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公开(公告)号：US4929165A
公开(公告)日：1990-05-29
申请号：US333811
申请日：1989-04-06
CPC分类号： B29C45/66 , Y10T74/18576 , Y10T74/19014
摘要： A motor-operated, direct-pressure type mold clamping mechanism capable of high-speed mold closing and opening operations and of producing a required mold clamping force, without the use of a large-sized motor. In the mold opening and closing operations, a ball screw, in engagement with a ball nut which is movable in unison with a moving platen, is rotated at high speed by a coarse-adjustment motor through gears, so that a die is opened and closed at high speed. In the mold clamping operation, the ball screw is driven by a fine-adjustment motor through a clutch and gears which, having a high reduction ratio, serve to enhance the rotatory force and provide greater clamping force.
摘要翻译： 一种电动直接压力式合模机构，能够高速关闭和打开操作，并产生所需的合模力，而不需要使用大型电机。 在模具打开和关闭操作中，与可移动的压板一起移动的滚珠螺母接合的滚珠丝杠通过齿轮通过粗调电机高速旋转，使得模具打开和关闭 高速 在模具夹紧操作中，滚珠丝杠由微调马达通过离合器驱动，齿轮具有高减速比，用于提高旋转力并提供更大的夹紧力。
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公开(公告)号：US4968239A
公开(公告)日：1990-11-06
申请号：US167854
申请日：1988-02-17
CPC分类号： B29C45/66 , Y10S425/223 , Y10T74/18696 , Y10T74/19014
摘要： A motor-operated, direct-pressure type mold clamping apparatus is capable of high-speed mold closing and opening operations and of producing a required mold clamping force, without the use of a large-sized motor. In the mold opening and closing operations, a ball screw, in engagement with a ball nut which is movable in one with a moving platen, is rotated at high speed by a motor through gears and a clutch, so that a die is opened and closed at high speed. In a mold clamping operation, the ball screw is driven with a large rotatory force transmitted through a clutch and gears which, having a high reduction ratio, serve to increase the rotatory force of the motor. Thus, dies are clamped with a large clamping force.
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公开(公告)号：US4741685A
公开(公告)日：1988-05-03
申请号：US86141
申请日：1987-07-27
CPC分类号： G05B19/231 , B29C45/5008 , B29C45/76 , B29C2045/1792 , G05B2219/41258 , G05B2219/45244
摘要： In order to obtain an injection drive apparatus which is low-priced, can produce a great output torque, and has a satisfactory acceleration/deceleration characteristic, in an injection-molding machine which performs injection by driving a screw by means of servomotors, one or more ball screws (7), used to drive a screw (2) in the axial direction, are driven by means of a plurality of servomotors (M1, M2), a position detector (P1) for detecting the screw position is provided only for one servomotor (M1), and the servomotors (M1, M2) are provided individually with power amplifiers, which are controlled by means of one control circuit so that the individual servomotors (M1, M2) are controlled in synchronism with one another.
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公开(公告)号：US4865536A
公开(公告)日：1989-09-12
申请号：US221251
申请日：1988-06-17
CPC分类号： B29C45/4005 , B29C45/66
摘要： There is provided a direct mold clamping apparatus with an ejector, which is capable of uniformly applying a mold clamping force to a movable platen and is simple in construction and compact in size. A hollow cylindrical push member (12) and a movable platen (3) are coupled to each other through a single junction plane, in the form of an annular ring. A driving force transmitted through the push member is applied uniformly to the movable platen. The ejector (1) of the mold clamping apparatus (2) is provided with a ball nut (7) disposed in a hollow portion of the push member. A ball screw (6), which mates with the nut, is coaxial with a ball screw (8) for mold clamping, and has a front end fixed to an ejector pin (4) and the rear end portion removably fitted in a hole (8a) in a front end portion of the mold clamping ball screw. Thus, the axial length of the mold clamping apparatus is reduced.
