摘要:
A wafer transport method includes the steps of preparing a semiconductor process equipment having a transport chamber and a process chamber. An interface means connects the transport chamber to the process chamber. A transport means transports a semiconductor wafer from the transport chamber to the process chamber by way of the interface means. The transport means mounting a substrate is inserted into a communicating corridor including a supply means and an exhaust means. The substrate is transported while performing the supply and exhaust by sequentially controlling a supply shutoff means, an exhaust shutoff means, and a communicating shutoff means according to the position of a conductance part formed of a gap between the transport means and the communicating corridor. Thus, the substrate is transported at a high throughput without contamination of the substrate while keeping the different atmospheric conditions for the transport chamber and the process chamber, thereby manufacturing a semiconductor device with high performance capabilities.
摘要:
A wafer transport method including the steps of preparing a semiconductor process equipment having a transport chamber, a process chamber, an interface means for connecting the transport chamber to the process chamber, and a transport means for transporting a semiconductor wafer from the transport chamber to the process chamber by way of the interface means; inserting the transport means mounting a substrate in a communicating corridor including a supply means and an exhaust means; and transporting the substrate while performing the supply and exhaust by sequentially controlling a supply shutoff means, an exhaust shutoff means, and a communicating shutoff means according to the position of a conductance part formed of a gap between the transport means and the communicating corridor. With this method, the substrate is transported at a high throughput without the contamination on the substrate while keeping the different atmospheric conditions of the transport chamber and the process chamber, thereby manufacturing a semiconductor device with a high performance.
摘要:
Disclosed is a scanning electron microscope provided with a calculation device (403) for measuring the dimension of a pattern on a sample (413), characterized in that the amount of change of a pattern shape, caused by electron beam irradiation, is calculated and stored, and a pattern shape contour (614; 815; 1512) before the sample is irradiated with an electron beam is restored from a pattern shape contour (613; 814; 1511) in a scanning electron microscope image (612; 813; 1510) after the sample is irradiated with an electron beam using the calculated amount and, then, the pattern shape contour (614; 815; 1512) is displayed. Thus, the shrinking of a resist and/or the effect of electrostatic charge caused when a sample is irradiated with an electron beam are eliminated, so that the shape contour of a two-dimensional pattern before irradiating an electron beam can be restored with a high degree of accuracy, and the dimension of a pattern can be measured with a high degree of accuracy, using the restored image.
摘要:
In order to provide a pattern dimension measurement method with a small measured error and excellent reproducibility even though defocus occurs and a charged particle beam microscope used in the same, in a method for applying a charged particle beam to a specimen formed with a pattern to measure a pattern dimension from a signal intensity distribution of signal charged particles from the specimen, edge index positions (X1) and (X2) on the right and left of the maximum point of signal intensity corresponding to a pattern edge are calculated by a threshold method, and a pattern edge position (Xe) is found from a mean value between the positions. Thus, it is possible to reduce the influence of defocus on the pattern edge position (Xe).
摘要:
A standard component for length measurement includes a first diffraction grating and a second diffraction grating. Each of components of the second diffraction grating is disposed between components of the first diffraction grating.
摘要:
A method for enabling management of fatal defects of semiconductor integrated patterns easily, the method enables storing of design data of each pattern designed by a semiconductor integrated circuit designer, as well as storing of design intent data having pattern importance levels ranked according to their design intents respectively. The method also enables anticipating of defects to be generated systematically due to the characteristics of the subject exposure system, etc. while each designed circuit pattern is exposed and delineated onto a wafer in a simulation carried out beforehand and storing those defects as hot spot information. Furthermore, the method also enables combining of the design intent data with hot spot information to limit inspection spots that might include systematic defects at high possibility with respect to the characteristics of the object semiconductor integrated circuit and shorten the defect inspection time significantly.
摘要:
The invention provides a standard component for calibration that enables a calibration position to be easily specified in order to calibrate accurately a scale factor in the electron-beam system, and provides an electron-beam system using it. High-accuracy metrology calibration capable of specifying a calibration position can be realized by forming a mark pattern or labeled material for identifying the calibration position in proximity of a superlattice pattern of the standard component for system calibration. The standard component for calibration is one that calibrates a scale factor of an electron-beam system based on a signal of secondary charged particles detected by irradiation of a primary electron beam emitted from the electron-beam system on a substrate having a cross section of a superlattice of a multi-layer structure in which different materials are deposited alternately. The substrate have linear patterns that are on the substrate surface parallel to the multi-layer and are arranged at a fixed interval in a direction crossing the cross section of the superlattice pattern, and is so configured that the cross sections of the linear patterns may exist on substantially the same plane of the superlattice cross section, so that the linear patterns enable a position of the superlattice pattern to be identified.
摘要:
An electron-beam metrology system includes a specimen stage to mount a specimen on which a device pattern is formed, electron optics to radiate the device pattern with an electron-beam, a secondary electron detector to detect a secondary electron generated by the radiation of the electron-beam, and an information processing system to analyze a signal obtained from the secondary electron detector. A standard reference for metrology is held on the specimen stage, and the standard reference includes a first grating unit pattern including an array of gratings having pitch sizes which are verified by an optical method, and a second grating unit pattern including an array of gratings having pitch sizes which are smaller than the pitch sizes of the first grating unit pattern.
摘要:
The positions of diffraction gratings used for calibration can be checked easily by arranging marks near the diffraction gratings, the marks indicating the coordinate positions of the diffraction gratings. Dummy patterns including a pattern of cross marks are arranged around the array of the diffraction gratings. Consequently, a uniform diffraction grating pattern is accomplished in which the proximity effect is uniform across the diffraction grating array. Furthermore, cross marks can be disposed adjacent to the diffraction grating array. Therefore, the diffraction gratings can be placed in position and calibrated accurately and easily by using a standard component capable of realizing accurate positioning of the diffraction gratings. Hence, accurate metrology calibration coping with the next generation of semiconductor lithography technology can be accomplished.
摘要:
A deflector which deflects a charged particle beam includes a substrate having an opening through which the charged particle beam should pass, and a deflection electrode which is arranged in the opening to deflect the charged particle beam and has a first conductive member and second conductive member which are formed by plating. The second conductive member is formed on a surface of the first conductive member and is essentially made of a material that is more difficult to oxidize than the first conductive member.