公开(公告)号：US07089525B2

公开(公告)日：2006-08-08

申请号：US10688975

申请日：2003-10-21

申请人： Yoichi Tamaki ,  Takayuki Iwasaki ,  Kousuke Tsuji ,  Chiyoshi Kamada

发明人： Yoichi Tamaki ,  Takayuki Iwasaki ,  Kousuke Tsuji ,  Chiyoshi Kamada

IPC分类号： G06F17/50

CPC分类号： H01L27/1203 ,  H01L21/76264 ,  H01L21/76267 ,  H01L21/76275 ,  H01L21/76283 ,  H01L21/84 ,  H01L29/7317

摘要： The number of design processes for fabricating semiconductor devices can be reduced by parallel connection of a plurality of unit bipolar transistors Qu that are completely electrically isolated from each other in a semiconductor layer of an SOI substrate 1 to form a bipolar transistor having a large current capacity.

公开(公告)号：US06662344B2

公开(公告)日：2003-12-09

申请号：US10092594

申请日：2002-03-08

申请人： Yoichi Tamaki ,  Takayuki Iwasaki ,  Kousuke Tsuji ,  Chiyoshi Kamada

发明人： Yoichi Tamaki ,  Takayuki Iwasaki ,  Kousuke Tsuji ,  Chiyoshi Kamada

IPC分类号： G06F1750

CPC分类号： H01L27/1203 ,  H01L21/76264 ,  H01L21/76267 ,  H01L21/76275 ,  H01L21/76283 ,  H01L21/84 ,  H01L29/7317

摘要： The number of design processes for fabricating semiconductor devices can be reduced by parallel connection of a plurality of unit bipolar transistors Qu that are completely electrically isolated from each other in a semiconductor layer of an SOI substrate 1 to form a bipolar transistor having a large current capacity.

公开(公告)号：US06603807B1

公开(公告)日：2003-08-05

申请号：US09259058

申请日：1999-02-26

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H01L2900

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： An isolator is made monolithic by forming a capacitive insulating barrier using an interlayer insulation film on the semiconductor substrate to miniaturize the modem device by the monolithic isolator.

摘要翻译： 隔离器通过在半导体衬底上形成使用层间绝缘膜的电容绝缘屏障来制成单片，以通过单片隔离器使调制解调器装置小型化。

公开(公告)号：US07522692B2

公开(公告)日：2009-04-21

申请号：US11714856

申请日：2007-03-07

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H04L23/00 ,  H04B1/38 ,  H01L29/00

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.

摘要翻译： 提供一种通信系统，包括收发机和应用控制器，用于通过收发信机发送和接收信号。 绝缘和分离收发器和应用控制器的隔离器包括在基板上彼此绝缘的初级和次级侧电路和用于在初级侧和第二侧之间传递信号的电容绝缘装置，同时将初级侧电路与次级侧隔离 电路。

公开(公告)号：US07289553B2

公开(公告)日：2007-10-30

申请号：US10377670

申请日：2003-03-04

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H04B1/38 ,  H01L29/00

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.

公开(公告)号：US20070153886A1

公开(公告)日：2007-07-05

申请号：US11714856

申请日：2007-03-07

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H04L5/16

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.

摘要翻译： 提供一种通信系统，包括收发机和应用控制器，用于通过收发信机发送和接收信号。 绝缘和分离收发器和应用控制器的隔离器包括在基板上彼此绝缘的初级和次级侧电路和用于在初级侧和第二侧之间传递信号的电容绝缘装置，同时将初级侧电路与次级侧隔离 电路。

公开(公告)号：US20110274555A1

公开(公告)日：2011-11-10

申请号：US13145015

申请日：2010-01-22

申请人： Takayuki Iwasaki

发明人： Takayuki Iwasaki

IPC分类号： F01D5/14 ,  B23P15/02

CPC分类号： B21D53/78 ,  B21D26/021 ,  B21D26/055 ,  B23K3/04 ,  B23K20/02 ,  B23K20/023 ,  B23P15/04 ,  F01D5/147 ,  F04D29/023 ,  F04D29/324 ,  F04D29/388 ,  F05D2230/237 ,  F05D2240/303 ,  F05D2300/43 ,  F05D2300/702 ,  Y02T50/673 ,  Y10T29/49337

摘要： A production method uses ultrasonic forming but does not leave a bonding face exposed to the exterior in a final product.The production method of a leading edge member of a fan blade comprises the steps of causing superplastic forming by using a combination of a first mold having a flow path for gas and a second mold having a female mold to pressurize a plate member with the gas through the flow path to fit the plate member onto the female mold; bonding a backing with the plate member processed with the superplastic forming; and cutting out a periphery of the plate member to obtain a product shape.

摘要翻译： 一种制造方法使用超声波成形，但是在最终产品中不会留下暴露于外部的接合面。 风扇叶片的前缘构件的制造方法包括以下步骤：通过使用具有气体流路的第一模具和具有阴模的第二模具的组合来引起超塑性成形，以使气体通过板构件加压 将板构件配合到阴模上的流动路径; 将背衬与用超塑性成形加工的板构件接合; 并且切割板构件的周边以获得产品形状。

公开(公告)号：US20110274551A1

公开(公告)日：2011-11-10

申请号：US13145350

申请日：2010-01-22

申请人： Takayuki Iwasaki

发明人： Takayuki Iwasaki

IPC分类号： F03B3/12 ,  B23P15/02

CPC分类号： B21D53/78 ,  B21D26/049 ,  B21D26/055 ,  B23P15/04 ,  F01D5/147 ,  F04D29/023 ,  F04D29/324 ,  F04D29/388 ,  F05D2230/10 ,  F05D2230/23 ,  F05D2240/303 ,  F05D2300/702 ,  Y02T50/673 ,  Y10T29/49336 ,  Y10T29/49805

摘要： A production method enables use of ultrasonic forming but does not leave a bonding face in a final product.One cuts into a plate member having a first side face and a second side face from the first side face toward the second side face to form a slit that does not reach the second side face; seals lips of the slit to leave an opening; causes superplastic forming of the plate member by pressurizing the plate member in a mold with gas through the opening; and cuts out a portion including the sealed lips.

