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1.发明授权Method for inspecting filled state of via-holes filled with fillers and apparatus for carrying out the method 失效用于检查填充有填充物的通孔的填充状态的方法和用于执行该方法的装置
公开(公告)号：US5015097A
公开(公告)日：1991-05-14
申请号：US416934
申请日：1989-10-04
IPC分类号： G01N21/88 , G01N21/956 , G06T7/00 , H05K3/00 , H05K3/40
CPC分类号： G06T7/0004 , G01N21/95692 , G06T7/604 , G01N2021/95653 , G01N21/8806 , G06T2207/30141
摘要： A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed.The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results. The area of the image of the filler is detected according to differences between the brightness of the board surface or of the via-hole wall and the brightness of the filler in the via-hole in the detected optical image, and whether the filler is lacking or not is decided according to the detection result.
摘要翻译： 公开了一种用于检查通过非导电电路板并填充有导电物质的多个通孔的填充状态的方法和用于实施该方法的装置。 电路板的表面在两个方向上被照亮，以产生取决于多个通孔中的填料的凹凸状态的阴影。 检测电路板的被照射表面的光学图像。 检测存在于所检测的光学图像中并且在两个方向上通过光照射在一个通孔中产生的两个阴影区域的每个边缘。 根据检测到的边缘的相互位置关系来识别该通孔中的填充物是处于凹状还是凸状状态。 检测每个阴影区域的长度，根据检测结果确定填料的凹状或凸状状态是否处于预定的余量内。 根据检测到的光学图像中的基板表面或通孔壁的亮度与通孔中的填充物的亮度之间的差异来检测填充物的图像的面积，以及填充材料是否缺乏 是否根据检测结果决定。
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公开(公告)号：US4872187A
公开(公告)日：1989-10-03
申请号：US156179
申请日：1988-02-16
申请人： Kozo Nakahata , Toshimitsu Hamada , Yasuo Nakagawa , Mineo Nomoto
发明人： Kozo Nakahata , Toshimitsu Hamada , Yasuo Nakagawa , Mineo Nomoto
CPC分类号： G01N23/18 , G01N23/046 , G01N2223/419
摘要： In an X-ray tomographic imaging system and method, an object to be inspected is irradiated with X-rays from an X-ray source to obtain an X-ray transmission image of the object. The X-ray transmission image is converted by an X-ray fluorescence image intensifier into a detection image. The intensity of the detection image is also intensified by the X-ray fluorescence image intensifier. A photo-electric converter converts the intensified detection image from the X-ray fluorescence image intensifier into an electrical signal. The object to be inspected is held by an object holder rotatably at a position in proximity to the X-ray source and movably in a direction of the axis of rotation of the object and a direction perpendicular to the rotation axis. The electrical signal from the photo-electric converter is processed to a cross-sectional image.
摘要翻译： 在X射线层析成像系统和方法中，从X射线源照射X射线检查对象物，得到被检体的X射线透过图像。 通过X射线荧光图像增强器将X射线透射图像转换成检测图像。 X射线荧光图像增强器也增强了检测图像的强度。 光电转换器将强化的检测图像从X射线荧光图像增强器转换成电信号。 待检查对象由物体保持器可旋转地保持在靠近X射线源的位置，并且可沿物体的旋转轴线和垂直于旋转轴线的方向移动。 来自光电转换器的电信号被处理成横截面图像。
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公开(公告)号：US4772125A
公开(公告)日：1988-09-20
申请号：US875974
申请日：1986-06-19
申请人： Kazushi Yoshimura , Takashi Hiroi , Takanori Ninomiya , Toshimitsu Hamada , Yasuo Nakagawa , Kohichi Karasaki
发明人： Kazushi Yoshimura , Takashi Hiroi , Takanori Ninomiya , Toshimitsu Hamada , Yasuo Nakagawa , Kohichi Karasaki
IPC分类号： G01B11/24 , G01N21/64 , G01N21/88 , G01N21/956 , G06T7/00
CPC分类号： G06T7/0006 , G01N21/95684 , G01N2021/95646 , G01N21/64 , G06T2207/10064 , G06T2207/30152
摘要： An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.
