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    Solid electrolytic capacitor
    1.
    发明授权
    Solid electrolytic capacitor 有权
    固体电解电容器

    公开(公告)号：US07495892B2

    公开(公告)日：2009-02-24

    申请号：US11410975

    申请日：2006-04-26

    申请人： Yoshihiro Saida ,  Yoshifumi Asai ,  Hideki Oohata

    发明人： Yoshihiro Saida ,  Yoshifumi Asai ,  Hideki Oohata

    IPC分类号： H01G9/04 ,  H01G9/145

    CPC分类号： H01G9/042 ,  H01G9/012 ,  H01G9/055 ,  H01G9/15 ,  Y10T29/417

    摘要： The present invention relates to an anode substrate for a solid electrolytic capacitor which is produced by cutting obliquely a metal substrate comprising a valve-acting metal layer having fine pores and a valve-acting metal layer without fine pores, and having a cut surface which is formed by elongation of the valve-acting metal layer without fine pores dragged by a cutting blade; particularly to an anode substrate for a solid electrolytic capacitor which is produced by cutting obliquely a metal substrate comprising a valve-acting metal layer having fine pores and a valve-acting metal layer without fine pores, and a layer of the elongated valve-acting metal which is generated by that the valve-acting metal layer without fine pores is elongated being dragged along with a cutting blade and covers the edge part of the valve-acting layer having fine pores meets the requirement represented by the following formula: 0≦y/z≦1  [Formula 1] wherein y represents the thickness of the layer of the elongated valve-acting metal in the direction of the thickness of the substrate and z represents the thickness of the valve-acting layer having fine pores which is in contact with the elongated metal layer in the direction of the thickness of the substrate, respectively; and to a solid electrolytic capacitor comprising the above-mentioned anode substrate, an edge of which is chamfered at least partially.

    摘要翻译： 固体电解电容器用阳极基板技术领域本发明涉及一种固体电解电容器用阳极基板，其特征在于，所述固体电解电容器用阳极基板是将具有细孔的阀作用金属层和不具有细孔的阀作用金属层倾斜地切割成金属基板， 通过由作用力的金属层的延伸而形成，而没有由切割刀片拖动的细孔; 特别涉及一种固体电解电容器用阳极基板，该固体电解电容器是通过切割金属基板而制成的，所述金属基板包括具有细孔的阀作用金属层和没有细孔的阀作用金属层，以及细长阀作用金属 这是由没有细孔的阀作用金属层被拉长而与切割刀一起拖动并且覆盖具有细孔的阀作用层的边缘部分满足以下公式所示的要求：＆lt; line-formula description =“In-line Formulas”end =“lead”？> 0 <= y / z <= 1 [Formula 1] <？in-line-formula description =“In-line Formulas”end =“tail 其中y表示细长阀作用金属在基板厚度方向上的厚度，z表示与细长金属层接触的具有细孔的阀作用层的厚度 在基板的厚度方向上 分别 以及包括上述阳极基板的固体电解电容器，其边缘至少部分地被倒角。

    Solid electrolytic capacitor
    2.
    发明申请
    Solid electrolytic capacitor 有权
    固体电解电容器

    公开(公告)号：US20070030622A1

    公开(公告)日：2007-02-08

    申请号：US11410975

    申请日：2006-04-26

    申请人： Yoshihiro Saida ,  Yoshifumi Asai ,  Hideki Oohata

    发明人： Yoshihiro Saida ,  Yoshifumi Asai ,  Hideki Oohata

    IPC分类号： H01G4/255

    CPC分类号： H01G9/042 ,  H01G9/012 ,  H01G9/055 ,  H01G9/15 ,  Y10T29/417

    摘要： The present invention relates to an anode substrate for a solid electrolytic capacitor which is produced by cutting obliquely a metal substrate comprising a valve-acting metal layer having fine pores and a valve-acting metal layer without fine pores, and having a cut surface which is formed by elongation of the valve-acting metal layer without fine pores dragged by a cutting blade; particularly to an anode substrate for a solid electrolytic capacitor which is produced by cutting obliquely a metal substrate comprising a valve-acting metal layer having fine pores and a valve-acting metal layer without fine pores, and a layer of the elongated valve-acting metal which is generated by that the valve-acting metal layer without fine pores is elongated being dragged along with a cutting blade and covers the edge part of the valve-acting layer having fine pores meets the requirement represented by the following formula: 0≦y/z≦1  [Formula 1]wherein y represents the thickness of the layer of the elongated valve-acting metal in the direction of the thickness of the substrate and z represents the thickness of the valve-acting layer having fine pores which is in contact with the elongated metal layer in the direction of the thickness of the substrate, respectively; and to a solid electrolytic capacitor comprising the above-mentioned anode substrate, an edge of which is chamfered at least partially.

