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    Wafer transport method
    1.
    发明授权
    Wafer transport method 失效
    晶圆输送方式

    公开(公告)号：US5562800A

    公开(公告)日：1996-10-08

    申请号：US308442

    申请日：1994-09-19

    申请人： Yoshio Kawamura ,  Yoshifumi Kawamoto ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Natsuki Yokoyama ,  Eiichi Murakami ,  Yoshinori Nakayama ,  Eiichi Seya

    发明人： Yoshio Kawamura ,  Yoshifumi Kawamoto ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Natsuki Yokoyama ,  Eiichi Murakami ,  Yoshinori Nakayama ,  Eiichi Seya

    IPC分类号： B65G49/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/677

    CPC分类号： H01L21/67748 ,  H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  Y10S414/135 ,  Y10S414/139 ,  Y10S438/935

    摘要： A wafer transport method includes the steps of preparing a semiconductor process equipment having a transport chamber and a process chamber. An interface means connects the transport chamber to the process chamber. A transport means transports a semiconductor wafer from the transport chamber to the process chamber by way of the interface means. The transport means mounting a substrate is inserted into a communicating corridor including a supply means and an exhaust means. The substrate is transported while performing the supply and exhaust by sequentially controlling a supply shutoff means, an exhaust shutoff means, and a communicating shutoff means according to the position of a conductance part formed of a gap between the transport means and the communicating corridor. Thus, the substrate is transported at a high throughput without contamination of the substrate while keeping the different atmospheric conditions for the transport chamber and the process chamber, thereby manufacturing a semiconductor device with high performance capabilities.

    摘要翻译： 晶片输送方法包括准备具有输送室和处理室的半导体工艺设备的步骤。 接口装置将输送室连接到处理室。 传送装置通过接口装置将半导体晶片从传送室传送到处理室。 安装基板的输送装置被插入到包括供给装置和排气装置的通信走廊中。 通过根据由输送装置和通信走廊之间的间隙形成的电导部分的位置依次控制供给切断装置，排气关闭装置和通信切断装置，在进行供给和排出的同时运送基板。 因此，在保持输送室和处理室的不同大气条件的同时，以高通量输送基板而不污染基板，从而制造具有高性能的半导体器件。

    Wafer transport method
    2.
    发明授权
    Wafer transport method 失效
    晶圆输送方式

    公开(公告)号：US5601686A

    公开(公告)日：1997-02-11

    申请号：US642510

    申请日：1996-05-03

    申请人： Yoshio Kawamura ,  Yoshifumi Kawamoto ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Natsuki Yokoyama ,  Eiichi Murakami ,  Yoshinori Nakayama ,  Eiichi Seya

    发明人： Yoshio Kawamura ,  Yoshifumi Kawamoto ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Natsuki Yokoyama ,  Eiichi Murakami ,  Yoshinori Nakayama ,  Eiichi Seya

    IPC分类号： B65G49/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/677

    CPC分类号： H01L21/67748 ,  H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  Y10S414/135 ,  Y10S414/139 ,  Y10S438/935

    摘要： A wafer transport method including the steps of preparing a semiconductor process equipment having a transport chamber, a process chamber, an interface means for connecting the transport chamber to the process chamber, and a transport means for transporting a semiconductor wafer from the transport chamber to the process chamber by way of the interface means; inserting the transport means mounting a substrate in a communicating corridor including a supply means and an exhaust means; and transporting the substrate while performing the supply and exhaust by sequentially controlling a supply shutoff means, an exhaust shutoff means, and a communicating shutoff means according to the position of a conductance part formed of a gap between the transport means and the communicating corridor. With this method, the substrate is transported at a high throughput without the contamination on the substrate while keeping the different atmospheric conditions of the transport chamber and the process chamber, thereby manufacturing a semiconductor device with a high performance.

    摘要翻译： 一种晶片输送方法，包括以下步骤：制备具有输送室的半导体工艺设备，处理室，用于将输送室连接到处理室的接口装置，以及用于将半导体晶片从输送室输送到 处理室; 将安装基板的输送装置插入包括供给装置和排气装置的通信走廊中; 并且通过根据由传送装置和通信走廊之间的间隙形成的电导部分的位置顺序地控制供给关闭装置，排气关闭装置和连通关闭装置，在执行供应和排出的同时运送基板。 利用该方法，在保持输送室和处理室的不同大气条件的同时，以高通量输送基板而不会在基板上产生污染，从而制造具有高性能的半导体器件。