公开(公告)号：US20060111805A1

公开(公告)日：2006-05-25

申请号：US11320778

申请日：2005-12-30

Applicant: Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

Inventor： Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

IPC: G06F19/00

CPC classification number: C23C14/568 ,  C23C16/54 ,  G05B19/41865 ,  G05B2219/45031 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67745 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S438/908 ,  Y10T29/41

Abstract: A fabricating method for a system including a plurality of processing apparatuses connected to each other by an inter-apparatus transporter. The semiconductor waters are processed in the processing apparatuses and are transported to specified processing apparatuses in different time interval that are set to N times a unit time interval. Since the fabricating system includes processing apparatuses and an inter-apparatus transporter that are periodically controlled at time intervals related to a unit time, intervals related to a unit time, the scheduling of a plurality of works can be made efficiently to enhance the level of optimization, thus improving the productivity.

Abstract translation: 一种用于系统的制造方法，包括通过机构间运送器彼此连接的多个处理装置。 半导体水在处理装置中进行处理，并以不同的时间间隔被传送到规定的处理装置，时间间隔设定为单位时间间隔的N倍。 由于制造系统包括以与单位时间相关的时间间隔周期性地控制的处理装置和装置间运送器，所以与单位时间相关的间隔，可以有效地进行多个作品的调度以增强优化级别 ，从而提高生产率。

公开(公告)号：US5981399A

公开(公告)日：1999-11-09

申请号：US894308

申请日：1997-08-14

Applicant: Yoshio Kawamura ,  Tatuharu Yamamoto ,  Shigeo Moriyama ,  Yoshifumi Kawamoto ,  Natsuki Yokoyama ,  Fumihiko Uchida ,  Minoru Hidaka ,  Miyako Matsui

Inventor： Yoshio Kawamura ,  Tatuharu Yamamoto ,  Shigeo Moriyama ,  Yoshifumi Kawamoto ,  Natsuki Yokoyama ,  Fumihiko Uchida ,  Minoru Hidaka ,  Miyako Matsui

IPC: B65G49/07 ,  H01L21/00 ,  H01L21/677

CPC classification number: H01L21/67167 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67748

Abstract: A semiconductor device fabrication apparatus having multiple processing chambers for different processes, where a substrate is carried in and out in a sophisticated manner, with their different internal ambient conditions being retained, so that the substrate is free from contamination, thereby manufacturing high-quality semiconductor devices at high throughput. The apparatus includes a movable buffer chamber having a wafer carriage means within a transfer chamber which faces a process chamber, an evacuation means which evacuates of gas the buffer chamber, transfer chamber and process chamber independently, a gas feed means, and a control means.

Abstract translation: PCT No.PCT / JP95 / 00210 Sec。 371日期1997年8月14日 102（e）日期1997年8月14日PCT提交1995年2月15日PCT公布。 公开号WO96 / 25760 PCT 日期1996年8月22日一种半导体器件制造装置，具有用于不同工艺的多个处理室，其中衬底以复杂的方式进出，同时保持其不同的内部环境条件，使得衬底没有污染，从而 以高产量制造高品质半导体器件。 该装置包括可移动缓冲室，其具有面向处理室的传送室内的晶片托架装置，独立地排出缓冲室，传送室和处理室的气体的抽气装置，气体供给装置和控制装置。

公开(公告)号：US5562800A

公开(公告)日：1996-10-08

申请号：US308442

申请日：1994-09-19

Applicant: Yoshio Kawamura ,  Yoshifumi Kawamoto ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Natsuki Yokoyama ,  Eiichi Murakami ,  Yoshinori Nakayama ,  Eiichi Seya

Inventor： Yoshio Kawamura ,  Yoshifumi Kawamoto ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Natsuki Yokoyama ,  Eiichi Murakami ,  Yoshinori Nakayama ,  Eiichi Seya

IPC: B65G49/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/677

CPC classification number: H01L21/67748 ,  H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  Y10S414/135 ,  Y10S414/139 ,  Y10S438/935

Abstract: A wafer transport method includes the steps of preparing a semiconductor process equipment having a transport chamber and a process chamber. An interface means connects the transport chamber to the process chamber. A transport means transports a semiconductor wafer from the transport chamber to the process chamber by way of the interface means. The transport means mounting a substrate is inserted into a communicating corridor including a supply means and an exhaust means. The substrate is transported while performing the supply and exhaust by sequentially controlling a supply shutoff means, an exhaust shutoff means, and a communicating shutoff means according to the position of a conductance part formed of a gap between the transport means and the communicating corridor. Thus, the substrate is transported at a high throughput without contamination of the substrate while keeping the different atmospheric conditions for the transport chamber and the process chamber, thereby manufacturing a semiconductor device with high performance capabilities.