摘要翻译： 一种制造方法能够使用超声波成形，但不会在最终产品中留下接合面。 一个切割成具有从第一侧面朝向第二侧面的第一侧面和第二侧面的板构件，以形成不到达第二侧面的狭缝; 密封狭缝的嘴唇留下开口; 通过使气体通过开口对模具中的板构件加压来引起板构件的超塑性成形; 并切出包括密封唇部的部分。

公开(公告)号：US07093473B2

公开(公告)日：2006-08-22

申请号：US10886087

申请日：2004-07-08

申请人： Hisashi Honjo ,  Takayuki Iwasaki

发明人： Hisashi Honjo ,  Takayuki Iwasaki

IPC分类号： B21B29/00

CPC分类号： B21B27/02 ,  B21B1/026 ,  B21B1/463 ,  B21B13/142 ,  B21B29/00 ,  B21B2001/028 ,  B21B2013/025 ,  B21B2027/022 ,  B21B2263/02 ,  B21B2269/04 ,  B21B2269/14

摘要： An apparatus for manufacturing a band plate has a rolling mill that includes a pair of upper and lower work rolls that roll a slab material having edge drop portions at both ends thereof, and a pair of backup rolls that contact non-rolling side surfaces of the pair of upper and lower work rolls, respectively to prevent the work rolls from being deformed. The work roll includes a reverse taper portion where a roll diameter gradually increases towards a barrel end portion thereof corresponding to the edge drop portion. The upper and lower work rolls are configured to be shiftable individually in the axial direction thereof. The backup roll includes an escape portion whose diameter gradually decreases towards an axial end thereof so as not to contact the reverse taper portion of the work roll, within a shifting range of the work roll.

摘要翻译： 一种用于制造带板的装置具有一个轧机，该轧机包括一对上下工作轧辊，其在其两端滚动具有边缘部分的板坯材料，以及一对支承辊，其与 一对上下工作辊分别用于防止工作辊变形。 工作辊包括反向锥形部分，其中辊直径朝着与边缘落下部分相对的筒端部逐渐增大。 上下工作辊被构造成在其轴向方向上单独移动。 支承辊包括在工作辊的移动范围内其直径朝着其轴向端部逐渐减小以避免与工作辊的倒锥形部分接触的退出部分。

公开(公告)号：US20140037940A1

公开(公告)日：2014-02-06

申请号：US14009281

申请日：2012-03-27

申请人： Tetsuo Fujimura ,  Hisatsugu Tokunaga ,  Yusuke Tanazawa ,  Takeshi Ono ,  Tomoharu Watanabe ,  Akira Sasaki ,  Takayuki Iwasaki ,  Kazuya Sugimoto

发明人： Tetsuo Fujimura ,  Hisatsugu Tokunaga ,  Yusuke Tanazawa ,  Takeshi Ono ,  Tomoharu Watanabe ,  Akira Sasaki ,  Takayuki Iwasaki ,  Kazuya Sugimoto

IPC分类号： B65D43/02

CPC分类号： B65D43/02 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/327 ,  B32B27/34 ,  B32B27/36 ,  B32B2250/04 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/20 ,  B32B2307/202 ,  B32B2307/308 ,  B32B2439/00 ,  Y10T428/256 ,  Y10T428/265 ,  Y10T428/2826

摘要： A cover film including, at least, (A) a substrate layer, (B) an intermediate layer, (C) a release layer and (D) a heat seal layer is provided. The release layer (C) includes a resin composition which includes (a) a styrene-based resin composition and (b) an ethylene-α-olefin random copolymer, with the content of the copolymer (b) in the release layer being 20 to 50 mass %, and which has a Vicat softening temperature of 55 to 80° C., while the heat seal layer (D) includes an acrylic resin having a glass transition temperature of 55 to 80° C. By the cover film, a carrier tape of polystyrene or the like can be so heat-sealed even in a short time as to achieve sufficient peel strength. Further, the resulting heat-sealed carrier tape exhibits little variation in peel strength, so that when peeling, few components fly out of the carrier tape.

摘要翻译： 提供至少包括（A）基底层，（B）中间层，（C）剥离层和（D）热封层）的覆盖膜。 剥离层（C）包括树脂组合物，其包含（a）苯乙烯类树脂组合物和（b）乙烯-α-烯烃无规共聚物，脱模层中共聚物（b）的含量为20〜 50质量％，并且维卡软化温度为55〜80℃，而热封层（D）包含玻璃化转变温度为55〜80℃的丙烯酸树脂。通过覆盖膜，载体 聚苯乙烯等的胶带即使在短时间内也可以如此热密封，以达到足够的剥离强度。 此外，所得到的热封载带的剥离强度几乎不变化，因此剥离时，少量成分从载带中飞出。