009-06-04

    申请号：US11917633

    申请日：2006-06-16

    申请人： Tadahiro Ohmi ,  Yasuyuki Shirai ,  Hitoshi Morinaga ,  Yasuhiro Kawase ,  Masafumi Kitano ,  Fumikazu Mizutani ,  Makoto Ishikawa ,  Yukio Kishi

    发明人： Tadahiro Ohmi ,  Yasuyuki Shirai ,  Hitoshi Morinaga ,  Yasuhiro Kawase ,  Masafumi Kitano ,  Fumikazu Mizutani ,  Makoto Ishikawa ,  Yukio Kishi

    IPC分类号： B32B15/00

    CPC分类号： C23C4/02 ,  C23C8/80 ,  C23C28/00 ,  C23C28/042 ,  C25D11/02 ,  C25D11/04 ,  C25D11/08 ,  C25D11/10 ,  C25D11/16 ,  C25D11/18 ,  Y10T428/26 ,  Y10T428/265 ,  Y10T428/31678

    摘要： Multifunction production equipment enabling a plurality of processes in which deposition of reaction products on the inner wall of the processing chamber of equipment for producing a semiconductor or a flat-plate display, metal contamination due to corrosion of the inner wall, or the like, and fluctuation of the process due to discharged gas are suppressed, and a protective film structure for use therein. On the surface of a metal material, a first coating layer having an oxide coating of 1μ thick or less formed as an underlying layer by direct oxidation of a parent material, and a second coating layer of about 200 μm thick are formed. With such an arrangement, corrosion resistance against irradiation with ions or radicals can be imparted to a second layer protective film, and the effect of a protective layer for preventing corrosion of the surface of parent metal caused by diffusing molecules or ions into the second layer protective film can be imparted to the first layer oxide film. Consequently, contamination of the substrate with metals generated from each metal member and the inner surface of the process chamber is reduced, and stripping of the second layer protective film due to lowering in adhesion of the second layer protective film due to corrosion of the interface between the parent material and the second layer protective film can be suppressed.

    摘要翻译： 多功能生产设备能够实现多个工艺，其中在用于制造半导体或平板显示器的设备的处理室的内壁上沉积反应产物，由于内壁的腐蚀而引起的金属污染等，以及 排出气体的处理的波动被抑制，以及用于其中的保护膜结构。 在金属材料的表面上，形成通过母材直接氧化形成作为下层的1μm厚以下的氧化物被膜的第1被覆层和200μm厚的第2被覆层。 通过这样的布置，可以对第二层保护膜赋予对离子或自由基的照射的耐腐蚀性，以及用于防止母体金属表面由于扩散分子或离子而导致的第二层保护层的腐蚀的保护层的效果 可以将膜施加到第一层氧化物膜。 因此，由金属构件和处理室的内表面产生的金属对衬底的污染减少，并且由于第二层保护膜的粘附性的降低而导致的第二层保护膜的剥离 可以抑制母材和第二层保护膜。

    Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same
    9.
    发明申请
    Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the same 审中-公开
    用于半导体器件的清洁用基板的清洗液及使用其的清洗方法

    公开(公告)号：US20050020463A1

    公开(公告)日：2005-01-27

    申请号：US10899304

    申请日：2004-07-27

    申请人： Makoto Ikemoto ,  Yasuhiro Kawase ,  Hitoshi Morinaga

    发明人： Makoto Ikemoto ,  Yasuhiro Kawase ,  Hitoshi Morinaga

    IPC分类号： C11D1/72 ,  C11D3/02 ,  C11D3/20 ,  C11D11/00 ,  C11D1/00

    CPC分类号： C11D3/042 ,  C11D1/72 ,  C11D3/2075 ,  C11D11/0047

    摘要： A cleaning solution for cleaning a substrate for semiconductor devices and a cleaning method using the said cleaning solution, which comprises at least the following components (A), (B) and (C): (A) an ethyleneoxide-type surfactant containing a hydrocarbon group which may have a substituent group except for phenyl, and a polyoxyethylene group in which a ratio (m/n) of a number (m) of carbon atoms contained in the hydrocarbon group to a number (n) of oxyethylene groups contained in the polyoxyethylene group is in the range of 1 to 1.5, the number (m) of carbon atoms is not less than 9, and the number (n) of oxyethylene groups is not less than 7; (B) water; and (C) alkali or an organic acid. The cleaning solution highly clean the surface of the substrate without occurrence of corrosion by removing fine particles and organic contaminants which are adhered onto the surface of the substrate.

    摘要翻译： 一种用于清洁半导体器件用基板的清洗液和使用上述清洗液的清洗方法，其至少包括以下成分（A），（B）和（C）：（A）含有烃的环氧乙烷型表面活性剂 可以具有除苯基以外的取代基的基团，以及其中烃基中所含的（m）个碳原子数（m）与（甲） 聚氧乙烯基的范围为1〜1.5，碳原子数（m）为9以上，氧化乙烯基的数（n）为7以上。 （B）水; 和（C）碱或有机酸。 清洁溶液通过除去附着在基材表面上的细小颗粒和有机污染物，高度清洁基板的表面而不会发生腐蚀。