Ceramic electronic part and producing method thereof
    1.
    发明授权
    Ceramic electronic part and producing method thereof 失效
    陶瓷电子部件及其制造方法

    公开(公告)号:US5107394A

    公开(公告)日:1992-04-21

    申请号:US675149

    申请日:1991-03-26

    摘要: An external electrode is formed on an outer surface of a ceramic molded product. The external electrode consists of an inner layer and an outer layer. The inner layer is composed of conductive material. The outer layer is composed of conductive material and glass material. In a process for producing the ceramic molded product, first, by molding a ceramic material a molded product is formed. On outer surfaces of the molded product, a conductive paste containing copper or the like is coated. Furthermore, on the conductive paste, a conductive paste containing a glass frit is coated. By baking the molded product onto which these two kinds of conductive paste are coated, ceramic electronic parts having an external electrode of 2-layer structure is obtained.

    摘要翻译: 外部电极形成在陶瓷模制品的外表面上。 外部电极由内层和外层构成。 内层由导电材料构成。 外层由导电材料和玻璃材料组成。 在陶瓷成型体的制造方法中,首先,通过模制陶瓷材料,形成成型体。 在模制产品的外表面上涂覆含有铜等的导电糊。 此外,在导电性糊剂上涂布含有玻璃料的导电性糊剂。 通过烘烤涂覆有这两种导电糊的成型体,得到具有2层结构的外部电极的陶瓷电子部件。

    Dielectric ceramic composition
    2.
    发明授权
    Dielectric ceramic composition 失效
    电介质陶瓷组合物

    公开(公告)号:US5073523A

    公开(公告)日:1991-12-17

    申请号:US578629

    申请日:1990-09-06

    CPC分类号: H01G4/129 C04B35/47 H01B3/12

    摘要: A dielectric ceramic composition consists essentially of 80 to 99.7 wt % of a main component of a system, SrTiO.sub.3 -PbTiO.sub.3 -CaTiO.sub.3 -Bi.sub.2 O.sub.3 -TiO.sub.2 -SnO.sub.2, at least one oxide of rare earth elements incorporated therein as an additive in an amount of 0.1 to 5.0 wt % in terms of Re.sub.2 O.sub.3 (where Re is at least one rare element selected from the group consisting of Nd, La, Ce, Pr and Sm), and 0.2 to 15 wt % of a vitreous component. The main component consists essentially of 20.0 to 50.0 wt % of SrTiO.sub.3, 8.0 to 37.6 wt % of PbTiO.sub.3, 3.2 to 33.9 wt % of CaTiO.sub.3, 4.4 to 35.2 wt % of Bi.sub.2 O.sub.3, 2.5 to 13.6 wt % of TiO.sub.2 and 0.2 to 12.0 wt % of SnO.sub.2. The vitreous component consists essentially of 10 to 45 mol % of Li.sub.2 O, 5 to 40 mol % of at least one oxide selected from the group consisting of BaO, MgO, CaO and SrO, 0.2 to 10 mol % of Al.sub.2 O.sub.3, 30 to 70 mol % of at least two oxide selected from the group consisting of SiO.sub.2, MnO.sub.2 and TiO.sub.2, the content of SiO.sub.2 in the vitreous component being not less than 15 mol % at least, and 1 to 35 mol % of CuO.

    摘要翻译: 电介质陶瓷组合物基本上由80-99.7重量%的体系主要成分SrTiO3-PbTiO3-CaTiO3-Bi2O3-TiO2-SnO2组成,至少一种掺入其中的稀土元素氧化物作为添加剂的量为0.1 以Re 2 O 3(其中,Re为选自Nd,La,Ce,Pr和Sm中的至少一种稀有元素)为5.0重量%,以及0.2〜15重量%的玻璃质成分。 主成分基本上由20.0〜50.0重量%的SrTiO 3,8.0〜37.6重量%的PbTiO 3,3.2〜33.9重量%的CaTiO 3,4.4〜35.2重量%的Bi 2 O 3,2.5〜13.6重量%的TiO 2和0.2〜12.0重量% %的SnO2。 玻璃质成分基本上由10〜45摩尔%的Li 2 O,5〜40摩尔%的选自BaO,MgO,CaO和SrO中的至少一种氧化物,0.2〜10摩尔%的Al 2 O 3,30〜70摩尔 %的至少两种选自SiO 2,MnO 2和TiO 2的氧化物,玻璃状组分中SiO 2的含量至少为15mol%以及1〜35mol%的CuO。

