公开(公告)号：US20070036930A1

公开(公告)日：2007-02-15

申请号：US11500118

申请日：2006-08-07

申请人： Tomohiro Kontani ,  Yoshinori Yoshida ,  Toshio Shintani ,  Kouji Akazawa

发明人： Tomohiro Kontani ,  Yoshinori Yoshida ,  Toshio Shintani ,  Kouji Akazawa

IPC分类号： B32B33/00

CPC分类号： B32B7/12 ,  B32B7/06 ,  B32B27/08 ,  B32B27/308 ,  B32B2309/105 ,  B32B2405/00 ,  C08L33/08 ,  C08L2666/04 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J133/08 ,  C09J2201/162 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2433/006 ,  Y10T428/14

摘要： To provide a pressure-sensitive adhesive sheet for use in processing wafers and the like articles, that produces less cutting sludge of the pressure-sensitive adhesive sheet and that can follow up unevenness of a wafer even when a difference in height of the unevenness is large, the pressure-sensitive adhesive sheet includes a base having on one surface thereof an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an initial elastic modulus of 0.5 N/mm2 or less, a loss tangent (tanδ) at 20° C. to 70° C. of 0.4 or more, and a gel fraction of 30% or more

摘要翻译： 为了提供用于处理晶片等物品的压敏粘合片，即使当凹凸的高度差大时，也可以产生较少的压敏粘合片的切割污泥，并且可以跟随晶片的不均匀性 所述粘合片具有在其一个表面上具有中间层和压敏粘合剂层的基体，其中所述中间层的初始弹性模量为0.5N / mm 2以下， 或更少，在20℃至70℃的损耗角正切（tandelta）为0.4或更大，凝胶分数为30％或更多

公开(公告)号：US20060257651A1

公开(公告)日：2006-11-16

申请号：US11383371

申请日：2006-05-15

申请人： Toshio Shintani ,  Tomokazu Takahashi ,  Syouji Yamamoto ,  Kazuyuki Kiuchi ,  Fumiteru Asai ,  Kouji Akazawa

发明人： Toshio Shintani ,  Tomokazu Takahashi ,  Syouji Yamamoto ,  Kazuyuki Kiuchi ,  Fumiteru Asai ,  Kouji Akazawa

IPC分类号： B32B7/12

CPC分类号： H01L21/6836 ,  B32B7/12 ,  C09J7/385 ,  C09J2203/326 ,  H01L21/6835 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2891

摘要： According to the invention, a pressure-sensitive adhesive sheet for use in dicing of a workpiece is provided which comprises a base film and at least a pressure-sensitive adhesive layer provided on the base film, wherein the pressure-sensitive adhesive layer comprises an acrylic polymer that contains at least 5% by weight of a monomer unit having an alkoxyl group in its side chain. According to the structure, there are provided a pressure-sensitive adhesive sheet for dicing that can produce good pickup performance even after a long time and a method of picking up a product worked with the pressure-sensitive adhesive sheet.

摘要翻译： 根据本发明，提供了一种用于切割工件的压敏粘合片，其包括基膜和至少设置在基膜上的压敏粘合剂层，其中压敏粘合剂层包含丙烯酸 在侧链中含有至少5重量％的具有烷氧基的单体单元的聚合物。 根据该结构，提供了即使经过长时间也能够获得良好的拾取性能的切割用粘合片，以及拾取用压敏粘合片加工的产品的方法。

公开(公告)号：US08388786B2

公开(公告)日：2013-03-05

申请号：US12720704

申请日：2010-03-10

申请人： Takashi Habu ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Akinori Nishio ,  Toshio Shintani

发明人： Takashi Habu ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Akinori Nishio ,  Toshio Shintani

IPC分类号： B32B37/00

CPC分类号： H01L21/304 ,  C09J133/066 ,  C09J2201/606 ,  C09J2203/326 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/3025

摘要： The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.