摘要翻译： 一种用于检查连接在形成在印刷电路板上的焊盘和电子主体部分的引线之间的焊接部分的外观的装置。 利用从印刷电路板的基板部分产生的荧光图像将狭缝光束引导到要检查和扫描的部分，并且从引线，焊盘和焊接部分产生的暗荧光图像被图像信号检测到 根据其产生。 图像信号被二值化，并且从二值化信号中提取不同的功能，该功能与其他功能相关联使用，并且先前获得的数据用于确定在电路板上的预定位置是否存在异常部分。
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公开(公告)号：US4776023A
公开(公告)日：1988-10-04
申请号：US850681
申请日：1986-04-11
申请人： Toshimitsu Hamada , Mineo Nomoto , Kozo Nakahata
发明人： Toshimitsu Hamada , Mineo Nomoto , Kozo Nakahata
IPC分类号： H04N7/18 , G01N21/956 , G06T7/00 , H01L51/00 , G06K9/64
CPC分类号： G06T7/001 , G01N21/95607 , G06T2207/30148
摘要： Two kinds of image corresponding to a reference pattern and a pattern to be inspected are converted into binary images and local images cut out from the binary images are compared with each other to detect differences between the cut out images and recognize these differences as a defect. One of the main subjects of the inspecting method is to moderate excess sensitivity to the different portions to the extent of allowing non-serious actual defects. By setting don't care areas each of which consists of one pixel row neighboring on a binary boundary line in the image, and comparing the remaining portions of the images other than the don't care areas by logical processing it is possible to detect various defects without regarding the quantization error as a defect.
摘要翻译： 对应于参考图案和待检查图案的两种图像被转换为二进制图像，并且将从二进制图像切出的局部图像彼此进行比较，以检测切出的图像之间的差异并将这些差异识别为缺陷。 检查方法的主要课题之一是对不同部位的过度敏感度进行调节，使得不严重的实际缺陷达到程度。 通过设置不关心区域，每个区域由图像中的二进制边界线上相邻的一个像素行组成，并且通过逻辑处理比较除了无关区域之外的图像的剩余部分，可以检测各种 缺陷而不考虑量化误差作为缺陷。
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公开(公告)号：US4744047A
公开(公告)日：1988-05-10
申请号：US793219
申请日：1985-10-31
申请人： Keiichi Okamoto , Toshimitsu Hamada , Mineo Nomoto
发明人： Keiichi Okamoto , Toshimitsu Hamada , Mineo Nomoto
CPC分类号： G01R31/281
摘要： An apparatus for testing printed wiring patterns for use in combination with an apparatus including a plurality of dedicated pattern generators for generating arcuate wiring patterns. In contrast to the conventional LSI pattern inspection effected with design data being inputted, the apparatus can inspect the pattern including curved portions peculiar to the printed wiring pattern. Although the conventional LSI inspection technique involves an impracticably increased amount of design data, the invention allows the test or inspection to be performed at a high speed with an improved reliability and can be applied to the inspection of any pattern including arcuate patterns. By inputting graphic data in conformance with the order for generating patterns, pattern generation can be accomplished not only through ordinary raster scan but also by other various scanning methods.
摘要翻译： 一种用于测试印刷布线图案的装置，用于与包括用于产生弓形布线图案的多个专用图案发生器的装置组合使用。 与通过输入设计数据进行的常规LSI图案检查相反，该设备可以检查包括印刷布线图案特有的弯曲部分的图案。 虽然传统的LSI检测技术涉及到不切实际地增加的设计数据量，但是本发明允许以高速度提高测试或检查的可靠性，并且可以应用于包括弧形图案的任何图案的检查。 通过根据生成图案的顺序输入图形数据，不仅可以通过普通光栅扫描也可以通过其他各种扫描方法来实现图案生成。
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6.发明授权Inspection method for soldered joints using x-ray imaging and apparatus therefor 失效使用X射线成像的焊接接头的检查方法及其设备
公开(公告)号：US5463667A
公开(公告)日：1995-10-31
申请号：US53240
申请日：1993-04-28
申请人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
发明人： Toshiaki Ichinose , Takanori Ninomiya , Asahiro Kuni , Kozo Nakahata , Toshimitsu Hamada , Toshihiko Ayabe
摘要： A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate. The method may include moving the substrate so as to move the surface of the substrate in an XY plane to position the soldered joint at a desired position in the XY plane, rotating the substrate so as to rotate the surface of the substrate in the XY plane to position the soldered joint at a desired orientation in the XY plane, rotating an X-ray source and a detector about the soldered joint in both of two mutually perpendicular planes perpendicular to the XY plane while maintaining the X-ray source and the detector at fixed positions relative to each other to establish a desired oblique irradiation angle between an X-ray from the X-ray source and the lead on the surface of the substrate, irradiating the soldered joint with the X-ray from the X-ray source at the desired oblique irradiation angle such that the X-ray is transmitted through the soldered joint and the substrate, detecting the X-ray transmitted through the soldered joint and the substrate with the detector, the detector producing an output signal indicative of the detected X-ray, and determining a condition of the soldered joint based on the output signal of the detector. The apparatus may operate in the same fashion.
