公开(公告)号：US07127726B2

公开(公告)日：2006-10-24

申请号：US10394140

申请日：2003-03-24

申请人： Yasuyuki Tobishima ,  Yasuharu Nakamura ,  Akira Shimizu

发明人： Yasuyuki Tobishima ,  Yasuharu Nakamura ,  Akira Shimizu

IPC分类号： G11B17/03

CPC分类号： H04B1/082 ,  B60R11/0205 ,  B60R11/0211

摘要： An electronics instrument 1 includes an instrument body, an operation display unit and a driving mechanism. The driving mechanism moves the operation display unit over the span between a first position where the insertion inlet of the instrument body is covered and a second position where the insertion inlet is opened. The driving mechanism is provided with a helical torsion coil spring 30. At the first position, the helical torsion coil spring 30 urges the operation display unit toward the second position. At the second position, the helical torsion coil spring 30 urges the operation display unit toward the first position. This configuration suppresses the sound generated when the operation display unit of a cover is located at a first position where the one surface of the instrument body is covered and a second position where at least a part of the one surface is opened.

摘要翻译： 电子仪器1包括仪器主体，操作显示单元和驱动机构。 所述驱动机构使所述操作显示单元在所述仪表主体的插入口被覆盖的第一位置与所述插入口打开的第二位置之间跨越所述跨度。 驱动机构设置有螺旋扭力螺旋弹簧30。 在第一位置，螺旋扭力螺旋弹簧30将操作显示单元推向第二位置。 在第二位置，螺旋扭力螺旋弹簧30将操作显示单元向第一位置推压。 该结构抑制当盖的操作显示单元位于器械主体的一个表面被覆盖的第一位置处的声音和一个表面的至少一部分被打开的第二位置时产生的声音。

公开(公告)号：US06791844B2

公开(公告)日：2004-09-14

申请号：US10394195

申请日：2003-03-24

申请人： Yasuyuki Tobishima ,  Yasuharu Nakamura ,  Akira Shimizu

发明人： Yasuyuki Tobishima ,  Yasuharu Nakamura ,  Akira Shimizu

IPC分类号： H05K500

CPC分类号： B60R11/0211 ,  B60R11/0205 ,  H04B1/082

摘要： An electronic instrument has an instrument body 2, an operation unit 3, and an engagement link 4. The engagement link 4 removably attaches the operation unit 3 to the instrument body 2. The engagement link 4 has a first joint member 22 and a second joint member 23. The first joint member 22 engages with a lower end 3a of the operation unit 3. The second joint member engages with an upper end 3b of the operation unit 3. The link mechanism moves the second joint member 23 to release the second joint member 23 from the upper end 3b when the first joint member 22 moves toward an engaging position of the first joint member 22 with the lower end 3a. The link mechanism can move the second joint member 23 to engage with the upper end 3b while the first joint member 22 has been engaged with the lower end 3a.

摘要翻译： 电子乐器具有乐器主体2，操作单元3和接合连杆4.接合连杆4将操作单元3可拆卸地附接到乐器主体2.接合连杆4具有第一接合构件22和第二接头 构件23.第一接合构件22与操作单元3的下端3a接合。第二接头构件与操作单元3的上端3b接合。连杆机构移动第二接头构件23以释放第二接头 当第一接合构件22朝向第一接头构件22与下端3a的接合位置移动时，从上端3b的构件23。 连接机构可以使第二接头构件23与第一接头构件22与下端3a接合而与上端3b接合。

公开(公告)号：US07304836B2

公开(公告)日：2007-12-04

申请号：US10791558

申请日：2004-03-03

申请人： Yasuharu Nakamura ,  Takahiro Sasaki ,  Akira Shimizu

发明人： Yasuharu Nakamura ,  Takahiro Sasaki ,  Akira Shimizu

IPC分类号： G06F1/16

CPC分类号： B60R11/02 ,  B60R11/0235

摘要： As an electronic apparatus in which a drive power source for generating a drive force to move a movable portion moving freely can be miniaturized, an multi-function electronic apparatus 1 has a main body 2, an operation and display unit 3 as a movable portion, a drive mechanism 4, the first and second pushing units, a guide groove 19 and a slide groove 21. The drive mechanism 4 has a movable arm 15 as a movable portion. The first and second pushing units push the operation and display unit 3 and the movable arm 15. The guide groove 19 and the slide groove 21 change the pushing forces of the first and second pushing units between the first position and the second position.

