公开(公告)号：US06603807B1

公开(公告)日：2003-08-05

申请号：US09259058

申请日：1999-02-26

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H01L2900

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： An isolator is made monolithic by forming a capacitive insulating barrier using an interlayer insulation film on the semiconductor substrate to miniaturize the modem device by the monolithic isolator.

摘要翻译： 隔离器通过在半导体衬底上形成使用层间绝缘膜的电容绝缘屏障来制成单片，以通过单片隔离器使调制解调器装置小型化。

公开(公告)号：US07522692B2

公开(公告)日：2009-04-21

申请号：US11714856

申请日：2007-03-07

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H04L23/00 ,  H04B1/38 ,  H01L29/00

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.

摘要翻译： 提供一种通信系统，包括收发机和应用控制器，用于通过收发信机发送和接收信号。 绝缘和分离收发器和应用控制器的隔离器包括在基板上彼此绝缘的初级和次级侧电路和用于在初级侧和第二侧之间传递信号的电容绝缘装置，同时将初级侧电路与次级侧隔离 电路。

公开(公告)号：US07289553B2

公开(公告)日：2007-10-30

申请号：US10377670

申请日：2003-03-04

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H04B1/38 ,  H01L29/00

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.

公开(公告)号：US20070153886A1

公开(公告)日：2007-07-05

申请号：US11714856

申请日：2007-03-07

申请人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

发明人： Seigoh Yukutake ,  Yasuyuki Kojima ,  Minehiro Nemoto ,  Masatsugu Amishiro ,  Takayuki Iwasaki ,  Shinichiro Mitani ,  Katsuhiro Furukawa ,  Chiyoshi Kamada ,  Atsuo Watanabe ,  Takayuki Oouchi ,  Nobuyasu Kanekawa

IPC分类号： H04L5/16

CPC分类号： H04L25/0266 ,  H01L2924/0002 ,  H04L25/0268 ,  H04L25/0272 ,  H04L25/028 ,  H04L25/0292 ,  H04L27/0002 ,  H04M11/06 ,  H01L2924/00

摘要： A communication system is provided including a transceiver and an application controller to transmit and receive signals through the transceiver. An isolator which insulates and separates the transceiver and application controller includes primary and secondary side circuits insulated from each other on a substrate and a capacitive insulating means to transfer signals between the primary and second sides while insulating and separating the primary side circuit from the secondary side circuit.

摘要翻译： 提供一种通信系统，包括收发机和应用控制器，用于通过收发信机发送和接收信号。 绝缘和分离收发器和应用控制器的隔离器包括在基板上彼此绝缘的初级和次级侧电路和用于在初级侧和第二侧之间传递信号的电容绝缘装置，同时将初级侧电路与次级侧隔离 电路。

公开(公告)号：US06662344B2

公开(公告)日：2003-12-09

申请号：US10092594

申请日：2002-03-08

申请人： Yoichi Tamaki ,  Takayuki Iwasaki ,  Kousuke Tsuji ,  Chiyoshi Kamada

发明人： Yoichi Tamaki ,  Takayuki Iwasaki ,  Kousuke Tsuji ,  Chiyoshi Kamada

IPC分类号： G06F1750

CPC分类号： H01L27/1203 ,  H01L21/76264 ,  H01L21/76267 ,  H01L21/76275 ,  H01L21/76283 ,  H01L21/84 ,  H01L29/7317

摘要： The number of design processes for fabricating semiconductor devices can be reduced by parallel connection of a plurality of unit bipolar transistors Qu that are completely electrically isolated from each other in a semiconductor layer of an SOI substrate 1 to form a bipolar transistor having a large current capacity.