摘要翻译： 本发明提供一种用于保护半导体晶片的无基板用粘合片，其将在半导体晶片的背面磨削时粘贴到半导体晶片的前表面，该压敏粘合片由 压敏粘合剂层，其中压敏粘合剂层由含有主要由丙烯酸单体可聚合化合物组成的聚合物的UV可固化压敏粘合剂形成，压力表面的压敏粘合力 要粘附到半导体晶片的前表面的敏感粘合剂层大于其相对表面的压敏粘合力，并且压敏粘合剂层的初始弹性模量为0.01MPa至500MPa。

公开(公告)号：US07943235B2

公开(公告)日：2011-05-17

申请号：US11969023

申请日：2008-01-03

申请人： Akiyoshi Yamamoto ,  Toshio Shintani ,  Fumiteru Asai ,  Kouichi Hashimoto

发明人： Akiyoshi Yamamoto ,  Toshio Shintani ,  Fumiteru Asai ,  Kouichi Hashimoto

IPC分类号： B32B7/12 ,  B32B15/04 ,  C08L33/06 ,  C09B67/00

CPC分类号： H01L21/6836 ,  C08G18/672 ,  C08L61/00 ,  C08L2666/16 ,  C09D175/16 ,  C09J7/385 ,  C09J133/02 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/31 ,  H01L2221/68327 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2852 ,  Y10T428/2883 ,  Y10T428/2891

摘要： An adhesive sheet for processing semiconductor substrates comprises a UV rays- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer is formed using a multifunctional acrylate oligomer and/or monomer having a double bond, and is blended so as to result in 1 double bond per total average molecular weight of 225 to 8000 as determined on the basis of the weight average molecular weight of the multifunctional acrylate oligomer and/or monomer.

摘要翻译： 用于处理半导体衬底的粘合片包括紫外线和/或辐射透射性底膜和通过紫外线和/或辐射进行聚合固化反应的粘合剂层，其中粘合剂层使用多官能丙烯酸酯 低聚物和/或具有双键的单体，并且根据多官能丙烯酸酯低聚物和/或单体的重均分子量测定，共混以达到每平均分子量为225至8000的1双键 。

公开(公告)号：US20080057306A1

公开(公告)日：2008-03-06

申请号：US11892216

申请日：2007-08-21

申请人： Takatoshi Sasaki ,  Tomokazu Takahashi ,  Fumiteru Asai ,  Akiyoshi Yamamoto ,  Toshio Shintani

发明人： Takatoshi Sasaki ,  Tomokazu Takahashi ,  Fumiteru Asai ,  Akiyoshi Yamamoto ,  Toshio Shintani

IPC分类号： B32B7/12

CPC分类号： B23K26/18 ,  C09J7/29 ,  Y10T428/2848

摘要： An adhesive sheet for laser processing, comprises a base film and an adhesive layer laminated on the surface of the base film, wherein the base film has a melting protection layer on the back side thereof. According to the adhesive sheet for laser processing of the present invention, the melting of the base film caused by the local concentration of laser beam energy at the places irradiated with the laser beam can be effectively prevented. Accordingly, the back side of the base film can be prevented from locally adhering to the processing table in the dicing apparatus, and subsequent steps, namely, drawing the base film to separate the workpiece from the adhesive layer, and individually recovering these, can be carried out easily and efficiently.

摘要翻译： 一种用于激光加工的粘合片，包括基膜和层压在基膜表面上的粘合剂层，其中基膜在其背面具有熔融保护层。 根据本发明的激光加工用粘合片，能够有效地防止由激光束照射的部位的激光能量的局部浓度引起的基膜熔化。 因此，可以防止基膜的背面局部粘附在切割装置的处理台上，随后的步骤即拉出基膜以将粘合剂层分离出来，并单独地回收它们，可以是 轻松高效地进行。

公开(公告)号：US20140154450A1

公开(公告)日：2014-06-05

申请号：US14003974

申请日：2012-03-02

申请人： Takumi Yutou ,  Fumiteru Asai ,  Toshio Shintani ,  Toshitaka Suzuki ,  Minoru Hanaoka ,  Edwin Thys ,  Bart Forier

发明人： Takumi Yutou ,  Fumiteru Asai ,  Toshio Shintani ,  Toshitaka Suzuki ,  Minoru Hanaoka ,  Edwin Thys ,  Bart Forier