摘要翻译： 作为用于产生用于使可移动部分移动自由移动的驱动力的驱动电源的电子设备可以小型化，多功能电子设备1具有作为可移动部分的主体2，操作和显示单元3， 驱动机构4，第一和第二推动单元，引导槽19和滑动槽21。 驱动机构4具有作为可动部的可动臂15。 第一和第二按压单元推动操作和显示单元3和可动臂15。 引导槽19和滑动槽21改变第一和第二推动单元在第一位置和第二位置之间的推力。

公开(公告)号：US06986672B2

公开(公告)日：2006-01-17

申请号：US10792577

申请日：2004-03-04

申请人： Takahiro Sasaki ,  Yasuharu Nakamura ,  Akira Shimizu

发明人： Takahiro Sasaki ,  Yasuharu Nakamura ,  Akira Shimizu

IPC分类号： H01R4/66

CPC分类号： H01R4/64 ,  H01R12/592 ,  H01R13/6582 ,  H01R13/6596

摘要： A multifunctional electronic instrument includes a body of the electronic instrument, an operation display unit movably provided on the body of the electronic instrument, and a ground structure as an electric contact structure, which includes a parallel part and a contact spring piece. The parallel part includes an electrically conductive base material and an electrically insulating surface layer formed on surfaces of both sides of the base material, and is attached to a movable member that moves together with the operation display unit. The parallel part is provided with a projection. At an end of the projection, the base material is exposed in a ruptured part where the surface layer is ruptured. The ruptured part is provided with an electric contact. The contact spring piece comes in contact with the electric contact. The base material of the parallel part and the contact spring piece are electrically connected to each other.

摘要翻译： 多功能电子仪器包括电子仪器的主体，可移动地设置在电子仪器的主体上的操作显示单元和作为电接触结构的接地结构，其包括平行部分和接触弹簧片。 平行部分包括导电基材和形成在基材两面的表面上的电绝缘表面层，并且附接到与操作显示单元一起移动的可移动部件。 平行部分设置有突起。 在突起的末端，基材在表面层破裂的破裂部分中露出。 破裂部分设有电接点。 触点弹簧片与电触点接触。 平行部件和接触弹簧片的基材彼此电连接。

公开(公告)号：US07692102B2

公开(公告)日：2010-04-06

申请号：US11195719

申请日：2005-08-03

申请人： Yoshiteru Kawakami ,  Yasuharu Nakamura

发明人： Yoshiteru Kawakami ,  Yasuharu Nakamura

IPC分类号： H05K1/00

CPC分类号： H05K1/147 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H05K1/144 ,  H05K1/145 ,  H05K3/361 ,  H05K2201/2036 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic circuit device includes at least two circuit substrates for mounting electronic components and a flexible board for external electrical connection disposed between the circuit substrates. The flexible board is electrically connected to at least the surface of one circuit substrate opposed to another circuit substrate.

摘要翻译： 电子电路装置包括用于安装电子部件的至少两个电路基板和设置在电路基板之间的用于外部电连接的柔性板。 柔性板至少与一个电路基板的与另一个电路基板相对的表面电连接。

公开(公告)号：US4885185A

公开(公告)日：1989-12-05

申请号：US305980

申请日：1989-02-03

申请人： Kiyoshi Kitazume ,  Yasuharu Nakamura ,  Hiromichi Ochiai ,  Hisashi Nozaki

发明人： Kiyoshi Kitazume ,  Yasuharu Nakamura ,  Hiromichi Ochiai ,  Hisashi Nozaki

IPC分类号： A23C11/10 ,  A23L11/00 ,  A23L11/30

CPC分类号： A23C11/103 ,  A23L11/31

摘要： Soybean milk from which grassy-smell and trypsin inhibitor have substantially been eliminated is prepared by crushing soybean at a temperature of 85.degree. C. or higher, maintaining the resulting crushed slurry at an elevated temperature, grinding the slurry, removing bean-curd (tofu) refuse from the slurry, and sterilizing the resulting soybean milk in a plate-type sterilizer.

