Surface light source device using light emitting diodes
    1.
    发明申请
    Surface light source device using light emitting diodes 有权
    使用发光二极管的表面光源装置

    公开(公告)号:US20080080165A1

    公开(公告)日:2008-04-03

    申请号:US11896818

    申请日:2007-09-06

    IPC分类号: F21V9/16

    摘要: A surface light source device using light emitting diodes, the device including: a housing having a top opening to emit light; a light emitting diode board disposed on an inner bottom surface of the housing, the board on which a plurality of light emitting diodes are arranged; and a color conversion laminate formed by depositing a plurality of phosphor-mixed resin layers containing phosphors, the layers disposed at a top of the opening of the housing and providing light having different wavelengths.

    摘要翻译: 一种使用发光二极管的表面光源装置,该装置包括:壳体,其具有用于发光的顶部开口; 设置在所述壳体的内底面上的发光二极管板,配置有多个发光二极管的基板; 以及通过沉积包含荧光体的多个荧光体混合树脂层形成的颜色转换层压体,所述荧光体混合树脂层设置在壳体的开口的顶部并提供具有不同波长的光。

    Gallium nitride semiconductor and method of manufacturing the same
    2.
    发明申请
    Gallium nitride semiconductor and method of manufacturing the same 有权
    氮化镓半导体及其制造方法

    公开(公告)号:US20060145187A1

    公开(公告)日:2006-07-06

    申请号:US11302957

    申请日:2005-12-13

    申请人: Yong Kim Dong Lee

    发明人: Yong Kim Dong Lee

    IPC分类号: H01L31/109 H01L29/12

    摘要: The present invention provides to a gallium nitride (GaN) semiconductor and a method of manufacturing the same, capable of reducing crystal defects caused by a difference in lattice parameters, and minimizing internal residual stress. In particular, since a high-quality GaN thin film is formed on a silicon wafer, manufacturing costs can be reduced by securing high-quality wafers with a large diameter at a low price, and applicability to a variety of devices and circuit can also be improved.

    摘要翻译: 本发明提供一种氮化镓(GaN)半导体及其制造方法,其能够减少由晶格参数的差异引起的晶体缺陷,并使内部残余应力最小化。 特别地,由于在硅晶片上形成高质量的GaN薄膜,所以可以通过以较低的价格确保大直径的高品质晶片来降低制造成本,并且适用于各种器件和电路也可以 改进。

    High voltage transistor
    3.
    发明申请
    High voltage transistor 有权
    高压晶体管

    公开(公告)号:US20050104123A1

    公开(公告)日:2005-05-19

    申请号:US10878273

    申请日:2004-06-28

    CPC分类号: H01L29/7833 H01L27/105

    摘要: Provided is a high voltage transistor in a flash memory device comprising: a source/drain junction of a DDD structure consisting of a high-concentration impurity region and a low-concentration impurity region surrounding the high-concentration impurity region, the high-concentration impurity region being formed in parallel with a gate electrode at a distance spaced by a location in which a contact hole is formed, and having a rectangular shape whose width is the same as or wider than that of the contact hole and whose length is the same as or narrower than that of an active region through which the gate electrode passes. Accordingly, a current density to pass the gate electrode neighboring the contact hole portion and a current density to pass the gate electrode at a portion where the contact hole cannot be formed become uniform. A uniform and constant saturation current can be obtained regardless of the number of the contact hole.

    摘要翻译: 提供一种闪速存储器件中的高压晶体管,包括:由高浓度杂质区域和围绕高浓度杂质区域的低浓度杂质区域构成的DDD结构的源极/漏极结,高浓度杂质 区域与栅电极平行地形成在与形成接触孔的位置隔开的距离处,并且具有与接触孔的宽度相同或更宽的矩形形状,并且其长度与 或比栅电极通过的有源区的窄。 因此,与接触孔部相邻的栅电极的电流密度以及在不能形成接触孔的部分通过栅电极的电流密度变得均匀。 无论接触孔的数量如何,都可以获得均匀和恒定的饱和电流。

    Elastic member for vibration absorption, and refrigerator using the same
    4.
    发明申请
    Elastic member for vibration absorption, and refrigerator using the same 审中-公开
    用于振动的弹性构件和使用其的冰箱

    公开(公告)号:US20050106042A1

    公开(公告)日:2005-05-19

    申请号:US10936520

    申请日:2004-09-09

    IPC分类号: F04B39/00 F25D19/00 F04B23/00

    CPC分类号: F04B39/0044

    摘要: Disclosed is an elastic member for absorbing vibration with an improved vibration absorbing performance through an improved structure, the elastic member including an hollow shape seating part with a hollow shape, the hollow shape seating part seating the driving device such as a compressor thereon and having an axial direction supporting part supporting compressive load of the driving device, and a hollow shape base having an average radius different from that of the axial direction supporting part supporting the compressive load of the driving device.

    摘要翻译: 公开了一种弹性构件,其通过改进的结构吸收具有改善的振动吸收性能的振动,弹性构件包括具有中空形状的中空形座部件,中空形座部件将诸如压缩机的驱动装置安置在其上,并具有 支撑驱动装置的压缩载荷的轴向支撑部分,以及平均半径不同于支撑驱动装置的压缩载荷的轴向支撑部分的中空形基部。

    Optical waveguide having curved reflecting mirror surface and method of manufacturing the same

    公开(公告)号:US20070077005A1

    公开(公告)日:2007-04-05

    申请号:US11285621

    申请日:2005-11-22

    IPC分类号: G02B6/42

    摘要: The present invention relates to an optical waveguide having a curved reflecting mirror surface for optical coupling and a method of manufacturing it. The method of manufacturing an optical waveguide includes the steps of coating a transparent glass substrate with a photosensitive material; radiating ultraviolet rays onto the photosensitive material through a mask in which the shape of the optical waveguide and partition blocks formed beside ends of the optical waveguide are patterned; manufacturing a photoresist stamp by developing patterns onto which the ultraviolet ray has been radiated through the mask; forming a PolyDiMethylSiloxane (PDMS) mold by coating the photo stamp with PDMS, and forming a core; forming the optical waveguide, in which the partition blocks are formed beside the ends thereof, using the PDMS mold; and dropping liquid polymer between the partition blocks formed beside the ends of the optical waveguide using an inkjet header and hardening it. This structure and manufacturing method have advantage in that optical waveguides having variously shaped reflecting mirror surfaces are simply and economically manufactured.