IPC分类号： C09J7/02

CPC分类号： C09J7/245 ,  C08K5/0016 ,  C08L27/06 ,  C09J2203/326 ,  C09J2205/106 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T428/1462 ,  Y10T428/2891

摘要： A polyvinyl chloride-based adhesive tape or sheet has a base material layer formed to include 10 to 40 parts by weight of plasticizing agent(s) in relation to 100 parts by weight of a polyvinyl chloride-based resin and an adhesive layer on one surface of the base material layer, the plasticizing agent includes at least one type of plasticizing agent having an SP value of at least 9.0.

摘要翻译： 聚氯乙烯类粘合带或片材具有基材层，该基材层形成为相对于100重量份的聚氯乙烯类树脂和在一个表面上的粘合剂层包含10〜40重量份的增塑剂 的基材层，增塑剂包括SP值至少为9.0的至少一种增塑剂。

公开(公告)号：US20080138618A1

公开(公告)日：2008-06-12

申请号：US11951605

申请日：2007-12-06

申请人： Takatoshi Sasaki ,  Fumiteru Asai ,  Toshio Shintani ,  Tomokazu Takahashi

发明人： Takatoshi Sasaki ,  Fumiteru Asai ,  Toshio Shintani ,  Tomokazu Takahashi

IPC分类号： B32B7/06 ,  C08F2/46

CPC分类号： H01L21/6836 ,  C08K5/0025 ,  C08L2312/06 ,  C09J7/385 ,  C09J139/06 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/302 ,  C09J2205/31 ,  H01L2221/68327 ,  H01L2924/3025 ,  Y10T428/2809

摘要： The present invention relates to a removable pressure-sensitive adhesive composition containing an acrylic polymer, a photopolymerization initiator and a crosslinking agent, in which the acrylic polymer and the photopolymerization initiator each are chemically bonded to the crosslinking agent. The present invention also relates to a removable pressure-sensitive adhesive composition containing an acrylic polymer and a photopolymerization initiator, the composition further containing a crosslinking agent having a reactive functional group which is capable of reacting with a reactive functional group of the acrylic polymer and a reactive functional group of the photopolymerization initiator.

摘要翻译： 本发明涉及含有丙烯酸类聚合物，光聚合引发剂和交联剂的可除去的压敏粘合剂组合物，其中丙烯酸类聚合物和光聚合引发剂各自与交联剂化学键合。 本发明还涉及含有丙烯酸类聚合物和光聚合引发剂的可除去的压敏粘合剂组合物，该组合物还含有具有能够与丙烯酸类聚合物的反应性官能团反应的反应性官能团的交联剂和 光聚合引发剂的反应性官能团。

公开(公告)号：US20080108262A1

公开(公告)日：2008-05-08

申请号：US11931124

申请日：2007-10-31

申请人： Fumiteru Asai ,  Takatoshi Sasaki ,  Toshio Shintani ,  Tomokazu Takahashi ,  Tsubasa Miki ,  Akiyoshi Yamamoto

发明人： Fumiteru Asai ,  Takatoshi Sasaki ,  Toshio Shintani ,  Tomokazu Takahashi ,  Tsubasa Miki ,  Akiyoshi Yamamoto

IPC分类号： D03D9/00 ,  B32B7/00

CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  B26F3/004 ,  C09J7/21 ,  C09J7/22 ,  C09J2201/20 ,  C09J2203/326 ,  H01L21/78 ,  H01L2221/68327 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T442/10

摘要： The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film which has a mean opening diameter of 5 μm to 30 μm. According to the adhesive sheet of the invention, a base film having a mean opening diameter of a certain size is used, thus ensuring better permeability to liquids originating in a liquid stream, and preventing the material that is being processed from being separated by the liquids from the adhesive sheet. In addition, the relatively low mean opening diameter makes it possible to control rippling on the surface of the base film and kept the surface flat, resulting in better adhesion to the material being processed and ensuring that the material being processed is secured during the dicing stage. The ability to improve the adhesion between the base film and the adhesive layer also makes it possible to prevent the separation of the adhesive form the base film and the adhesion of the adhesion on the material being processed when picked up after dicing.

