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1.发明授权Apparatus for detaching a head slider joined to a mounting plate of suspension 有权用于拆卸连接到悬架的安装板的磁头滑块的装置公开(公告)号：US08099862B2
公开(公告)日：2012-01-24
申请号：US12285000
申请日：2008-09-25
申请人： Yoshio Uematsu , Kenjirou Watanabe , Takuya Satoh
发明人： Yoshio Uematsu , Kenjirou Watanabe , Takuya Satoh
CPC分类号： G11B5/4826 , G11B5/4853 , Y10T29/49023 , Y10T29/49027 , Y10T29/53165 , Y10T29/53261 , Y10T29/53274 , Y10T29/53283
摘要： An apparatus for detaching a head slider bonded onto a mounting plate of a suspension includes a platform on which a head gimbal assembly is mounted; a heating device for heating a joint section between the head slider and the suspension to decrease the bonding force; a latching part for latching the mounting plate at a position on a center line of the mounting plate in the lengthwise direction and/or at positions symmetric about the center line; and a clamp device for moving the head slider in a direction along the center line with the heating to detach the head slider from the mounting plate.
摘要翻译： 用于拆卸粘合到悬架的安装板上的磁头滑块的装置包括：平台，安装有磁头万向架组件; 加热装置，用于加热头部滑块和悬架之间的接合部分以降低接合力; 用于将安装板在长度方向上的中心线的中心线的位置和/或关于中心线对称的位置处锁定的闩锁部分; 以及夹持装置，用于沿着具有加热的中心线的方向移动头部滑块，以将头部滑块从安装板上分离。
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2.发明申请Method for manufacturing head gimbal assembly and apparatus for detaching head slider joined to mounting plate of suspension 有权用于制造头万向架组件的方法和用于分离头滑块的装置连接到悬架的安装板公开(公告)号：US20090077792A1
公开(公告)日：2009-03-26
申请号：US12285000
申请日：2008-09-25
申请人： Yoshio Uematsu , Kenjirou Watanabe , Takuya Satoh
发明人： Yoshio Uematsu , Kenjirou Watanabe , Takuya Satoh
CPC分类号： G11B5/4826 , G11B5/4853 , Y10T29/49023 , Y10T29/49027 , Y10T29/53165 , Y10T29/53261 , Y10T29/53274 , Y10T29/53283
摘要： Embodiments of the present invention help to prevent deformation of a gimbal in detaching a head slider from a suspension. In an embodiment of the present invention, after a head slider has been mounted on a suspension, a test on the assembly is conducted. If a defect head slider is found in the test, the head slider is detached from the suspension. The head slider is discarded but the suspension is reused and a new head slider is mounted on the suspension. In detaching the head slider, a pin inserted in a through-hole on the center line of a gimbal tongue latches the gimbal tongue.
摘要翻译： 本发明的实施例有助于防止将万向节从头部滑动件脱离悬架的变形。 在本发明的一个实施例中，在磁头滑块已经安装在悬架上之后，进行组件的测试。 如果在测试中发现缺陷磁头滑块，则磁头滑块与悬架分离。 磁头滑块被丢弃，但悬架被重新使用，并且在悬架上安装了一个新的磁头滑块。 在拆卸磁头滑动器时，插入万向节舌片中心线上的通孔中的销钉锁定万向节舌头。
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3.发明申请Manufacturing method of head gimbal assembly with solder fillet and head gimbal assembly 有权具有焊接圆角和头部万向节组件的头部万向节组件的制造方法公开(公告)号：US20060193084A1
公开(公告)日：2006-08-31
申请号：US11355470
申请日：2006-02-15
IPC分类号： G11B5/60
CPC分类号： H05K3/3442 , G11B5/4853 , H01L2224/742 , H01L2924/01327 , H05K3/3494 , H05K2201/10727 , H05K2203/0195 , H05K2203/041 , H05K2203/043 , H05K2203/107 , Y02P70/613 , Y10T29/4903 , Y10T29/49211 , H01L2924/00
摘要： Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.
摘要翻译： 本发明的实施例涉及当在磁盘驱动器中使用的头/滑块中的焊接连接失败时重新连接。 在一个实施例中，沉积在头/滑块的滑块上的焊料块与引线焊盘分离，并且在滑块焊盘和引线焊盘之间尚未形成焊球连接。 将成型尖端加热至接近焊料熔点的温度。 成形尖端与滑块的表面平行地移动到铅焊盘的侧面以软化焊料质量。 然后用激光束照射焊料，以形成焊锡圆角，从而在引线焊盘和滑块之间形成焊接连接。
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公开(公告)号：US06871392B2
公开(公告)日：2005-03-29
申请号：US10255454
申请日：2002-09-26
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要翻译： 一体化引线悬架包括放置在设置在悬架的弯曲部上的引线布线焊盘之间的焊球和设置在头部万向节部分的滑块上的焊盘。 引线接线板和接合焊盘通过熔化焊球焊接。 结果，在引线布线焊盘的表面的中心线附近，使用重力提供了通过表面凸起部分放置焊球的凹部。 以这种方式，当通过焊球连接接合焊盘和引线接线焊盘时，焊球的位置不会偏离中心线。
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公开(公告)号：US20050047020A1
公开(公告)日：2005-03-03
申请号：US10964188
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
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6.发明授权Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass 有权通过激光照射成形的焊料块形成的焊接圆角的头万向节组装方法公开(公告)号：US07486480B2
公开(公告)日：2009-02-03
申请号：US11355470
申请日：2006-02-15
CPC分类号： H05K3/3442 , G11B5/4853 , H01L2224/742 , H01L2924/01327 , H05K3/3494 , H05K2201/10727 , H05K2203/0195 , H05K2203/041 , H05K2203/043 , H05K2203/107 , Y02P70/613 , Y10T29/4903 , Y10T29/49211 , H01L2924/00
摘要： Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.
摘要翻译： 本发明的实施例涉及当在磁盘驱动器中使用的头/滑块中的焊接连接失败时重新连接。 在一个实施例中，沉积在头/滑块的滑块上的焊料块与引线焊盘分离，并且在滑块焊盘和引线焊盘之间尚未形成焊球连接。 将成型尖端加热至接近焊料熔点的温度。 成形尖端与滑块的表面平行地移动到铅焊盘的侧面以软化焊料质量。 然后用激光束照射焊料，以形成焊锡圆角，从而在引线焊盘和滑块之间形成焊接连接。
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公开(公告)号：US07137189B2
公开(公告)日：2006-11-21
申请号：US10964224
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
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公开(公告)号：US06879465B2
公开(公告)日：2005-04-12
申请号：US10459343
申请日：2003-06-11
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
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公开(公告)号：US06985335B2
公开(公告)日：2006-01-10
申请号：US10964188
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
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公开(公告)号：US20050063096A1
公开(公告)日：2005-03-24
申请号：US10963704
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要翻译： 一体化引线悬架包括放置在设置在悬架的弯曲部上的引线布线焊盘之间的焊球和设置在头部万向节部分的滑块上的焊盘。 引线接线板和接合焊盘通过熔化焊球进行焊接。 结果，在引线布线焊盘的表面的中心线附近，使用重力提供了通过表面凸起部分放置焊球的凹部。 以这种方式，当通过焊球连接接合焊盘和引线接线焊盘时，焊球的位置不会偏离中心线。
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