公开(公告)号：US4611292A

公开(公告)日：1986-09-09

申请号：US537095

申请日：1983-09-29

申请人： Takanori Ninomiya ,  Yasuo Nakagawa

发明人： Takanori Ninomiya ,  Yasuo Nakagawa

IPC分类号： B25J19/02 ,  G01B11/00 ,  G01S17/06 ,  G06T1/00 ,  G01B11/24 ,  G01B11/03 ,  G01B11/22

CPC分类号： G01B11/00 ,  B25J19/023 ,  G01S17/06 ,  G06T1/0014

摘要： A method and an apparatus for detecting the position and posture of an object (5, 9, 10) are characterized by two planar light beams (3a, 3b) alternately projected on the object (5, 9, 10) to be handled and intersection lines (A, B) formed between the two planar light beams (3a, 3b) and the object (5, 9, 10) which are imaged by a single image pickup device (2) positioned between the two planar light beams (3a, 3b).A bright line occurring at a junction between an edge of the object and an intersection line is separated, extracted and transformed into an actual coordinate in a three dimensional coordinate system (x, y, z) by referring to corresponding relationships between the actual coordinate system (x, y, z) and a scanning coordinate system (i, j) so that the position and posture of the object (5, 9, 10) are detected in three dimensions.

摘要翻译： 用于检测物体（5,9,10）的位置和姿势的方法和装置的特征在于交替地投射在被处理物体（5,9,10）上的两个平面光束（3a，3b）被处理和交叉 由位于两个平面光束（3a，3b）之间的单个图像拾取装置（2）成像的两个平面光束（3a，3b）和物体（5,9,10）之间形成的线（A，B） 3b）。 通过参照实际坐标系（X，Y，Z）之间的对应关系，在物体的边缘与交叉线之间的连接处发生的亮线被分离，提取并变换为三维坐标系（x，y，z）中的实际坐标 （x，y，z）和扫描坐标系（i，j），从而以三维检测物体（5,9,10）的位置和姿势。

公开(公告)号：US4953224A

公开(公告)日：1990-08-28

申请号：US158125

申请日：1988-02-16

申请人： Toshiaki Ichinose ,  Takanori Ninomiya ,  Yasuo Nakagawa

发明人： Toshiaki Ichinose ,  Takanori Ninomiya ,  Yasuo Nakagawa

IPC分类号： G06T7/00 ,  G06K9/00

CPC分类号： G06T7/0006 ,  G06T2207/30141

摘要： A pattern defect detecting method and apparatus are disclosed on a connectivity processor to input a binary picture signal pattern and a pad position coordinate and outputting connectivity data between pads. Here, the connectivity processing refers to a processing for giving the identical number to one aggregation of connected or linked pads for the pads given to a serial pattern. In the connectivity processor wherein a plane on which the drawn pattern to be inspected is scanned by a linear sensor, the connectivity processing can be releazed almost concurrently with the scanning by driving a temporary memory.Also, a pattern defect detecting apparatus the above-mentioned connectivity. The invention processing coping with the difficulties of a required inspection level, and also represents a processing time of each embodiment theoretically. A moving time of the bed on which an inspecting object is placed and others are added to the real processing time.

摘要翻译： 在连接性处理器上公开了一种图案缺陷检测方法和装置，用于输入二进制图像信号模式和焊盘位置坐标，并在焊盘之间输出连接数据。 这里，连接处理是指给予给予串行模式的焊盘的连接或连接焊盘的一个聚合相同数量的处理。 在其中通过线性传感器扫描要检查的绘制图案的平面的连接处理器中，可以通过驱动临时存储器几乎与扫描同时地进行连接处理。 此外，图案缺陷检测装置具有上述连接性。 本发明处理应对所需检查水平的困难，并且也表示理论上各实施例的处理时间。 检查对象被放置的床的移动时间和其他被添加到实际处理时间。

公开(公告)号：US4641527A

公开(公告)日：1987-02-10

申请号：US707501

申请日：1985-03-04

申请人： Takashi Hiroi ,  Takanori Ninomiya ,  Yasuo Nakagawa

发明人： Takashi Hiroi ,  Takanori Ninomiya ,  Yasuo Nakagawa

IPC分类号： G01N21/956 ,  G01R31/02 ,  G01N29/04

CPC分类号： G01R31/026 ,  G01N21/956 ,  G01N2021/479

摘要： An object to be inspected which is jointed to a circuit board is vibrated in a contactless manner by applying a gas jet or a magnetic force to the object, a laser beam is irradiated on the object, and a laser beam reflected from the object is detected by a linear sensor to observe a laser speckle pattern for the object. Quality of a joint junction state of the object is judged from the laser speckle pattern.

