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44 条记录 (耗时 0.023 秒)

    Electrical apparatus with higher durability against surges
    1.
    发明授权
    Electrical apparatus with higher durability against surges 失效
    具有较高耐久性的电气设备

    公开(公告)号：US08786992B2

    公开(公告)日：2014-07-22

    申请号：US12727559

    申请日：2010-03-19

    申请人： Yoko Sumiyoshi ,  Junichi Fujiwara ,  Yosuke Watanabe

    发明人： Yoko Sumiyoshi ,  Junichi Fujiwara ,  Yosuke Watanabe

    IPC分类号： H01T4/08 ,  H01T4/06 ,  H01T4/10 ,  H01T4/16 ,  H01H9/06

    CPC分类号： H02H9/06 ,  H01T4/08

    摘要： An electrical apparatus, which is immovable in a facility, comprises plural electric circuits. Each electric circuit has one or more resistance elements and is connected to each input terminal connected a power source. The electric circuits are arranged positionally closely with each other. In each electric circuit, a desired functional circuit is connected in series to the resistance element, and a protection circuit is connected in series to the resistance element and connected in parallel with the functional circuit. A discharge member is provided in each electric circuit and arranged between each input terminal and the functional circuit. The discharge member includes a discharge gap which allows the discharge member to face with the discharge member of an adjacently arranged electric circuit.The discharge gap discharge deliberately to the adjacently positioned discharge member when a voltage applied to a selected electric circuit exceeds a predetermined voltage value.

    摘要翻译： 在设施中不可移动的电气设备包括多个电路。 每个电路具有一个或多个电阻元件，并且连接到连接到电源的每个输入端子。 电路彼此位置紧密地排列。 在每个电路中，期望的功能电路与电阻元件串联连接，并且保护电路与电阻元件串联连接并与功能电路并联。 在每个电路中设置放电构件，并且布置在每个输入端子和功能电路之间。 放电构件包括放电间隙，其允许放电构件面对相邻布置的电路的放电构件。 当施加到所选择的电路上的电压超过预定电压值时，放电间隙放电到相邻定位的放电构件。

    Injection molding process for making a preform
    3.
    发明授权
    Injection molding process for making a preform 有权

    公开(公告)号：US10300670B2

    公开(公告)日：2019-05-28

    申请号：US15829384

    申请日：2017-12-01

    申请人： Hiroshi Hosokoshiyama ,  Junichi Chiba ,  Yosuke Watanabe

    发明人： Hiroshi Hosokoshiyama ,  Junichi Chiba ,  Yosuke Watanabe

    IPC分类号： B29C45/16 ,  B29D22/00 ,  B29C49/00 ,  B29C49/22 ,  B65D1/02 ,  B29B11/14 ,  B29K105/00 ,  B29C49/06 ,  B29L31/00 ,  B29C49/10 ,  B29C45/28

    摘要： Technical problems of this invention is to create an injection molding device and an injection molding process for a test tube shaped preform, that can laminate a colored layer at certain positions of a wall of the reform with a certain thickness in a manner of a high degree of accuracy.A feature associated with the injection molding device to solve these problem comprising a nozzle section, in which a molten main resin and a molten second resin are join together to form a joined resin mass, the nozzle section comprising: an outer flow channel through which the main resin flows, an inner flow channel through which the second resin flows, a cylindrical column-shaped joined flow channel where the second resin from the inner flow channel joins the main resin from the outer flow channel, a first confluence disposed at a point where the main resin from the outer flow channel flows into the joined flow channel, a second confluence disposed at a point where the second resin flows into the joined flow channel wherein the first confluence is located downstream of the second confluence with a predetermined space left in between, and a cylindrical shutoff pin inserted slidably in the joined flow channel, wherein this shutoff pin is capable of shutting off or opening either or both of the first confluence and/or the second confluence, depending on the sliding position.

    Dividing method for wafer having film on the front side thereof
    8.
    发明授权
    Dividing method for wafer having film on the front side thereof 有权
    在其前侧具有膜的晶片的分割方法

    公开(公告)号：US07897488B2

    公开(公告)日：2011-03-01

    申请号：US12468556

    申请日：2009-05-19

    申请人： Yosuke Watanabe ,  Ryugo Oba ,  Masaru Nakamura

    发明人： Yosuke Watanabe ,  Ryugo Oba ,  Masaru Nakamura

    IPC分类号： H01L21/00

    CPC分类号： H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/172 ,  B23K2103/50

    摘要： A wafer dividing method for dividing a wafer having a film on the front side thereof. The wafer dividing method includes a modified layer forming step of applying a laser beam having a transmission wavelength to the substrate of the wafer from the front side thereof along the streets so that a focal point of the laser beam is set inside the substrate, thereby forming a modified layer in the substrate along each street, a film dividing step of applying a laser beam having an absorption wavelength to the film from the front side of the wafer along each street to thereby form a laser processed groove for dividing the film along each street, a back grinding step of grinding the back side of the substrate of the wafer to thereby reduce the thickness of the wafer to a predetermined thickness, a wafer supporting step of attaching the wafer to a dicing tape supported to an annular frame, and a wafer breaking step of applying an external force to the wafer by expanding the dicing tape to thereby break the wafer along each street.

    摘要翻译： 一种用于在其前侧分割具有膜的晶片的晶片分割方法。 晶片分割方法包括：修改层形成步骤，其沿着街道从其前侧向晶片的基板施加具有透射波长的激光束，使得激光束的焦点设置在基板内部，从而形成 沿着每个街道的基板中的改性层，膜分离步骤，沿着每条街道从晶片的前侧向膜施加具有吸收波长的激光束，从而形成用于沿着每条街道分割膜的激光加工槽 ，后磨削步骤，研磨晶片的基板的背面，从而将晶片的厚度减小到预定厚度;晶片支撑步骤，将晶片附着到支撑在环形框架上的切割带;以及晶片 通过扩大切割胶带将外力施加到晶片从而沿着每个街道破裂晶片的断裂步骤。

    Laser beam processing machine
    10.
    发明授权
    Laser beam processing machine 有权
    激光束加工机

    公开(公告)号：US07538048B2

    公开(公告)日：2009-05-26

    申请号：US11808384

    申请日：2007-06-08

    申请人： Satoshi Kobayashi ,  Keiji Nomaru ,  Yosuke Watanabe

    发明人： Satoshi Kobayashi ,  Keiji Nomaru ,  Yosuke Watanabe

    IPC分类号： H01L21/00

    CPC分类号： B23K26/0613 ,  B23K26/0604 ,  B23K26/067 ,  B23K26/0838 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/52

    摘要： A laser beam processing machine comprising a path distribution means for distributing a pulse laser beam oscillated by pulse laser beam oscillation means to a first path and a second path alternately, and one laser beam that passes through one of the paths and is converged by one condensing lens and the other laser beam that passes through the other path and is converged by the condensing lens are applied at different focusing points which have been displaced from each other in the direction of the optical axis, alternately with a time lag between them.

    摘要翻译： 一种激光束处理机，包括：路径分布装置，用于将由脉冲激光束振荡装置振荡的脉冲激光束交替地分配到第一路径和第二路径;以及一个激光束，其穿过一条路径并被一个会聚 透镜和通过另一路径并被聚光透镜会聚的另一激光束被施加在彼此沿着光轴方向相互偏移的不同聚焦点处，它们之间的时间间隔交替。