公开(公告)号：US07089525B2

公开(公告)日：2006-08-08

申请号：US10688975

申请日：2003-10-21

申请人： Yoichi Tamaki ,  Takayuki Iwasaki ,  Kousuke Tsuji ,  Chiyoshi Kamada

发明人： Yoichi Tamaki ,  Takayuki Iwasaki ,  Kousuke Tsuji ,  Chiyoshi Kamada

IPC分类号： G06F17/50

CPC分类号： H01L27/1203 ,  H01L21/76264 ,  H01L21/76267 ,  H01L21/76275 ,  H01L21/76283 ,  H01L21/84 ,  H01L29/7317

摘要： The number of design processes for fabricating semiconductor devices can be reduced by parallel connection of a plurality of unit bipolar transistors Qu that are completely electrically isolated from each other in a semiconductor layer of an SOI substrate 1 to form a bipolar transistor having a large current capacity.

公开(公告)号：US5294751A

公开(公告)日：1994-03-15

申请号：US791291

申请日：1991-11-13

申请人： Chiyoshi Kamada

发明人： Chiyoshi Kamada

IPC分类号： H01L23/12 ,  H01L23/64 ,  H01P1/203 ,  H01P3/08 ,  H05K1/02 ,  H05K1/18 ,  H01L23/02

CPC分类号： H01L23/64 ,  H05K1/0219 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/183 ,  H05K2201/09254 ,  H05K2203/049

摘要： A high frequency transmission line structure has a reference potential plane conductor layer, a plurality of strip line conductors, a dielectric material layer interposed between the reference potential plane conductor layer and the strip line conductors and a shielding conductor unit provided between adjacent two strip line conductors. The shielding conductor unit includes first and second slender conductor portions extending substantially in a direction parallel with a lengthwise direction of the strip line conductors and connected to be integral with each other at their first ends. The second ends of the first and second slender conductor portions being electrically connected with the reference potential plane conductor layer.

摘要翻译： 高频传输线结构具有参考电位面导体层，多条带状线导体，介于基准电位面导体层和带状导体之间的电介质材料层，以及设置在相邻的两条带状导线之间的屏蔽导体单元 。 屏蔽导体单元包括第一细长导体部分和第二细长导体部分，其基本上沿与条状导线导体的长度方向平行的方向延伸，并且在第一端部彼此成一体连接。 第一和第二细长导体部分的第二端与参考电位面导体层电连接。

公开(公告)号：US5616520A

公开(公告)日：1997-04-01

申请号：US367490

申请日：1994-12-30

申请人： Masahiko Nishiuma ,  Norio Nakazato ,  Hiroyuki Takahashi ,  Chiyoshi Kamada ,  Motoo Suwa

发明人： Masahiko Nishiuma ,  Norio Nakazato ,  Hiroyuki Takahashi ,  Chiyoshi Kamada ,  Motoo Suwa

IPC分类号： H01L21/60 ,  H01L23/10 ,  H01L23/367 ,  H01L23/433 ,  H01L23/485 ,  H01L23/66

CPC分类号： H01L24/16 ,  H01L23/10 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/433 ,  H01L23/66 ,  H01L24/11 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/1184 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/75753 ,  H01L2224/78301 ,  H01L2224/81193 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  Y10T29/49144

摘要： A semiconductor device is fabricated by forming first metal balls on electrode pads of a semiconductor chip. The first metal balls each can have a sharp tipped anchor. All of the anchors simultaneously flattened slightly only to the extent of equalizing the height thereof. The first metal balls are bonded to electrodes formed on a substrate with wirings by embedding the anchors into the electrodes. Alternatively, second metal balls can be formed on the electrodes which are then flattened to equalize the height thereof. The first metal balls, either with or without the anchors, are bonded to the second metal balls. The first and second metal balls are preferably heated during the bonding step to soften the second metal balls.