摘要翻译： 通过对物体施加气体射流或磁力，将被检查物体接触电路板以非接触的方式振动，激光束被照射在物体上，检测从物体反射的激光束 通过线性传感器观察物体的激光散斑图案。 从激光斑纹图案判断物体的接合连接状态的质量。

公开(公告)号：US5015097A

公开(公告)日：1991-05-14

申请号：US416934

申请日：1989-10-04

申请人： Mineo Nomoto ,  Takanori Ninomiya ,  Hiroya Koshishiba ,  Toshimitsu Hamada ,  Yasuo Nakagawa

发明人： Mineo Nomoto ,  Takanori Ninomiya ,  Hiroya Koshishiba ,  Toshimitsu Hamada ,  Yasuo Nakagawa

IPC分类号： G01N21/88 ,  G01N21/956 ,  G06T7/00 ,  H05K3/00 ,  H05K3/40

CPC分类号： G06T7/0004 ,  G01N21/95692 ,  G06T7/604 ,  G01N2021/95653 ,  G01N21/8806 ,  G06T2207/30141

摘要： A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed.The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results. The area of the image of the filler is detected according to differences between the brightness of the board surface or of the via-hole wall and the brightness of the filler in the via-hole in the detected optical image, and whether the filler is lacking or not is decided according to the detection result.

摘要翻译： 公开了一种用于检查通过非导电电路板并填充有导电物质的多个通孔的填充状态的方法和用于实施该方法的装置。 电路板的表面在两个方向上被照亮，以产生取决于多个通孔中的填料的凹凸状态的阴影。 检测电路板的被照射表面的光学图像。 检测存在于所检测的光学图像中并且在两个方向上通过光照射在一个通孔中产生的两个阴影区域的每个边缘。 根据检测到的边缘的相互位置关系来识别该通孔中的填充物是处于凹状还是凸状状态。 检测每个阴影区域的长度，根据检测结果确定填料的凹状或凸状状态是否处于预定的余量内。 根据检测到的光学图像中的基板表面或通孔壁的亮度与通孔中的填充物的亮度之间的差异来检测填充物的图像的面积，以及填充材料是否缺乏 是否根据检测结果决定。

公开(公告)号：US5930382A

公开(公告)日：1999-07-27

申请号：US645475

申请日：1996-05-13

申请人： Yoko Irie ,  Hideaki Doi ,  Yasuhiko Hara ,  Tadashi Iida ,  Yasuhiro Fujishita ,  Yasuo Nakagawa ,  Takanori Ninomiya

发明人： Yoko Irie ,  Hideaki Doi ,  Yasuhiko Hara ,  Tadashi Iida ,  Yasuhiro Fujishita ,  Yasuo Nakagawa ,  Takanori Ninomiya

IPC分类号： G01N23/04 ,  G01N21/88 ,  G01N21/956 ,  G01N29/04 ,  G01R31/02 ,  G06T7/00 ,  H05K3/00 ,  G06K9/00 ,  G06K9/32 ,  G06K9/42

CPC分类号： G06T7/0004 ,  G06T2207/10116 ,  G06T2207/20044 ,  G06T2207/30141

摘要： A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.