摘要翻译： 一种用X射线检测焊接接头的方法和装置，所述焊接接头通过将引线焊接到基板的表面而形成。 该方法可以包括移动基板以使基板的表面在XY平面中移动，以将焊接接头定位在XY平面中的期望位置，旋转基板以使基板的表面在XY平面中旋转 将焊接接头定位在XY平面中所需的取向上，使X射线源和检测器围绕焊接接头在与XY平面垂直的两个相互垂直的平面中旋转，同时将X射线源和检测器保持在 固定位置，以建立来自X射线源的X射线与衬底表面上的铅之间的期望的倾斜照射角度，用X射线源的X射线照射焊接接头 所需的倾斜照射角度，使得X射线透射通过焊接接头和基板，通过检测器检测透过焊接接头和基板的X射线，检测器产品 选择表示检测到的X射线的输出信号，以及基于检测器的输出信号确定焊接接头的状态。 该装置可以以相同的方式操作。
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公开(公告)号：US4403294A
公开(公告)日：1983-09-06
申请号：US211113
申请日：1980-11-28
CPC分类号： G01N21/88 , G06T7/001 , G06T2207/30164
摘要： A surface defect inspection system comprises an image pick-up device for picking up an image by sequentially scanning the surface of an object two-dimensionally, a threshold circuit for quantizing the image signal produced from the image pick-up device as a binary code, a pattern feature extracting device for making calculations for extracting the features of image patterns from the quantized signal in synchronism with the scanning, and for temporarily storing the result of the calculations, a pattern region end decision device for deciding that individual pattern regions have ended in one direction, and a defect decision device for reading out from the pattern feature extracting device the result of the calculations on the pattern features corresponding to the positions each of the patterns in the direction perpendicular to the one direction each time of the decision that each pattern region has ended, so that the feature of each pattern scanned is compared with a predetermined reference, thus deciding and an indication of producing the presence or absence of a defect.
摘要翻译： 表面缺陷检查系统包括用于通过二维顺序地扫描对象的表面来拾取图像的图像拾取装置，用于量化由图像拾取装置产生的图像信号作为二进制代码的阈值电路， 图案特征提取装置，用于进行与扫描同步地从量化信号中提取图像图案的特征的计算，并且用于临时存储计算结果;图案区域结束判定装置，用于决定各个图案区域已经结束 一个方向，以及缺陷判定装置，用于从每个图案特征提取装置的每个图案每次都从与图形特征相对应的图案特征相对应的图案特征提取装置读出与每个方向垂直的方向上的位置的计算结果 区域已经结束，使得所扫描的每个图案的特征与预定的裁剪进行比较 因此，决定和产生缺陷的存在或缺失的指示。
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公开(公告)号：US5059559A
公开(公告)日：1991-10-22
申请号：US265704
申请日：1988-11-01
申请人： Michio Takahashi , Tooru Mita , Yasuo Nakagawa , Toshimitsu Hamada , Hisafumi Iwata , Aizo Kaneda , Kouji Serizawa , Hiroyuki Tanaka , Koichi Sugimoto , Toshihiko Sakai , Keizo Matsukawa , Tsutomu Mimata
发明人： Michio Takahashi , Tooru Mita , Yasuo Nakagawa , Toshimitsu Hamada , Hisafumi Iwata , Aizo Kaneda , Kouji Serizawa , Hiroyuki Tanaka , Koichi Sugimoto , Toshihiko Sakai , Keizo Matsukawa , Tsutomu Mimata
IPC分类号： H01L21/00 , H01L21/603
CPC分类号： H01L21/67144 , H01L24/50 , Y10T29/49121
摘要： The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.