    摘要翻译： 固体电解电容器用阳极基板技术领域本发明涉及一种固体电解电容器用阳极基板，其特征在于，所述固体电解电容器用阳极基板是将具有细孔的阀作用金属层和不具有细孔的阀作用金属层倾斜地切割成金属基板， 通过由作用力的金属层的延伸而形成，而没有由切割刀片拖动的细孔; 特别涉及一种固体电解电容器用阳极基板，该固体电解电容器是通过切割金属基板而制成的，所述金属基板包括具有细孔的阀作用金属层和没有细孔的阀作用金属层，以及细长阀作用金属 这是由没有细孔的阀作用金属层被拉长而与切割刀一起拖动并且覆盖具有细孔的阀作用层的边缘部分满足以下公式所示的要求：＆lt; line-formula description =“In-line Formulas”end =“lead”？> 0 <= y / z <= 1 [Formula 1] <？in-line-formula description =“In-line Formulas”end =“tail 其中y表示细长阀作用金属在基板厚度方向上的厚度，z表示与细长金属层接触的具有细孔的阀作用层的厚度 在基板的厚度方向上 分别 以及包括上述阳极基板的固体电解电容器，其边缘至少部分地被倒角。

    Solid electrolytic capacitor and method for manufacturing same
    3.
    发明授权
    Solid electrolytic capacitor and method for manufacturing same 有权
    固体电解电容器及其制造方法

    公开(公告)号：US07848083B2

    公开(公告)日：2010-12-07

    申请号：US11993627

    申请日：2006-06-22

    申请人： Hideki Oohata ,  Yoshihiro Saida ,  Masayuki Shinoda

    发明人： Hideki Oohata ,  Yoshihiro Saida ,  Masayuki Shinoda

    IPC分类号： H01G9/04 ,  H01G9/145

    CPC分类号： H01G9/042 ,  H01G9/048 ,  H01G9/055 ,  H01G9/15 ,  Y10T29/417 ,  Y10T428/24496

    摘要： The invention relates to a substrate for solid electrolytic capacitor and a method for producing solid electrolytic capacitors using the substrate. By reducing at least part of the porous layer on the surface between the anode part region and the cathode part region of the substrate and preferably filling the dent generated by the reduction with a masking material, a structure ensuring insulation between the anode and the cathode can be obtained and solid electrolytic capacitors excellent in leakage current property and reliability can be obtained.

    摘要翻译： 本发明涉及固体电解电容器用基板和使用该基板的固体电解电容器的制造方法。 通过减少衬底的阳极部分区域和阴极部分区域之间的表面上的多孔层的至少一部分，并且优选地通过掩模材料填充通过还原产生的凹陷，确保阳极和阴极之间的绝缘的结构 可以获得具有优异的漏电流特性和可靠性的固体电解电容器。

    SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING SAME
    4.
    发明申请
    SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING SAME 有权
    固体电解电容器及其制造方法

    公开(公告)号：US20100039751A1

    公开(公告)日：2010-02-18

    申请号：US11993627

    申请日：2006-06-22

    申请人： Hideki Oohata ,  Yoshihiro Saida ,  Masayuki Shinoda

    发明人： Hideki Oohata ,  Yoshihiro Saida ,  Masayuki Shinoda

    IPC分类号： H01G9/15 ,  B32B3/30 ,  B29C59/16

    CPC分类号： H01G9/042 ,  H01G9/048 ,  H01G9/055 ,  H01G9/15 ,  Y10T29/417 ,  Y10T428/24496

    摘要： The invention relates to a substrate for solid electrolytic capacitor and a method for producing solid electrolytic capacitors using the substrate. By reducing at least part of the porous layer on the surface between the anode part region and the cathode part region of the substrate and preferably filling the dent generated by the reduction with a masking material, a structure ensuring insulation between the anode and the cathode can be obtained and solid electrolytic capacitors excellent in leakage current property and reliability can be obtained.

    摘要翻译： 本发明涉及固体电解电容器用基板和使用该基板的固体电解电容器的制造方法。 通过减少衬底的阳极部分区域和阴极部分区域之间的表面上的多孔层的至少一部分，并且优选地通过掩模材料填充通过还原产生的凹陷，确保阳极和阴极之间的绝缘的结构 可以获得具有优异的漏电流特性和可靠性的固体电解电容器。

    Solid electrolytic capacitor element and manufacturing method therefor
    5.
    发明授权
    Solid electrolytic capacitor element and manufacturing method therefor 有权
    固体电解电容器元件及其制造方法