摘要翻译： 布线图案检查方法包括用X射线照射设置有多层的布线图案的测试对象，获得与叠加在多个层中的布线图案的厚度相对应的可变密度图像信号，所述多个层包括叠加部分 布线图案，从可变密度图像信号中提取与叠加布线图案的数量相对应的多个图像信号的数量，以及比较从表示的图像信号获得的布线图案的终点信息或孤立点信息 从提取的图像信号中获得的表示较少数量的叠加布线图案以检查布线图案中的布线图案中的缺陷的叠加布线图案的数量以及关于布线点上的端点或隔离点的分支信息。 布线图形检查方法由布线图形检查系统进行。

公开(公告)号：US5278012A

公开(公告)日：1994-01-11

申请号：US938516

申请日：1992-09-02

申请人： Chie Yamanaka ,  Toshiaki Ichinose ,  Takanori Ninomiya ,  Hisafumi Iwata ,  Yasuo Nakagawa ,  Nobuyuki Akiyama

发明人： Chie Yamanaka ,  Toshiaki Ichinose ,  Takanori Ninomiya ,  Hisafumi Iwata ,  Yasuo Nakagawa ,  Nobuyuki Akiyama

IPC分类号： G01N21/956 ,  H01L21/00 ,  H01L21/48 ,  H01L21/66 ,  H05K3/22 ,  G01N21/88 ,  G01N21/64

CPC分类号： H01L21/67121 ,  G01N21/95684 ,  H01L21/4857 ,  H01L22/20 ,  H05K3/225 ,  G01N2021/8825

摘要： A method for producing a thin film multilayer substrate having a base substrate, and, which a plurality of conductor pattern layers superposed thereon through dielectric layers therebetween comprises the steps of: optically detecting the uppermost conductor pattern layer whenever the conductor pattern layer is formed on the base substrate; inspecting an absence and/or presence of a fault of the conductor pattern layer; and repairing a faulty portion in accordance with fault position data detected by the inspecting. According to this method, it is possible to enhance a production yield of relatively large size of thin film multilayer substrates which needs a relatively small amount of production at a high production cost, for mounting LSI chips thereon.

摘要翻译： 一种制造具有基底基板的薄膜多层基板的方法，其中通过介电层叠置在其上的多个导体图案层之间包括以下步骤：每当在导体图案层上形成导体图案层时，光学检测最上面的导体图案层 基底; 检查导体图案层的缺陷和/或存在故障; 并根据检查检测到的故障位置数据修复故障部分。 根据这种方法，可以提高生产成本较高的相对大尺寸薄膜多层基板的生产成本，以便在其上安装LSI芯片。

公开(公告)号：US4791586A

公开(公告)日：1988-12-13

申请号：US812928

申请日：1985-12-23

申请人： Shunji Maeda ,  Hitoshi Kubota ,  Satoru Fushimi ,  Hiroshi Makihira ,  Takanori Ninomiya ,  Yasuo Nakagawa

发明人： Shunji Maeda ,  Hitoshi Kubota ,  Satoru Fushimi ,  Hiroshi Makihira ,  Takanori Ninomiya ,  Yasuo Nakagawa

IPC分类号： H01L21/66 ,  G06T7/00 ,  G06K9/00

CPC分类号： G06T7/001 ,  G06T2207/10056 ,  G06T2207/30148

摘要： Method of and apparatus for checking the geometry of multi-layer patterns for IC structures having identical functions, each of the multi-layer patterns including layer patterns arranged in different level layers, wherein electrical image signals corresponding to any two of the multi-layer patterns and having more than two levels are registered with each other and then compared to determine unmatched and matched portions. The comparison of the registered electric image signals may be performed with respect to their amplitude or their gradients. The registration and comparison of two electric image signals may be repeated for all of the layer patterns with the matched portions being no longer subjected to the registration and comparison. A defect detection signal is produced from finally unmatched portions, if any, of the electric image signals having undergone the said registration and comparison.

摘要翻译： 用于检查具有相同功能的IC结构的多层图案的几何形状的方法和装置，每个多层图案包括布置在不同层级中的层图案，其中对应于多层图案中的任何两个的电图像信号 并且具有两个以上的级别彼此登记，然后进行比较以确定不匹配和匹配的部分。 登记的电图像信号的比较可以相对于它们的振幅或梯度进行。 对于所有的层图案，可以对匹配的部分不再进行注册和比较来重复两个电图像信号的配准和比较。 如果有的话，经过所述登记和比较的电子图像信号的最终不匹配的部分产生缺陷检测信号。