Abstract translation: 晶片输送方法包括准备具有输送室和处理室的半导体工艺设备的步骤。 接口装置将输送室连接到处理室。 传送装置通过接口装置将半导体晶片从传送室传送到处理室。 安装基板的输送装置被插入到包括供给装置和排气装置的通信走廊中。 通过根据由输送装置和通信走廊之间的间隙形成的电导部分的位置依次控制供给切断装置，排气关闭装置和通信切断装置，在进行供给和排出的同时运送基板。 因此，在保持输送室和处理室的不同大气条件的同时，以高通量输送基板而不污染基板，从而制造具有高性能的半导体器件。

公开(公告)号：US07603194B2

公开(公告)日：2009-10-13

申请号：US12153926

申请日：2008-05-28

Applicant: Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

Inventor： Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

IPC: G06F19/00

CPC classification number: C23C14/568 ,  C23C16/54 ,  G05B19/41865 ,  G05B2219/45031 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67745 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S438/908 ,  Y10T29/41

Abstract: A fabricating method for a system that includes a plurality of processing apparatuses connected to each other by an inter-apparatus transporter and a computer storing managing information of processing and transporting of semiconductor wafers. The processing apparatuses have an interface for loading and unloading a plurality of the semiconductor wafers that are contained in a carrier. The semiconductor waters are processed in processing chambers of the processing apparatuses and the result of processing is monitored. In the processing, a first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus is transported toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus, according to the managing information.

Abstract translation: 一种系统的制造方法，其包括通过机器间运输机彼此连接的多个处理装置和存储管理半导体晶片的处理和传输信息的计算机。 处理装置具有用于装载和卸载容纳在载体中的多个半导体晶片的界面。 在处理装置的处理室中处理半导体水，并监视处理结果。 在处理中，在卸载包含在第二处理中处理的半导体晶片的第二载体之前，将包含在第一处理装置中处理的多个半导体晶片的第一载体通过装置间传送器传送到第二处理装置 装置，根据管理信息。

公开(公告)号：US5858863A

公开(公告)日：1999-01-12

申请号：US722944

申请日：1996-09-27

Applicant: Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

Inventor： Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

IPC: B65G49/07 ,  B23Q41/00 ,  B23Q41/02 ,  C23C14/56 ,  C23C16/54 ,  G05B19/418 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/205 ,  H01L21/285 ,  H01L21/304 ,  H01L21/3065 ,  H01L21/3205 ,  H01L21/677 ,  H01L21/68

CPC classification number: C23C14/568 ,  C23C16/54 ,  G05B19/41865 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67745 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S438/908 ,  Y10T29/41

Abstract: Disclosed is a fabricating system including a plurality of processing apparatuses connected to each other by means of an inter-apparatus transporter, wherein one group of semiconductor wafers are processed in processing apparatuses and other group of wafers are transported to specified processing apparatuses for a time interval from (To+T) to a time To; and another group of wafers are processed and the remaining group of wafers are transported for a time interval from (To+T) to (To+2T). Since processing apparatuses can receive at least one of works from the inter-apparatus transporter for a time interval T min, the distribution of works from the transporter to processing apparatuses is completed for the time interval T min. The transporter is emptied for each time interval T min, and works are unloaded to the emptied transporter, which makes easy the scheduling, control and management of the transporting of a plurality of works in the fabricating system. Moreover, since the fabricating system including processing apparatuses is periodically controlled at a cycle time T min, the scheduling of a plurality of works can be made easy, to enhance the level of optimization, thus improving the productivity.