摘要翻译： 本发明涉及一种基于TAB（磁带自动接合）系统的多针芯片安装方法和装置，其中形成在磁带上的引线和形成IC芯片的凸起彼此对准并且彼此压接。 在其表面形成有凸起的IC芯片和形成在载带上的内部引线在接合台处彼此相对设置。 通过焊接台的内部引线检测台架上的IC芯片的位置，以确定台阶位置的校正量。 内部引线和IC芯片基于确定的校正量彼此对准，然后彼此结合。
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公开(公告)号：US4226539A
公开(公告)日：1980-10-07
申请号：US863345
申请日：1977-12-22
IPC分类号： G01N21/952 , G06G7/186 , G06G7/48 , G01N21/48
CPC分类号： G01N21/952 , G06G7/1865 , G06G7/48
摘要： An automatic cylindrical body appearance inspection apparatus comprises a cylindrical body appearance detecting device including rotating means for rotating the cylindrical body around its axis at a constant speed and detecting means for optically picking up an image of a cylindrical surface of the cylindrical body rotated by the rotating means and one-dimensionally scanning the image on a plane of real image thereof in a predetermined direction to extract a base line of the cylindrical surface of the cylindrical body as an image signal, an end surface appearance detecting device including a pair of detecting means each for optically picking up an image of each of opposite end surfaces of the cylindrical body and one-dimensionally scanning the image on a plane of real image thereof in a direction transverse to the predetermined direction to extract an image signal, transporting means for transporting the cylindrical body while it is positioned, from the cylindrical surface appearance detecting means to the end surface appearance detecting means and determining means for determining pass or fail or grade of a defect pattern on the surfaces of the cylindrical body based on the image signals derived from the cylindrical surface appearance detecting device and the end surface appearance detecting device, whereby the appearance of the cylindrical surface and the end surfaces of the cylindrical body under test is automatically inspected.
摘要翻译： 一种自动圆柱体外观检查装置，包括：圆筒体外观检测装置，包括用于以恒定速度旋转圆筒体绕其轴线的旋转装置;以及检测装置，用于光学地拾取由旋转的旋转体旋转的圆筒体的圆柱形表面的图像 在预定方向上对其图像的平面进行一维扫描，提取圆筒体的圆筒形表面的基线作为图像信号;端面外观检测装置，其包括一对检测装置 用于光学拾取圆柱体的每个相对端面的图像，并在垂直于预定方向的方向上在其实像平面上一维扫描图像以提取图像信号;传送装置，用于传送圆柱形 身体定位时，从圆柱形表面外观d 基于来自圆筒形外观检测装置和端面外观检测装置的图像信号，确定装置，用于确定圆筒体的表面上的缺陷图形的通过或失败或等级 由此自动检查圆柱形表面和待测筒状体的端面的外观。
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公开(公告)号：US4410278A
公开(公告)日：1983-10-18
申请号：US170181
申请日：1980-07-18
IPC分类号： G01N21/952 , G01N21/55 , G01N21/88
CPC分类号： G01N21/952
摘要： An apparatus for inspecting the outer peripheral surface of a cylindrical object is disclosed, in which the light in slit form is radiated on the surface of an object such as a nuclear fuel pellet at an angle thereto, the light regularly reflected on the surface is detected by a detector, the detected image signal is quantized at threshold values higher and lower than an average level, and the binary signals are used to detect surface losses separately from an unground part and a metal inclusion as a first detection process. The diffused light is radiated onto the surface of the nuclear fuel pellet at an angle thereto, parallel light rays are radiated onto the surface from the direction perpendicular thereto, the light reflected from the surface of the object is detected by a detector from the direction perpendicular to the surface, the detected image signal is quantized at a threshold level lower than an average level of the image signal for the normal surface, and the binary signal is used to detect, as a second detection process, a crack and a pit separately from a chip, said crack, pit or chip included in surface missing defects detected in said first detection process. The surface defects of the nuclear fuel pellet or the like are thus detected by separating them into at least three types including a chip, an unground part and a metal inclusion, and a crack and a pit.
摘要翻译： 公开了一种用于检查圆柱形物体的外周表面的装置，其中狭缝形式的光以与其成角度的核燃料芯片的物体的表面上辐射，检测到表面上规则反射的光 通过检测器，检测到的图像信号在高于和低于平均电平的阈值处被量化，并且二进制信号用于与未接地部分和金属夹杂物分开地检测表面损耗作为第一检测处理。 散射光与核燃料芯块的表面成角度地辐射，平行的光线从与其垂直的方向辐射到表面上，从物体的表面反射的光由检测器从垂直的方向 检测到的图像信号在比正常表面的图像信号的平均电平低的阈值处被量化，并且二进制信号用于作为第二检测处理分别检测裂纹和凹坑 在所述第一检测过程中检测到的表面缺失缺陷中包含的裂纹，凹坑或芯片的芯片。 因此，通过将核燃料粒子等的表面缺陷分离为包括芯片，未研磨部分和金属夹杂物以及裂纹和凹坑中的至少三种类型来检测。
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