公开(公告)号：US4654583A

公开(公告)日：1987-03-31

申请号：US600957

申请日：1984-04-16

申请人： Takanori Ninomiya ,  Yasuo Nakagawa ,  Keiya Saito

发明人： Takanori Ninomiya ,  Yasuo Nakagawa ,  Keiya Saito

IPC分类号： G01N21/956 ,  G06T7/00 ,  G01R15/12 ,  G01B11/00

CPC分类号： G06T7/0006 ,  G01N21/956 ,  G06T2207/30141

摘要： A printed circuit pattern inspection system, in which the optical image of circuit patterns is transformed into an electrical signal, the signal is converted into a binary digital signal, the connectivity relationship between selected two points of pattern in the form of binary signal is examined, connection data representative of the connectivity relationship and expressed by a pair of numbers given to the points is generated, and the connection data is compared with design data which is produced from design information and expressed in the form of a circulation list of numbers given to points in linkage relationship, whereby determination of defectiveness of patterns is made basing on the result of comparison.

摘要翻译： 一种印刷电路图形检查系统，其中电路图案的光学图像被变换为电信号，该信号被转换为二进制数字信号，检查二进制信号形式的所选择的两个点之间的连接关系， 连接数据表示连接关系，并且由给予点的一对数字表示，并将连接数据与从设计信息产生的设计数据进行比较，并以给定给点的数字的循环列表的形式表示 在连接关系中，由此根据比较结果确定图案的缺陷。

公开(公告)号：US4575304A

公开(公告)日：1986-03-11

申请号：US482730

申请日：1983-04-07

申请人： Yasuo Nakagawa ,  Takanori Ninomiya

发明人： Yasuo Nakagawa ,  Takanori Ninomiya

IPC分类号： B25J19/04 ,  B25J9/10 ,  B25J13/08 ,  B25J19/02 ,  G06K9/00 ,  G06K9/20 ,  G06T1/00 ,  B66C1/00

CPC分类号： B25J19/023 ,  B25J9/1015 ,  G06K9/00201 ,  G06K9/2036 ,  G06T1/0014

摘要： The present invention consists in a robot wherein a slit-light detector which is constructed of a light projector for projecting light so as to form a slit-light on an object to-be-handled and an image detector for detecting an image of the light-section waveform, is mounted on an operating member of the robot; means for scanning the slit-light detector is disposed; and the slit-light detector detects range data, on the basis of which a position, posture, inclination etc. of the object in a three-dimensional shape are detected, so that the robot can handle the object.

摘要翻译： 本发明在于一种机器人，其中由用于投射光以在待处理物体上形成狭缝光的投光器构成的狭缝光检测器和用于检测光的图像的图像检测器 分段波形安装在机器人的操作部件上; 布置扫描狭缝光检测器的装置; 并且狭缝光检测器检测范围数据，基于该范围数据检测到三维形状的物体的位置，姿势，倾斜度等，从而机器人可以处理物体。

公开(公告)号：US4772125A

公开(公告)日：1988-09-20

申请号：US875974

申请日：1986-06-19

申请人： Kazushi Yoshimura ,  Takashi Hiroi ,  Takanori Ninomiya ,  Toshimitsu Hamada ,  Yasuo Nakagawa ,  Kohichi Karasaki

发明人： Kazushi Yoshimura ,  Takashi Hiroi ,  Takanori Ninomiya ,  Toshimitsu Hamada ,  Yasuo Nakagawa ,  Kohichi Karasaki

IPC分类号： G01B11/24 ,  G01N21/64 ,  G01N21/88 ,  G01N21/956 ,  G06T7/00

CPC分类号： G06T7/0006 ,  G01N21/95684 ,  G01N2021/95646 ,  G01N21/64 ,  G06T2207/10064 ,  G06T2207/30152

摘要： An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.

摘要翻译： 一种用于检查连接在形成在印刷电路板上的焊盘和电子主体部分的引线之间的焊接部分的外观的装置。 利用从印刷电路板的基板部分产生的荧光图像将狭缝光束引导到要检查和扫描的部分，并且从引线，焊盘和焊接部分产生的暗荧光图像被图像信号检测到 根据其产生。 图像信号被二值化，并且从二值化信号中提取不同的功能，该功能与其他功能相关联使用，并且先前获得的数据用于确定在电路板上的预定位置是否存在异常部分。