摘要翻译： 通过在85℃或更高的温度下对大豆进行破碎来制备草嗅和胰蛋白酶抑制剂已经被消除的豆浆，将得到的破碎浆保持在高温下，研磨浆料，除去豆腐（豆腐 ）从浆料中拒绝，并将得到的豆浆在板式灭菌器中灭菌。

公开(公告)号：US4162161A

公开(公告)日：1979-07-24

申请号：US822764

申请日：1977-08-08

申请人： Isao Shimamura ,  Yasuharu Nakamura

发明人： Isao Shimamura ,  Yasuharu Nakamura

IPC分类号： G03C7/00 ,  G03C5/50 ,  G03C7/30

CPC分类号： G03C5/50

摘要： A reversal color photographic process which comprises subjecting an exposed silver halide color photographic light-sensitive material to a first black-and-white development and then (a) color developing the light-sensitive material with a color developing solution containing a water-soluble stannous salt and a phosphonocarboxylic acid compound or (b) processing the light-sensitive material with a fogging bath containing a water-soluble stannous salt and a phosphonocarboxylic acid compound and then color developing the light-sensitive material, the phosphonocarboxylic acid compound being represented by the general formula (I): ##STR1## wherein R.sub.1 is --COOM' or --PO(OM).sub.2 ;R.sub.2 is a hydrogen atom, an alkyl group containing 1 to 4 carbon atoms, --(CH.sub.2).sub.n COOM' or a phenyl group;R.sub.3 is a hydrogen atom or --COOM';M and M', which may be the same or different, each is a hydrogen atom, an alkali metal atom or an ammonium group;M is 0 or 1; andN is 1 to 4.

摘要翻译： 一种反转彩色照相方法，其包括将暴露的卤化银彩色摄影感光材料进行第一次黑白显影，然后（a）用含有水溶性亚锡的彩色显影液彩色显影感光材料 盐和膦酰基羧酸化合物，或者（b）用含有水溶性亚锡盐和膦酰基羧酸化合物的雾化浴处理感光材料，然后使感光材料显色，膦酰基羧酸化合物由 通式（I）：其中R 1是-COOM'或-PO（OM）2; R2是氢原子，含有1至4个碳原子的烷基， - （CH2）nCOOM'或苯基; R3是氢原子或-COOM'; M和M'可以相同或不同，分别为氢原子，碱金属原子或铵基; M IS 0或1; 而且是1至4。

公开(公告)号：US07298047B2

公开(公告)日：2007-11-20

申请号：US11195818

申请日：2005-08-03

申请人： Yoshiteru Kawakami ,  Yasuharu Nakamura

发明人： Yoshiteru Kawakami ,  Yasuharu Nakamura

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K1/144 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/467 ,  H01L23/49833 ,  H01L23/5385 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/16195 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0272 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/064 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2203/063 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic circuit device includes at least a first substrate and a second substrate, a spacer substrate interposed between the first substrate and the second substrate, an electronic component interposed between the first substrate and the second substrate, and at least one through-hole formed on the second circuit substrate opposing the first circuit substrate. The spacer substrate mutually connects the first substrate and the second substrate. The electronic component is connected to the first circuit substrate with the active surface of the electronic component. The through-hole penetrates from a first surface of the second circuit substrate opposing the first substrate to a second surface of the second circuit substrate. The first circuit substrate is connected to the electronic component.

