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    High voltage semiconductor device including field shaping layer and method of fabricating the same
    1.
    发明授权
    High voltage semiconductor device including field shaping layer and method of fabricating the same 有权
    包括场成形层的高电压半导体器件及其制造方法

    公开(公告)号：US08399923B2

    公开(公告)日：2013-03-19

    申请号：US12495948

    申请日：2009-07-01

    申请人： Yong-cheol Choi ,  Chang-ki Jeon ,  Min-suk Kim

    发明人： Yong-cheol Choi ,  Chang-ki Jeon ,  Min-suk Kim

    IPC分类号： H01L29/66

    CPC分类号： H01L29/66681 ,  H01L29/0634 ,  H01L29/0878 ,  H01L29/1083 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/41758 ,  H01L29/42368 ,  H01L29/7816

    摘要： Provided are a high voltage semiconductor device in which a field shaping layer is formed on the entire surface of a semiconductor substrate and a method of fabricating the same. Specifically, the high voltage semiconductor device includes a first conductivity-type semiconductor substrate. A second conductivity-type semiconductor layer is disposed on a surface of the semiconductor substrate, and a first conductivity-type body region is formed in semiconductor layer. A second conductivity-type source region is formed in the body region. A drain region is formed in the semiconductor layer and is separated from the body region. The field shaping layer is formed on the entire surface of the semiconductor layer facing the semiconductor layer.

    摘要翻译： 提供一种在半导体衬底的整个表面上形成场成形层的高电压半导体器件及其制造方法。 具体地，高电压半导体器件包括第一导电型半导体衬底。 在半导体衬底的表面上设置第二导电型半导体层，在半导体层中形成第一导电型体区。 在体区域中形成第二导电型源极区域。 在半导体层中形成漏区，与体区分离。 在与半导体层相对的半导体层的整个表面上形成场成形层。

    High voltage semiconductor device having shifters and method of fabricating the same
    2.
    发明授权
    High voltage semiconductor device having shifters and method of fabricating the same 有权
    具有移位器的高电压半导体器件及其制造方法

    公开(公告)号：US07777524B2

    公开(公告)日：2010-08-17

    申请号：US12402528

    申请日：2009-03-12

    申请人： Chang-ki Jeon ,  Min-suk Kim ,  Yong-cheol Choi

    发明人： Chang-ki Jeon ,  Min-suk Kim ,  Yong-cheol Choi

    IPC分类号： H03K19/0175

    CPC分类号： H01L27/088 ,  H01L21/823481

    摘要： Provided are a high-voltage semiconductor device including a junction termination which electrically isolates a low voltage unit from a high voltage unit, and a method of fabricating the same. The high voltage semiconductor device includes a high voltage unit, a low voltage unit surrounding the high voltage unit, and a junction termination formed between the high voltage unit and the low voltage unit and surrounding the high voltage unit to electrically isolate the high voltage unit from the low voltage unit. The junction termination includes at least one level shifter which level shifts signals from the low voltage unit and supplies the same to the high voltage unit, a first device isolation region surrounding the high voltage unit to electrically isolate the high voltage unit from the level shifter, and a resistor layer electrically connecting neighboring level shifters.

    摘要翻译： 提供一种包括将低电压单元与高电压单元电隔离的接合端子的高压半导体器件及其制造方法。 高电压半导体器件包括高电压单元，围绕高电压单元的低电压单元，以及形成在高电压单元和低电压单元之间并且围绕高电压单元的连接端子，以将高压单元与 低压单位。 所述连接终端包括至少一个电平移位器，其将来自所述低电压单元的信号电平移位并将其提供给所述高压单元;围绕所述高压单元的第一器件隔离区，以将所述高压单元与所述电平移位器电隔离; 以及电连接相邻电平移位器的电阻层。

    HIGH VOLTAGE SEMICONDUCTOR DEVICE HAVING SHIFTERS AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    HIGH VOLTAGE SEMICONDUCTOR DEVICE HAVING SHIFTERS AND METHOD OF FABRICATING THE SAME 有权
    具有变形器的高电压半导体器件及其制造方法