摘要翻译： 本发明提供一种水喷射激光切割用粘合片，其特征在于，具有层叠在平均开口直径为5〜30μm的基底膜上的粘合剂层。 根据本发明的粘合片，使用具有一定尺寸的平均开口直径的基膜，从而确保对来自液体流的液体的更好的渗透性，并且防止被处理的材料被液体分离 从粘合片。 另外，相对低的平均开口直径使得可以控制基膜的表面上的波纹并保持表面平坦，导致对被处理材料的更好的附着力，并确保在切割阶段期间确保正在加工的材料 。 提高基膜和粘合剂层之间的粘合力的能力也使得可以防止粘合剂从基膜剥离，以及在切割后拾取时对待处理材料的粘合的粘附。

公开(公告)号：US20080085397A1

公开(公告)日：2008-04-10

申请号：US11905567

申请日：2007-10-02

申请人： Fumiteru Asai ,  Toshio Shintani ,  Takatoshi Sasaki ,  Akiyoshi Yamamoto ,  Tomokazu Takahashi

发明人： Fumiteru Asai ,  Toshio Shintani ,  Takatoshi Sasaki ,  Akiyoshi Yamamoto ,  Tomokazu Takahashi

IPC分类号： B32B33/00 ,  B32B7/12

CPC分类号： H01L21/6836 ,  B23K26/40 ,  B23K2103/50 ,  C09J7/22 ,  C09J7/241 ,  C09J7/29 ,  C09J2201/162 ,  C09J2205/114 ,  C09J2423/006 ,  H01L21/78 ,  H01L2221/68327 ,  Y10T428/24355 ,  Y10T428/28

摘要： An adhesive sheet for laser processing comprises an adhesive layer laminated on the surface of a base film, wherein the base film has a textured contact-reducing layer on the back side thereof. According to the adhesive sheet for laser processing of the present invention, the melting of the base film caused by the local concentration of laser beam energy at the places irradiated with the laser beam can be effectively prevented. Accordingly, the back side of the base film can be prevented from locally adhering to the processing table in the dicing apparatus, and subsequent steps, namely, drawing the base film to separate the workpiece from the adhesive layer, and individually recovering these, can be carried out easily and efficiently.

摘要翻译： 用于激光加工的粘合片包括层压在基膜的表面上的粘合剂层，其中所述基膜在其背面具有纹理化的接触减少层。 根据本发明的激光加工用粘合片，能够有效地防止由激光束照射的部位的激光能量的局部浓度引起的基膜熔化。 因此，可以防止基膜的背面局部粘附在切割装置的处理台上，随后的步骤即拉出基膜以将粘合剂层分离出来，并单独地回收它们，可以是 轻松高效地进行。

公开(公告)号：US20080057253A1

公开(公告)日：2008-03-06

申请号：US11892567

申请日：2007-08-24

申请人： Takatoshi Sasaki ,  Tsubasa Miki ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

发明人： Takatoshi Sasaki ,  Tsubasa Miki ,  Fumiteru Asai ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

IPC分类号： B65D65/28 ,  B32B7/12

CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  C09J7/20 ,  C09J2201/20 ,  C09J2203/326 ,  C09J2407/00 ,  C09J2409/00 ,  C09J2423/006 ,  C09J2433/00 ,  H01L2221/68327 ,  Y10T428/15 ,  Y10T428/28 ,  Y10T428/2852

摘要： An adhesive sheet for water jet laser dicing, comprises an adhesive layer laminated on a base film, wherein the adhesive constituting the adhesive layer is an energy radiation curing type adhesive, and said adhesive sheet has an adhesive strength of at least 1.5 N/20 mm.

摘要翻译： 一种用于水射流激光切割的粘合片，包括层压在基膜上的粘合剂层，其中构成粘合剂层的粘合剂是能量辐射固化型粘合剂，并且所述粘合片具有至少1.5N / 20mm的粘合强度 。