    公开(公告)号：US08482902B2

    公开(公告)日：2013-07-09

    申请号：US12970058

    申请日：2010-12-16

    申请人： Kouhei Ishida ,  Yoshihiro Saida ,  Masaaki Nishioka

    发明人： Kouhei Ishida ,  Yoshihiro Saida ,  Masaaki Nishioka

    IPC分类号： H01G9/00 ,  H01G5/013

    CPC分类号： H01G9/15 ,  H01G9/0029 ,  Y10T29/417

    摘要： A solid electrolytic capacitor containing a solid electrolytic capacitor element with increased heat resistance, resistance to leakage current, and a low ESR and high reliability, includes a solid electrolytic capacitor element having a dielectric layer, a solid electrolyte layer, a carbon paste layer, and a conductive paste layer sequentially stacked on a surface of a valve acting metal plate, where the carbon paste layer has an end thereof on the solid electrolyte layer, the end of the carbon paste layer is covered with an insulating resin layer, and the largest thickness of the capacitor element in the section of the insulating resin layer is not more than the largest thickness of the capacitor element in the section of the conductive paste layer. A manufacturing method is also described.

    摘要翻译： 包含具有增加的耐热性，耐漏电流和低ESR和高可靠性的固体电解电容器元件的固体电解电容器包括具有电介质层，固体电解质层，碳糊层和 导电浆料层依次层叠在阀作用金属板的表面上，其中碳糊层的端部位于固体电解质层上，碳糊层的端部被绝缘树脂层覆盖，最大厚度 在绝缘树脂层的截面中的电容器元件的厚度不大于导电膏层的截面中的电容器元件的最大厚度。 还描述了制造方法。

    Crosslinked Self-Doping Type Electrically Conducting Polymer, Production Process Thereof, Product Coated With The Polymer And Electronic Device
    6.
    发明申请
    Crosslinked Self-Doping Type Electrically Conducting Polymer, Production Process Thereof, Product Coated With The Polymer And Electronic Device 有权
    交联自掺杂型导电聚合物，其制备方法，聚合物和电子器件涂覆的产品

    公开(公告)号：US20070194285A1

    公开(公告)日：2007-08-23

    申请号：US10593498

    申请日：2005-03-23

    申请人： Yoshihiro Saida ,  Takashi Ohkubo

    发明人： Yoshihiro Saida ,  Takashi Ohkubo

    IPC分类号： H01B1/12

    CPC分类号： C08G61/126 ,  C08G2261/135 ,  C08G2261/1452 ,  C08G2261/3223 ,  C08G2261/3243 ,  C08G2261/512 ,  C08G2261/76 ,  C08G2261/79 ,  H01B1/127 ,  H01L51/5088 ,  Y10T428/265 ,  Y10T428/31533

    摘要： The invention relates to a self-doping type electrically conducting polymer comprising an isothianaphthene or thiophene skeleton where the polymer chains are crosslinked preferably through a sulfone bond, as represented by formula (2) or (5) below, which is imparted with water resistance and solvent resistance; a production process thereof; an electrically conducting composition film obtained by coating a composition containing the self-doping type electrically conducting polymer on a substrate and heating it; a product coated using the composition; and an electronic device containing the self-doping type electrically conducting polymer: (wherein the symbols are as described in the specification).

    摘要翻译： 本发明涉及一种自掺杂型导电聚合物，其包含异硫茚或噻吩骨架，其中聚合物链优选通过砜键进行交联，如下式（2）或（5）所示，其赋予耐水性， 耐溶剂性; 其生产工艺; 通过将含有自掺杂型导电聚合物的组合物涂布在基板上并加热而获得的导电性组合物膜; 使用该组合物涂覆的产品; 和含有自掺杂型导电聚合物的电子器件（其中符号如说明书所述）。

    Preparation of polymer having isoindole structures
    7.
    发明授权
    Preparation of polymer having isoindole structures 失效
    具有异吲哚结构的聚合物的制备

    公开(公告)号：US4954590A

    公开(公告)日：1990-09-04

    申请号：US327875

    申请日：1989-03-23

    申请人： Haruo Yoshida ,  Nobuo Uotani ,  Yoshihiro Saida

    发明人： Haruo Yoshida ,  Nobuo Uotani ,  Yoshihiro Saida

    IPC分类号： C08G73/06 ,  C08G61/12 ,  H01B1/12

    CPC分类号： C08G61/124 ,  H01B1/127

    摘要： A polymer having an isoindole structure represented by the following general formula: ##STR1##wherein R.sup.1, R.sup.2 and R.sup.3 independently represent a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms, X.sup.- represents an anion of an electrolyte, y is a number of from 0.01 to 1, which indicates the proportion of the anion to 1 mole of the monomer, and n is a number of from 5 to 500, which indicates the degree of polymerization,shows a high electroconductivity when doped, and the stability of the polymer in the oxidized state is high. This polymer is obtained by subjecting an isoindole compound represented by the following general formula: ##STR2## wherein R.sup.1, R.sup.2 and R.sup.3 are as defined above, to (1) electrochemical polymerization in the presence of an electrolyte in a solvent or (2) oxidative polymerization in a solvent by the action of an oxidant.