    公开(公告)号：US20090243696A1

    公开(公告)日：2009-10-01

    申请号：US12402528

    申请日：2009-03-12

    申请人： Chang-ki Jeon ,  Min-suk Kim ,  Yong-cheol Choi

    发明人： Chang-ki Jeon ,  Min-suk Kim ,  Yong-cheol Choi

    IPC分类号： H03L5/00 ,  H01L21/76

    CPC分类号： H01L27/088 ,  H01L21/823481

    摘要： Provided are a high-voltage semiconductor device including a junction termination which electrically isolates a low voltage unit from a high voltage unit, and a method of fabricating the same. The high voltage semiconductor device includes a high voltage unit, a low voltage unit surrounding the high voltage unit, and a junction termination formed between the high voltage unit and the low voltage unit and surrounding the high voltage unit to electrically isolate the high voltage unit from the low voltage unit. The junction termination includes at least one level shifter which level shifts signals from the low voltage unit and supplies the same to the high voltage unit, a first device isolation region surrounding the high voltage unit to electrically isolate the high voltage unit from the level shifter, and a resistor layer electrically connecting neighboring level shifters.

    摘要翻译： 提供一种包括将低电压单元与高电压单元电隔离的接合端子的高压半导体器件及其制造方法。 高电压半导体器件包括高电压单元，围绕高电压单元的低电压单元，以及形成在高电压单元和低电压单元之间并且围绕高电压单元的连接端子，以将高压单元与 低压单位。 所述连接终端包括至少一个电平移位器，其将来自所述低电压单元的信号电平移位并将其提供给所述高压单元;围绕所述高压单元的第一器件隔离区，以将所述高压单元与所述电平移位器电隔离; 以及电连接相邻电平移位器的电阻层。

    Method of Forming High Breakdown Voltage Low On-Resistance Lateral DMOS Transistor
    4.
    发明申请
    Method of Forming High Breakdown Voltage Low On-Resistance Lateral DMOS Transistor 有权
    形成高击穿电压低导通电阻横向DMOS晶体管的方法

    公开(公告)号：US20070264785A1

    公开(公告)日：2007-11-15

    申请号：US11828128

    申请日：2007-07-25

    申请人： Yong-cheol Choi ,  Chang-ki Jeon ,  Cheol-joong Kim

    发明人： Yong-cheol Choi ,  Chang-ki Jeon ,  Cheol-joong Kim

    IPC分类号： H01L27/085

    CPC分类号： H01L29/66674 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/7816

    摘要： A method of forming a metal oxide semiconductor (MOS) transistor includes the following steps. A substrate of a first conductivity is provided. A first buried layer of a second conductivity type is formed over the substrate. A second buried layer of the first conductivity type is formed in the first buried layer. An epitaxial layer of the second conductivity type is formed over the substrate. A drift region of a second conductivity type is formed in the epitaxial layer. A gate layer is formed over the drift region. A body region of the first conductivity type is formed in the drift region such that the gate overlaps a surface portion of the body region. A source region of the second conductivity is formed in the body region. A drain region of the second conductivity type is formed in the drift region. The drain region is laterally spaced from the body region. The first and second buried layers laterally extend from under the body region to under the drain region. The surface portion of the body region extends between the source region and the drift region to form a channel region of the transistor.

    摘要翻译： 形成金属氧化物半导体（MOS）晶体管的方法包括以下步骤。 提供第一导电性的衬底。 在衬底上形成第二导电类型的第一掩埋层。 第一导电类型的第二掩埋层形成在第一掩埋层中。 在衬底上形成第二导电类型的外延层。 在外延层中形成第二导电类型的漂移区。 在漂移区上形成栅极层。 第一导电类型的体区形成在漂移区域中，使得栅极与身体区域的表面部分重叠。 在身体区域中形成第二导电性的源极区域。 在漂移区域中形成第二导电类型的漏极区域。 漏极区域与身体区域横向间隔开。 第一和第二掩埋层从身体区域下方横向延伸到漏极区域下方。 体区域的表面部分在源极区域和漂移区域之间延伸以形成晶体管的沟道区域。

    High breakdown voltage low on-resistance lateral DMOS transistor
    5.
    发明授权
    High breakdown voltage low on-resistance lateral DMOS transistor 有权
    高击穿电压低导通电阻横向DMOS晶体管