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公开(公告)号：US5158783A
公开(公告)日：1992-10-27
申请号：US720755
申请日：1991-07-02
申请人： Yoshiharu Inaba , Koichi Nishimura
发明人： Yoshiharu Inaba , Koichi Nishimura
CPC分类号： B29C45/5008 , B29C2045/502
摘要： A low cost crank operated injection apparatus is capable of driving an injection screw with a desired driving force without the need of employing a high output type electric motor. The injection apparatus includes a crank mechanism for converting forward and reverse rotation of a driving shaft into reciprocating motion of an injection screw mounted on a pusher plate. The driving shaft is coupled through a reduction gearing unit to the power output shaft of a servomotor controlled by a numerical control device, and the apparatus operates, during the injection process, so as to cause the injection screw to move forwardly with a great driving force. The servomotor is rotated in such a manner that the driving shaft is driven forwardly within a predetermined rotary angular region corresponding to an operational region which does not include the dead center positions of the crank mechanism, whereby rapid changes in the injection speed and in the rate of change of injection pressure are eliminated during the operating cycle.
摘要翻译： PCT No.PCT / JP90 / 01408 Sec。 371日期：1991年7月2日 102（e）日期1991年7月2日PCT 1990年11月1日PCT PCT。 出版物WO91 / 06414 日期：1991年5月16日。低成本曲柄式注射装置能够驱动具有期望驱动力的注射螺杆，而不需要使用高输出型电动机。 注射装置包括用于将驱动轴的正向和反向旋转转换成安装在推动板上的注射螺杆的往复运动的曲柄机构。 驱动轴通过减速装置联接到由数控装置控制的伺服电动机的动力输出轴上，并且该装置在喷射过程中操作以使喷射螺杆以大的驱动力向前移动 。 伺服电动机以这样的方式旋转，使得驱动轴在对应于不包括曲柄机构的死点位置的操作区域的预定旋转角度区域内向前驱动，由此喷射速度和速率的快速变化 在操作周期中消除了喷射压力的变化。
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公开(公告)号：US4696632A
公开(公告)日：1987-09-29
申请号：US752621
申请日：1985-07-08
申请人： Yoshiharu Inaba
发明人： Yoshiharu Inaba
IPC分类号： B22D17/26 , B29C45/64 , B29C45/66 , B29C45/76 , G05B19/42 , G05B19/425 , G05D13/62 , B29C45/80
CPC分类号： B29C45/76 , B29C45/66 , G05B19/425 , G05B2219/34319 , G05B2219/45244
摘要： A mold opening/closing speed control device wherein an opening/closing speed switching position for molds in a mold clamping unit in an injection molding apparatus can be taught by the control device. The control device is set in a teaching mode (101), a servo motor (M) is driven at a low speed to move (102) the molds, speed switching positions P1, P2 and P3 are stored (103, 104, 205, 106, 109) by a teaching device, and the opening/closing speed control of the molds is performed (110, 123) by the servo motor in accordance with the stored positions.
摘要翻译： PCT No.PCT / JP84 / 00618 Sec。 371日期：1985年7月8日 102（e）日期1985年7月8日PCT Filted 1984年12月26日PCT公布。 出版物WO85 / 02812 日期：1985年7月4日。一种模具打开/关闭速度控制装置，其中可以通过控制装置教导注射成型装置中的模具夹紧单元中的模具的打开/关闭速度切换位置。 控制装置设置在教学模式（101）中，伺服电机（M）以低速驱动以移动（102）模具，速度切换位置P1，P2和P3被存储（103,104,205， 106,109），并且根据所存储的位置由伺服电动机执行模具的打开/关闭速度控制（110,123）。
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公开(公告)号：US4693676A
公开(公告)日：1987-09-15
申请号：US841523
申请日：1986-03-06
申请人： Yoshiharu Inaba
发明人： Yoshiharu Inaba
CPC分类号： B29C45/5008
摘要： A screw-rotating/injection mechanism of an injection molding machine has a screw shaft (1) having a rear portion thereof connected to a drive shaft (1') which is rotatably fixed to a pressure plate (4). A nut (6) which is spline-coupled to a spline shaft (5) constituting a rear portion of the drive shaft (1') is driven by a screw rotating motor (M1) through a first transmission unit (9, 10, 13, 15) to rotate the screw shaft (1). A ball screw (8, 8') threadedly engaged with a ball nut (7, 7'), fixed to the pressure plate (4), is driven by an injection servo motor (M2) through a second transmission unit (11, 11', 14, 16) to move the screw shaft (1) forward, thereby performing injection.