Abstract translation: 公开了一种制造系统，其包括通过机构间传送器彼此连接的多个处理装置，其中一组半导体晶片在处理装置中被处理，并且其他组的晶片被传送到指定的处理装置一段时间间隔 从（To + T）到一个时间To; 并且处理另一组晶片，并且剩余的晶片组从（To + T）到（To + 2T）的时间间隔被传输。 由于处理装置可以从时间间隔T min接收来自装置间运送装置的作品中的至少一个，因此在时间间隔T min内完成从运送装置到处理装置的作品的分配。 在每个时间间隔T min内运输运输车被清空，并且卸载到排空运输车，这使得在制造系统中运输多个作业的调度，控制和管理变得容易。 此外，由于包括处理装置的制造系统在周期时间T min周期性地进行控制，因此能够容易地进行多个作业的调度，提高优化等级，提高生产率。

公开(公告)号：US5628828A

公开(公告)日：1997-05-13

申请号：US397991

申请日：1995-03-03

Applicant: Yoshio Kawamura ,  Shigeo Moriyama ,  Tatuharu Yamamoto ,  Fumihiko Uchida

Inventor： Yoshio Kawamura ,  Shigeo Moriyama ,  Tatuharu Yamamoto ,  Fumihiko Uchida

IPC: H01L21/677 ,  C23C16/44 ,  C23C16/458 ,  C23C16/54 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  C23C16/00

CPC classification number: H01L21/67167 ,  C23C16/4412 ,  C23C16/4583 ,  C23C16/54 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67748 ,  Y10S414/139

Abstract: Process equipment and method for processing a semiconductor device comprising a buffer chamber, at least one process chamber connected to the buffer chamber through an opening portion, a holding/carrying unit disposed at a position facing the opening portion for holding and carrying a member to be processed such as a wafer, and a carrier unit disposed in the buffer chamber for transferring the member to be processed to and from the holding/carrying unit. The holding/carrying unit includes a flattened surface closely facing the opening portion for holding an atmosphere in the at least one process chamber independently from an atmosphere in the buffer chamber. The opening portion has a flattened surface closely facing the flattened surface of the holding/carrying unit.

Abstract translation: 用于处理半导体器件的工艺设备和方法，包括缓冲室，通过开口部连接到缓冲室的至少一个处理室，设置在面向开口部分的位置处的保持/承载单元，用于保持和承载构件 处理如晶片，以及设置在缓冲室中的载体单元，用于将待加工的构件传送到保持/携带单元。 保持/携带单元包括紧密面向开口部分的平坦表面，用于独立于缓冲室中的气氛保持至少一个处理室中的气氛。 开口部具有与保持/承载单元的平坦表面紧密相对的平坦表面。

公开(公告)号：US07310563B2

公开(公告)日：2007-12-18

申请号：US11320778

申请日：2005-12-30

Applicant: Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

Inventor： Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

IPC: G06F19/00

CPC classification number: C23C14/568 ,  C23C16/54 ,  G05B19/41865 ,  G05B2219/45031 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67745 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S438/908 ,  Y10T29/41

Abstract: A fabricating method for a system including a plurality of processing apparatuses connected to each other by an inter-apparatus transporter. The semiconductor waters are processed in the processing apparatuses and are transported to specified processing apparatuses in different time interval that are set to N times a unit time interval. Since the fabricating system includes processing apparatuses and an inter-apparatus transporter that are periodically controlled at time intervals related to a unit time, intervals related to a unit time, the scheduling of a plurality of works can be made efficiently to enhance the level of optimization, thus improving the productivity.