    公开(公告)号：US07265416B2

    公开(公告)日：2007-09-04

    申请号：US10366545

    申请日：2003-02-12

    申请人： Yong-cheol Choi ,  Chang-ki Jeon ,  Cheol-joong Kim

    发明人： Yong-cheol Choi ,  Chang-ki Jeon ,  Cheol-joong Kim

    IPC分类号： H01L29/94 ,  H01L29/76

    CPC分类号： H01L29/66674 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/7816

    摘要： In accordance with the present invention, a metal oxide semiconductor (MOS) transistor has a substrate of a first conductivity type. A drift region of a second conductivity type extends over the substrate. A body region of the first conductivity type is in the drift region. A source region of the second conductivity is in the body region. A gate extends over a surface portion of the body region. The surface portion of the body region extends between the source region and the drift region to form a channel region of the transistor. A drain region of the second conductivity type is in the drift region. The drain region is laterally spaced from the body region. A first buried layer of the second conductivity type is between the substrate and drift region. The first buried layer laterally extends from under the body region to under the drain region. A second buried layer of the first conductivity type is between the first buried layer and the drift region. The second buried layer laterally extends from under the body region to under the drain region.

    摘要翻译： 根据本发明，金属氧化物半导体（MOS）晶体管具有第一导电类型的衬底。 第二导电类型的漂移区域在衬底上延伸。 第一导电类型的体区在漂移区中。 第二导电性的源极区域在体区域中。 门延伸到身体区域的表面部分上。 体区域的表面部分在源极区域和漂移区域之间延伸以形成晶体管的沟道区域。 第二导电类型的漏区在漂移区中。 漏极区域与身体区域横向间隔开。 第二导电类型的第一掩埋层位于衬底和漂移区之间。 第一掩埋层从身体区域下方横向延伸到漏极区域下方。 第一导电类型的第二掩埋层位于第一掩埋层和漂移区之间。 第二掩埋层从身体区域下方横向延伸到漏极区域下方。

    Method of forming high breakdown voltage low on-resistance lateral DMOS transistor
    6.
    发明授权
    Method of forming high breakdown voltage low on-resistance lateral DMOS transistor 有权
    形成高击穿电压低导通电阻横向DMOS晶体管的方法

    公开(公告)号：US07605040B2

    公开(公告)日：2009-10-20

    申请号：US11828128

    申请日：2007-07-25

    申请人： Yong-cheol Choi ,  Chang-ki Jeon ,  Cheol-joong Kim

    发明人： Yong-cheol Choi ,  Chang-ki Jeon ,  Cheol-joong Kim

    IPC分类号： H01L21/336

    CPC分类号： H01L29/66674 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/7816

    摘要： A method of forming a metal oxide semiconductor (MOS) transistor includes the following steps. A substrate of a first conductivity is provided. A first buried layer of a second conductivity type is formed over the substrate. A second buried layer of the first conductivity type is formed in the first buried layer. An epitaxial layer of the second conductivity type is formed over the substrate. A drift region of a second conductivity type is formed in the epitaxial layer. A gate layer is formed over the drift region. A body region of the first conductivity type is formed in the drift region such that the gate overlaps a surface portion of the body region. A source region of the second conductivity is formed in the body region. A drain region of the second conductivity type is formed in the drift region. The drain region is laterally spaced from the body region. The first and second buried layers laterally extend from under the body region to under the drain region. The surface portion of the body region extends between the source region and the drift region to form a channel region of the transistor.

    摘要翻译： 形成金属氧化物半导体（MOS）晶体管的方法包括以下步骤。 提供第一导电性的衬底。 在衬底上形成第二导电类型的第一掩埋层。 第一导电类型的第二掩埋层形成在第一掩埋层中。 在衬底上形成第二导电类型的外延层。 在外延层中形成第二导电类型的漂移区。 在漂移区上形成栅极层。 第一导电类型的体区形成在漂移区域中，使得栅极与身体区域的表面部分重叠。 在身体区域中形成第二导电性的源极区域。 在漂移区域中形成第二导电类型的漏极区域。 漏极区域与身体区域横向间隔开。 第一和第二掩埋层从身体区域下方横向延伸到漏极区域下方。 体区域的表面部分在源极区域和漂移区域之间延伸以形成晶体管的沟道区域。