摘要翻译： 电子电路装置至少包括第一基板和第二基板，插入在第一基板和第二基板之间的间隔基板，插入在第一基板和第二基板之间的电子部件，以及至少一个通孔，其形成在 所述第二电路基板与所述第一电路基板相对。 间隔基板相互连接第一基板和第二基板。 电子部件与电子部件的有源面连接到第一电路基板。 通孔从与第一基板相对的第二电路基板的第一表面穿透到第二电路基板的第二表面。 第一电路基板连接到电子部件。

公开(公告)号：US5847458A

公开(公告)日：1998-12-08

申请号：US858846

申请日：1997-05-19

申请人： Yasuharu Nakamura ,  Akiyoshi Nakamura

发明人： Yasuharu Nakamura ,  Akiyoshi Nakamura

IPC分类号： H01L21/48 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H05K3/34 ,  H01L23/00 ,  H01L23/28 ,  H01L23/48

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/48 ,  H05K3/3426 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  Y02P70/613

摘要： A semiconductor device package includes a plurality of leads and a stage, for mounting a semiconductor chip, arranged in juxtaposition at predetermined spatial intervals. A protruding terminal is formed at a predetermined portion on the lower surface of each of the leads. An insulating material is deposited in a continuous layer on the upper surfaces and the side surfaces of a plurality of the leads and on the side surfaces of the stage. A plurality of the leads and the stage are integrally coupled to each other through the insulating material and, therefore, the upper surfaces of the leads, the upper surface of the stage for bonding a semiconductor chip, and the terminals on the lower surfaces of the leads are exposed outside the insulating material. A semiconductor chip is bonded on the upper surface of the stage, the electrodes of the chip are electrically connected to the terminals on the upper surfaces of the leads, and the upper surface of the stage and the upper surfaces of the leads are deposited with a sealing insulating material thereby to seal the semiconductor chip in the sealing material.

摘要翻译： 半导体器件封装包括多个引线和用于安装以预定空间间隔并置布置的半导体芯片的平台。 突出端子形成在每个引线的下表面上的预定部分。 绝缘材料沉积在多个引线的上表面和侧表面上以及台的侧表面上的连续层中。 多个引线和台架通过绝缘材料彼此整体地连接，因此引线的上表面，用于接合半导体芯片的载物台的上表面，以及引线的下表面上的端子 引线暴露在绝缘材料外面。 半导体芯片接合在台的上表面上，芯片的电极与引线的上表面上的端子电连接，并且引线的上表面和引线的上表面沉积有 密封绝缘材料，从而密封密封材料中的半导体芯片。

公开(公告)号：US3982044A

公开(公告)日：1976-09-21

申请号：US593337

申请日：1975-07-03

申请人： Junichi Matsuyama ,  Yoshiyuki Nakazawa ,  Yasuharu Nakamura ,  Reiichi Ohi ,  Tokiharu Kondo, deceased ,  by Yoshiharu Kondo, legal representative

发明人： Junichi Matsuyama ,  Yoshiyuki Nakazawa ,  Yasuharu Nakamura ,  Reiichi Ohi ,  Tokiharu Kondo, deceased ,  by Yoshiharu Kondo, legal representative

IPC分类号： G01T1/08 ,  G03C1/10 ,  B05D3/06

CPC分类号： G03C1/10 ,  G01T1/08 ,  Y10S430/143

摘要： Fine grain silver halide photographic emulsions adapted for electron beam recording containing at least one compound represented by the following formula; ##SPC1##Wherein A represents an aliphatic group (substituted or unsubstituted), preferably an alkyl group, a substituted alkyl group, an aryl group, a substituted aryl group or a 5- or 6-membered heterocyclic ring containing at least one nitrogen atom, R.sub.1 and R.sub.2 represent a hydrogen atom or a lower alkyl group, and n represents 0 or 1.

摘要翻译： 适用于电子束记录的细粒卤化银照相乳剂，含有至少一种下式表示的化合物; 其中A表示脂族基团（取代或未取代的），优选烷基，取代的烷基，芳基，取代的芳基或含有至少一个氮原子的5或6元杂环，R 1和R 2 表示氢原子或低级烷基，n表示0或1。