摘要翻译： 通过在半导体芯片的电极焊盘上形成第一金属球来制造半导体器件。 第一个金属球各自可以具有尖锐的尖头锚。 所有的锚点同样平坦化，只能达到使其高度均匀的程度。 通过将锚固件嵌入电极中，第一金属球通过布线与形成在基板上的电极结合。 或者，可以在电极上形成第二金属球，然后将其平坦化以使其高度均匀。 具有或不具有锚固件的第一金属球结合到第二金属球。 第一和第二金属球优选在接合步骤期间被加热以软化第二金属球。

公开(公告)号：US5523622A

公开(公告)日：1996-06-04

申请号：US533410

申请日：1995-09-25

申请人： Takashi Harada ,  Kazuhiro Yoshihara ,  Kazutaka Masuzawa ,  Kiyoshi Hayashi ,  Jun Kumazawa ,  Kenji Nagai ,  Masahiko Nishiuma ,  Chiyoshi Kamada

发明人： Takashi Harada ,  Kazuhiro Yoshihara ,  Kazutaka Masuzawa ,  Kiyoshi Hayashi ,  Jun Kumazawa ,  Kenji Nagai ,  Masahiko Nishiuma ,  Chiyoshi Kamada

IPC分类号： H01L23/12 ,  H01L23/13 ,  H01L23/498 ,  H01L23/66 ,  H01L39/02

CPC分类号： H01L23/13 ,  H01L23/49822 ,  H01L23/66 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/16195 ,  H01L2924/3011

摘要： For taking a characteristic impedance matching of signal transmission lines in a package which carries thereon a semiconductor chip with a very high-speed LSI formed thereon, there is provided a semiconductor integrated circuit device wherein one ends of signal transmission lines formed on a main surface of a package substrate are extended up to the position just under pads formed on a main surface of the semiconductor chip and are connected to the pads on the chip electrically through bump electrodes, while opposite ends of the signal transmission lines are extended to the outer peripheral portion of the main surface of the package substrate and outer leads are bonded thereto.

摘要翻译： 为了在其上承载有非常高速LSI的半导体芯片的封装中采用信号传输线的特征阻抗匹配，提供了一种半导体集成电路器件，其中形成在主表面上的信号传输线的一端 封装基板延伸到刚好在形成在半导体芯片的主表面上的焊盘下方的位置，并且通过凸块电极与芯片上的焊盘电连接，同时信号传输线的相对端延伸到外周部分 的封装基板和外部引线的主表面接合。

公开(公告)号：US5225709A

公开(公告)日：1993-07-06

申请号：US715068

申请日：1991-06-13

申请人： Masahiko Nishiuma ,  Chiyoshi Kamada

发明人： Masahiko Nishiuma ,  Chiyoshi Kamada

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/49 ,  H01L23/64

CPC分类号： H01L24/48 ,  H01L23/642 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/4899 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025

摘要： A packaged semiconductor device has a package, a semiconductor IC chip disposed in a space formed in the package, a strip conductor buried at a first level in the package for carrying a signal to be coupled to the IC chip, a first reference potential conductor buried at a second level in the package for providing a reference potential for the IC chip and a second reference potential conductor buried at the first level in the package for shielding the strip conductor. A connection conductor such as a bonding wire is provided across the second reference potential conductor for connecting the IC chip with one of the ends of the strip conductor. A dielectric material is provided between the connection conductor and the second reference potential conductor to provide the connection conductor with a characteristic impedance matched with an impedance of a source of the signal the connection conductor carries. The package may have an interconnecting conductor extending to electrically connect the first and second reference potential conductors.

摘要翻译： 封装的半导体器件具有封装，设置在形成在封装中的空间中的半导体IC芯片，在封装中埋入第一电平的带状导体，用于承载要耦合到IC芯片的信号，第一参考电位导体埋入 在封装中的第二电平处提供用于IC芯片的参考电位，以及埋在第一级的第二参考电位导体，用于屏蔽带状导体。 诸如接合线的连接导体设置在第二参考电位导体两端，用于将IC芯片与带状导体的一个端部连接。 在连接导体和第二参考电位导体之间提供电介质材料，为连接导体提供与连接导体承载的信号源的阻抗匹配的特性阻抗。 封装可以具有延伸以电连接第一和第二参考电位导体的互连导体。