Abstract translation: 一种用于系统的制造方法，包括通过机构间运送器彼此连接的多个处理装置。 半导体水在处理装置中进行处理，并以不同的时间间隔被传送到规定的处理装置，时间间隔设定为单位时间间隔的N倍。 由于制造系统包括以与单位时间相关的时间间隔周期性地控制的处理装置和装置间运输装置，所以与单位时间相关的间隔，可以有效地进行多个作业的调度以增强优化水平 ，从而提高生产率。

公开(公告)号：US20060111802A1

公开(公告)日：2006-05-25

申请号：US11320610

申请日：2005-12-30

Applicant: Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

Inventor： Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

IPC: G06F19/00

CPC classification number: C23C14/568 ,  C23C16/54 ,  G05B19/41865 ,  G05B2219/45031 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67745 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S438/908 ,  Y10T29/41

Abstract: A fabricating method for a system including a plurality of processing apparatuses connected to each other by an inter-apparatus transporter. The semiconductor waters are processed in the processing apparatuses and are transported to specified processing apparatuses in different time interval that are set to N times a unit time interval. Since the fabricating system includes processing apparatuses and an inter-apparatus transporter that are periodically controlled at time intervals related to a unit time, intervals related to a unit time, the scheduling of a plurality of works can be made efficiently to enhance the level of optimization, thus improving the productivity.

公开(公告)号：US5820679A

公开(公告)日：1998-10-13

申请号：US713192

申请日：1996-09-12

Applicant: Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

Inventor： Natsuki Yokoyama ,  Yoshifumi Kawamoto ,  Eiichi Murakami ,  Fumihiko Uchida ,  Kenichi Mizuishi ,  Yoshio Kawamura

IPC: B65G49/07 ,  B23Q41/00 ,  B23Q41/02 ,  C23C14/56 ,  C23C16/54 ,  G05B19/418 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/205 ,  H01L21/285 ,  H01L21/304 ,  H01L21/3065 ,  H01L21/3205 ,  H01L21/677 ,  H01L21/68 ,  C23C16/00

CPC classification number: C23C14/568 ,  C23C16/54 ,  G05B19/41865 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67745 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S438/908 ,  Y10T29/41

Abstract: Disclosed is a fabricating system including a plurality of processing apparatuses connected to each other by means of an inter-apparatus transporter, wherein one group of semiconductor wafers are processed in processing apparatuses and other group of wafers are transported to specified processing apparatuses for a time interval from (To+T) to a time To; and another group of wafers are processed and the remaining group of wafers are transported for a time interval from (To+T) to (To+2T). Since processing apparatuses can receive at least one of works from the inter-apparatus transporter for a time interval T min, the distribution of works from the transporter to processing apparatuses is completed for the time interval T min. The transporter is emptied for each time interval T min, and works are unloaded to the emptied transporter, which makes easy the scheduling, control and management of the transporting of a plurality of works in the fabricating system. Moreover, since the fabricating system including processing apparatuses is periodically controlled at a cycle time T min, the scheduling of a plurality of works can be made easy, to enhance the level of optimization, thus improving the productivity.

公开(公告)号：US4739161A

公开(公告)日：1988-04-19

申请号：US870814

申请日：1986-06-05

Applicant: Shigeo Moriyama ,  Fumihiko Uchida

Inventor： Shigeo Moriyama ,  Fumihiko Uchida

IPC: G01B11/00 ,  G01B11/02 ,  G01C3/00 ,  G01C3/06 ,  G01C3/08 ,  H01J5/16

CPC classification number: G01B11/026

Abstract: A fine displacement transducer, wherein either end of a first and a second optical fibers which are mutually adjacent are respectively provided in alignment with each other opposed to the reflection surface and the illuminating light is made incident from the one end of the first optical fiber and the light irradiated from the other end of the first optical fiber is made to illuminate its reflection surface, while the reflected light therefrom is received by the second optical fiber, so that the amount of displacement of the reflection surface relative to both end surfaces of the second optical fiber can be detected from the variation of intensity of the received light, and a measuring system wherein the reflected light from the reflection surface is received by either of the second or a separately provided third optical fiber to detect the intensity of received light for converting it into the electric signal.

Abstract translation: 精细位移传感器，其中彼此相邻的第一和第二光纤的任一端分别设置成与反射表面相对准，并且照明光从第一光纤的一端入射， 使从第一光纤的另一端照射的光照射其反射面，同时其反射光被第二光纤接收，使得反射面相对于第二光纤的两个端面的位移量 可以从接收光的强度的变化来检测第二光纤，以及测量系统，其中来自反射表面的反射光由第二光纤或单独提供的第三光纤中的任一个接收，以检测接收光的强度 将其转换为电信号。