    Reduction reoxidation type semiconductor ceramic condenser
    4.
    发明授权
    Reduction reoxidation type semiconductor ceramic condenser 失效
    还原再氧化型半导体陶瓷电容器

    公开(公告)号:US4533931A

    公开(公告)日:1985-08-06

    申请号:US577020

    申请日:1984-02-06

    CPC分类号: H01G4/1272

    摘要: A reduction reoxidation ceramic semiconductor having a central ceramic portion with a dielectric layer formed thereon by oxidation. The ohmic electrode is formed from a material (e.g. an aluminum-glass frit) that prevents formation of the dielectric layer under the ohmic electrode during reoxidation. The non-ohmic electrode is formed on the dielectric layer.

    摘要翻译: 一种还原再氧化陶瓷半导体,具有通过氧化在其上形成介电层的中心陶瓷部分。 欧姆电极由在再氧化期间防止在欧姆电极下形成电介质层的材料(例如铝 - 玻璃料)形成。 在电介质层上形成非欧姆电极。

    LC composite component
    5.
    发明授权
    LC composite component 失效
    LC复合元件

    公开(公告)号:US4746557A

    公开(公告)日:1988-05-24

    申请号:US939346

    申请日:1986-12-08

    摘要: An LC composite component employing a ceramic sintered body obtained by laminating pluralities of magnetic green sheets and dielectric green sheets and cofiring the same. The ceramic sintered body is provided therein with a magnetic region and a dielectric region along the direction of thickness. The magnetic region of the sintered body is provided with at least one inner electrode layer which extends to first opposite side surfaces of the sintered body, thereby to define an inductance unit. The dielectric region is provided with a plurality of electrodes oppositely arranged through the dielectric substance, which plurality of electrodes includes first and second electrodes. A pair of first outer electrodes are formed on the first side surfaces of the sintered body, to be electrically connected with the inner electrode formed in the magnetic region. The first electrode in the dielectric region is electrically connected with at least one of the first outer electrodes, and the second electrodes is connected with a second outer electrode which is formed on another surface of the sintered body.

    摘要翻译: 使用通过层叠多个磁性生坯片和电介质生片并将其烧结而获得的陶瓷烧结体的LC复合部件。 陶瓷烧结体在其中设置有沿着厚度方向的磁性区域和电介质区域。 烧结体的磁性区域设置有至少一个内部电极层,其延伸到烧结体的第一相对侧表面,由此限定电感单元。 电介质区域设置有多个电极,通过电介质物体相对布置,多个电极包括第一和第二电极。 一对第一外部电极形成在烧结体的第一侧面上,与形成在磁性区域中的内部电极电连接。 电介质区域中的第一电极与第一外电极中的至少一个电连接,第二电极与形成在烧结体的另一表面上的第二外电极连接。

    Complex electronic component
    6.
    发明授权
    Complex electronic component 有权
    复杂的电子元件

    公开(公告)号:US06252778B1

    公开(公告)日:2001-06-26

    申请号:US09177026

    申请日:1998-10-22

    IPC分类号: H05K103

    摘要: The invention provides a complex electronic component, comprising; a multilayer substrate formed by laminating a plurality of dielectric layers; a first concave part being provided at least at the bottom surface of said multilayer substrate; a filter comprising at least one first passive element disposed within said multilayer substrate; an external terminal provided on at least one of the flat portion of the bottom surface and the side face of said multilayer substrate; either one of an active element or a second passive element mounted on the top surface of said multilayer substrate, a surface acoustic wave element mounted inside of said first concave portion of said multilayer substrate; and a flat cap provided at the opening of said first concave portion of said multilayer substrate so as to cover said opening said first concave portion. The size of the above complex electronic component is compact.

    摘要翻译: 本发明提供一种复杂的电子部件,包括: 通过层叠多个电介质层而形成的多层基板; 至少在所述多层基板的底面设置有第一凹部, 过滤器,包括设置在所述多层基板内的至少一个第一无源元件; 设置在所述底面的平坦部分和所述多层基板的侧面中的至少一个上的外部端子; 安装在所述多层基板的上表面上的有源元件或第二无源元件中的任一个,安装在所述多层基板的所述第一凹部内的表面声波元件; 以及设置在所述多层基板的所述第一凹部的开口处的盖,以便覆盖所述开口的所述第一凹部。上述复杂电子部件的尺寸是紧凑的。

