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    Method and system for defect detection
    1.
    发明申请
    Method and system for defect detection 有权

    公开(公告)号：US20060199287A1

    公开(公告)日：2006-09-07

    申请号：US11201279

    申请日：2005-08-10

    申请人： Yonghang Fu ,  Yongqiang Liu ,  Michael Darwin

    发明人： Yonghang Fu ,  Yongqiang Liu ,  Michael Darwin

    IPC分类号： H01L21/66 ,  G01R31/26

    CPC分类号： G01N21/9501

    摘要： A method for inspecting objects such as semiconductor wafers. A staging platform and an optical platform are arranged so that the object may be staged and its surface scanned by optical equipment situated on the optical platform. During the scanning process, the surface is illuminated with light of a plurality of wavelengths, each strobed at a predetermined rate so that multiple images may be collected using time and frequency multiplexing. The multiple images are stored in a database for analysis, which includes processing selected ones of the multiple images according to one or more algorithms. The defect-detection algorithms used for each object are determined by referenced to a predetermined or calculated defect detection protocol, then a defect mask is created for each pixel in the images that is suspected to be defective. The defect mask is then compared to threshold parameters to determine which if any of the suspected defects should be reported.

    Molecular airborne contaminants (MACs) film removal and wafer surface sustaining system and method
    2.
    发明申请
    Molecular airborne contaminants (MACs) film removal and wafer surface sustaining system and method 审中-公开
    分子空气污染物（MAC）膜去除和晶圆表面维持系统及方法

    公开(公告)号：US20050098264A1

    公开(公告)日：2005-05-12

    申请号：US10966125

    申请日：2004-10-14

    申请人： Robert Wolf ,  Michael Darwin

    发明人： Robert Wolf ,  Michael Darwin

    IPC分类号： C23F1/00 ,  C25F1/00 ,  H01L20060101 ,  H01L21/00 ,  H01L21/02

    CPC分类号： H01L21/67028 ,  H01L21/0206

    摘要： A MACs mitigation system includes a MACs film removal sub-system (14) and a wafer surface sustaining sub-system (16) for sustaining or maintaining the cleaned surface (18A) of a wafer (18) in a substantially MACs-free condition for some predetermined period of time, such as the typical amount of time required after MACs film removal to perform a desired measurement on the wafer using a metrology tool (12). The MACs film removal sub-system can comprise a source (14A) of microwave energy that beneficially both heats and dissociates the chemical constituents of the MACs film. The wafer surface sustaining sub-system can be co-located with a measurement stage portion of the metrology tool, and preferably includes an atmosphere provided by a source (20) of clean gas.

    摘要翻译： MAC缓解系统包括MAC薄膜去除子系统（14）和晶片表面维持子系统（16），用于维持或维持基本无MAC状态的晶片（18）的清洁表面（18A） 例如在MAC去膜之后使用计量工具（12）在晶片上执行期望的测量所需的典型时间量的一些预定时间段。 MAC膜去除子系统可以包括有利地加热和解离MAC膜的化学成分的微波能量源（14A）。 晶片表面维持子系统可以与计量工具的测量台部分共定位，并且优选地包括由清洁气体源（20）提供的气氛。