    Method of manufacturing light emitting diode package
    7.
    发明申请
    Method of manufacturing light emitting diode package 审中-公开
    制造发光二极管封装的方法

    公开(公告)号:US20070155033A1

    公开(公告)日:2007-07-05

    申请号:US11649914

    申请日:2007-01-05

    IPC分类号: H01L21/00

    摘要: A method of manufacturing an LED package. The method includes dispensing a transparent resilient resin on an LED package body and overturning an entire structure to form an LED lens integrally provided to the LED package body. This prevents extra processes and costs incurring from forming intermediate layers and obviates degradation in reliability and light extraction efficiency due to additional interfaces.

    摘要翻译: 一种制造LED封装的方法。 该方法包括将透明弹性树脂分配在LED封装主体上并翻转整个结构以形成一体地提供到LED封装体的LED透镜。 这防止了由于附加界面而形成中间层而导致额外的工艺和成本,并且消除了可靠性和光提取效率的降低。

    Method of manufacturing barrier ribs for pdp by capillary molding of paste and paste compositions therefor
    8.
    发明申请
    Method of manufacturing barrier ribs for pdp by capillary molding of paste and paste compositions therefor 失效
    通过毛细管成型用于制造pdp隔壁的糊剂和糊剂组合物的方法

    公开(公告)号:US20060121815A1

    公开(公告)日:2006-06-08

    申请号:US10521196

    申请日:2003-07-15

    IPC分类号: H01J9/24

    CPC分类号: H01J9/242 H01J11/12 H01J11/36

    摘要: Disclosed is a method of manufacturing rear plate barrier ribs for Plasma Display Panel (PDP), which includes the steps of: forming barrier ribs by infiltrating the barrier rib forming paste into grooves of a mold by using the capillary phenomenon, and then sintering the paste. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of PDP and reduce manufacture costs of the rear plate.

    摘要翻译: 公开了一种制造等离子体显示面板(PDP)的后板阻挡肋的方法,其包括以下步骤:通过使用毛细管现象将隔壁形成膏渗透到模具的凹槽中,然后烧结浆料 。 这种方法造成罕见的环境污染,能够形成具有精细和复杂形状的隔肋,并且减少隔壁所需的材料成本。 因此,该方法可以提高PDP的质量并降低后板的制造成本。

    Light emitting diode package and method for manufacturing the same
    9.
    发明申请
    Light emitting diode package and method for manufacturing the same 审中-公开
    发光二极管封装及其制造方法

    公开(公告)号:US20070063214A1

    公开(公告)日:2007-03-22

    申请号:US11524278

    申请日:2006-09-21

    IPC分类号: H01L33/00

    CPC分类号: H01L33/507 H01L33/58

    摘要: The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.

    摘要翻译: 本发明涉及能够防止荧光体劣化的发光二极管封装及其制造方法。 发光二极管封装包括具有凹部的封装主体,安装在凹部的地板表面上的发光二极管芯片和设置在封装体的上表面上的透镜结构,与发光二极管芯片分开。 荧光体分散在透镜结构的至少一部分中。

    Method of manufacturing barrier ribs for pdp by etching of thick film using water-based solution and compositions therefor
    10.
    发明申请
    Method of manufacturing barrier ribs for pdp by etching of thick film using water-based solution and compositions therefor 审中-公开
    通过使用水溶液蚀刻厚膜及其组合物来制造pdp隔壁的方法

    公开(公告)号:US20050156522A1

    公开(公告)日:2005-07-21

    申请号:US10510036

    申请日:2002-04-08

    摘要: Disclosed is a method of manufacturing barrier ribs for a Plasma Display Panel (PDP), which includes the steps of forming a thick film (or, “green tape”) for barrier ribs on a glass or metal substrate by using composition for forming the barrier ribs, which contains water soluble components and solvent soluble components together a binder; forming a protective pattern film partially soluble or insoluble to the water based solution on the thick film; etching the thick film into a barrier rib shape by using solution or mixed solution containing ceramic powder as an etching accelerator, and sintering the etched thick film. This method causes rare environmental pollution, enables to make barrier ribs having fine and complex shapes and reduces material costs required for the barrier rib. Thus, the method may improve quality of DPD and reduce manufacture costs of the rear plate.

    摘要翻译: 公开了一种制造用于等离子体显示面板(PDP)的隔壁的方法,其包括以下步骤:通过使用用于形成屏障的组合物在玻璃或金属基板上形成用于隔壁的厚膜(或“生胶条”) 肋骨,其含有水溶性成分和溶剂可溶性成分在一起的粘合剂; 在厚膜上形成部分溶解或不溶于水基溶液的保护性图案膜; 通过使用含有陶瓷粉末作为蚀刻加速剂的溶液或混合溶液将厚膜蚀刻成隔壁形状,并烧结蚀刻的厚膜。 这种方法造成罕见的环境污染,能够形成具有精细和复杂形状的隔肋,并且减少隔壁所需的材料成本。 因此,该方法可以提高DPD的质量并降低后板的制造成本。