    High-frequency filter, with an inductor for forming a pole, complex
electronic component using the same, and portable radio apparatus using
the same
    7.
    发明授权
    High-frequency filter, with an inductor for forming a pole, complex electronic component using the same, and portable radio apparatus using the same 失效
    高频滤波器,具有用于形成极点的电感器,使用该电感器的复合电子部件以及使用其的便携式无线电装置

    公开(公告)号:US6069541A

    公开(公告)日:2000-05-30

    申请号:US40950

    申请日:1998-03-18

    CPC分类号: H03H7/0123 H03H2001/0085

    摘要: A high-frequency filter 10 serving as a bandpass filter has three transmission lines SL11 to SL13 side-coupled in three stages. The transmission lines SL11 to SL13 are respectively connected in parallel to capacitors C11 to C13. One end of the input transmission line SL11 is connected to an input terminal Pi through an input capacitor C14. One end of the output transmission line SL13 is connected to an output terminal Po through an output capacitor C15. The other ends of the transmission lines SL11 and SL13 are connected and the connection point is connected to the ground through an inductor Lg for forming a pole in the transmission characteristic of the high-frequency filter. One end of the transmission line SL12 is connected to the ground.

    摘要翻译: 用作带通滤波器的高频滤波器10具有三个三相侧耦合的传输线SL11至SL13。 传输线SL11至SL13分别与电容器C11至C13并联连接。 输入传输线SL11的一端通过输入电容器C14连接到输入端子Pi。 输出传输线SL13的一端通过输出电容器C15连接到输出端子Po。 传输线SL11和SL13的另一端连接,并且连接点通过用于形成高频滤波器的传输特性中的极点的电感器Lg连接到地。 传输线SL12的一端连接到地面。

    Mobile image apparatus and an antenna apparatus used for the mobile
image apparatus
    9.
    发明授权
    Mobile image apparatus and an antenna apparatus used for the mobile image apparatus 失效
    移动图像装置和用于移动图像装置的天线装置

    公开(公告)号:US6028554A

    公开(公告)日:2000-02-22

    申请号:US35522

    申请日:1998-03-05

    摘要: The invention provides a mobile image apparatus (10), comprising: a case unit (11); at least one antenna (12) disposed at least one of within said case unit (11) and outside said case unit (11); wherein said chip antenna (12) comprises; a substrate (1) made of at least one of a dielectric material and a magnetic material; at least one conductor (2) disposed at least one of within said substrate (1) and on a surface of said substrate (1); at least one power feeding terminal (3) disposed on a surface of said substrate (1) and connected to one end of said conductor (2) for applying a voltage to said conductor (2).

    摘要翻译: 本发明提供了一种移动图像装置(10),包括:壳体单元(11); 至少一个天线(12),其设置在所述壳体单元(11)内和所述壳体单元(11)的外部中的至少一个上; 其中所述芯片天线(12)包括: 由介电材料和磁性材料中的至少一种制成的基片(1); 至少一个导体(2)设置在所述衬底(1)内和所述衬底(1)的表面上的至少一个上; 至少一个供电端子(3),设置在所述基板(1)的表面上并且连接到所述导体(2)的一端,用于向所述导体(2)施加电压。

    Chip antenna
    10.
    发明授权
    Chip antenna 失效
    芯片天线

    公开(公告)号:US5977927A

    公开(公告)日:1999-11-02

    申请号:US794976

    申请日:1997-02-05

    CPC分类号: H01Q1/38 H01Q1/362

    摘要: A chip antenna in which correct evaluation and inspection of a conductor can be performed regardless of the state of grounding. The chip antenna has a rectangular-prism-shaped substrate formed of a dielectric material comprising, e.g., barium oxide, aluminum oxide and silica. A copper or copper-alloy conductor is spirally wound within the substrate in the longitudinal direction. A feeding terminal for applying a voltage to the conductor and a free terminal are disposed on the surfaces of the conductor. One end of the conductor is attached to the feeding terminal, while the other end is connected to the free terminal.

    摘要翻译: 无论接地状态如何,均可进行正确的导体评估和检查的芯片天线。 芯片天线具有由包括例如氧化钡,氧化铝和二氧化硅的电介质材料形成的矩形棱柱形基板。 铜或铜合金导体沿纵向螺旋缠绕在基板内。 用于向导体施加电压的馈电端子和自由端子设置在导体的表面上。 导体的一端连接到馈电端子,而另一端连接到自由端子。