摘要翻译： PCT No.PCT / JP85 / 00382 Sec。 371日期：1986年3月6日 102（e）1986年3月6日PCT PCT。1985年7月5日PCT公布。 公开号WO86 / 00562 日期：1986年1月30日。注射成型机的螺杆旋转/注射机构具有螺杆轴（1），其后部连接到驱动轴（1'），驱动轴（1'）可旋转地固定到压板 ）。 与构成驱动轴（1'）的后部的花键轴（5）花键连接的螺母（6）通过第一传动单元（9,10,13）由螺杆旋转马达（M1）驱动 ，15）旋转螺杆轴（1）。 通过喷射伺服电动机（M2）通过第二传动单元（11,11）驱动固定到压板（4）上的与滚珠螺母（7,7'）螺纹接合的滚珠丝杠（8,8'） '，14,16）将螺杆轴（1）向前移动，从而进行喷射。
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公开(公告)号：US4601653A
公开(公告)日：1986-07-22
申请号：US772337
申请日：1985-08-22
申请人： Yoshiharu Inaba
发明人： Yoshiharu Inaba
CPC分类号： B29C45/5008 , B29C2045/1792 , B29C2045/5076 , B29C2045/7673 , Y02P70/261
摘要： An injection molding apparatus including a power transmission device is provided for axially moving a screw by a rotational force of a motor received through a first clutch. During non-injection/non-metering, the motor is driven to cause an energy accumulation device to accumulate energy through a second clutch. During injection, a driving force of the motor and the energy accumulated in the energy accumulation device achieve high-pressure, high-speed injection with good response characteristics.
摘要翻译： PCT No.PCT / JP84 / 00609 371日期1985年8月22日 102（e）日期1985年8月22日PCT提交1984年12月21日PCT公布。 第WO85 / 02811号公报 日期为1985年7月4日。包括动力传递装置的注塑设备被设置成通过第一离合器接收的马达的旋转力来轴向移动螺杆。 在非喷射/非测量期间，电动机被驱动以使能量积蓄装置通过第二离合器积聚能量。 在注射期间，电动机的驱动力和积聚在能量积蓄装置中的能量实现了具有良好响应特性的高压高速注射。
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公开(公告)号：US3993808A
公开(公告)日：1976-11-23
申请号：US546923
申请日：1975-02-04
申请人： Yoshiharu Inaba , Toru Kawanobe
发明人： Yoshiharu Inaba , Toru Kawanobe
摘要： Gold is directly plated onto tungsten or molybdenum by an electroless plating process using a plating solution including a gold compound and having pH not less than 8, and desirably not less than 9.
摘要翻译： 通过使用包含金化合物的电镀溶液并且pH不小于8，优选不小于9的化学镀方法将金直接镀在钨或钼上。
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10.发明授权公开(公告)号：US07013564B2
公开(公告)日：2006-03-21
申请号：US09971566
申请日：2001-10-09
申请人： Hanae Shimokawa , Tasao Soga , Hiroaki Okudaira , Toshiharu Ishida , Tetsuya Nakatsuka , Yoshiharu Inaba , Asao Nishimura
发明人： Hanae Shimokawa , Tasao Soga , Hiroaki Okudaira , Toshiharu Ishida , Tetsuya Nakatsuka , Yoshiharu Inaba , Asao Nishimura
CPC分类号： H05K1/181 , B23K1/0016 , B23K35/004 , B23K35/007 , B23K35/262 , B23K2101/40 , H01L23/488 , H01L23/49811 , H01L23/532 , H01L24/29 , H01L2224/83101 , H01L2924/01322 , H01L2924/15747 , H05K3/3426 , H05K3/3463 , H05K2201/10909 , Y02P70/613 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T428/12708 , Y10T428/12715 , H01L2924/00
摘要： A method of producing an electronic device by connecting a lead of a semiconductor device with an electrode of a circuit board to form a bonded structure. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.
摘要翻译： 一种通过将半导体器件的引线与电路板的电极连接以形成接合结构来制造电子器件的方法。 在接合结构中，通过Sn-Bi合金层将无铅Sn-Ag-Bi合金焊料施加到电极。 Sn-Bi合金优选含有1〜20重量％的Bi，以获得良好的焊料润湿性。 为了获得本发明中具有较高可靠性的理想的接合特性，在Sn-Bi合金层下方设置有铜层，从而获得足够的接合强度。
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