公开(公告)号：US08338931B2

公开(公告)日：2012-12-25

申请号：US12767909

申请日：2010-04-27

申请人： Yoshitaka Dozen ,  Eiji Sugiyama ,  Hisashi Ohtani ,  Takuya Tsurume

发明人： Yoshitaka Dozen ,  Eiji Sugiyama ,  Hisashi Ohtani ,  Takuya Tsurume

IPC分类号： H01L23/02

CPC分类号： H01L27/1266 ,  H01L27/1214 ,  H01L27/1255

摘要： In the present application, is disclosed a method of manufacturing a flexible semiconductor device having an excellent reliability and tolerance to the loading of external pressure. The method includes the steps of: forming a separation layer over a substrate having an insulating surface; forming an element layer including a semiconductor element comprising a non-single crystal semiconductor layer, over the separation layer; forming an organic resin layer over the element layer; providing a fibrous body formed of an organic compound or an inorganic compound on the organic resin layer; heating the organic resin layer; and separating the element layer from the separation layer. This method allows the formation of a flexible semiconductor device having a sealing layer in which the fibrous body is impregnated with the organic resin.

摘要翻译： 在本申请中，公开了一种制造柔性半导体器件的方法，所述柔性半导体器件对外部压力的加载具有优异的可靠性和耐受性。 该方法包括以下步骤：在具有绝缘表面的基底上形成分离层; 在分离层上形成包括非单晶半导体层的半导体元件的元件层; 在元件层上形成有机树脂层; 在有机树脂层上提供由有机化合物或无机化合物形成的纤维体; 加热有机树脂层; 并将元件层与分离层分离。 该方法允许形成具有密封层的柔性半导体器件，其中纤维体浸渍有机树脂。

公开(公告)号：US20080311706A1

公开(公告)日：2008-12-18

申请号：US12076148

申请日：2008-03-14

申请人： Yoshitaka Dozen ,  Eiji Sugiyama ,  Hisashi Ohtani ,  Takuya Tsurume

发明人： Yoshitaka Dozen ,  Eiji Sugiyama ,  Hisashi Ohtani ,  Takuya Tsurume

IPC分类号： H01L21/56

CPC分类号： H01L23/293 ,  H01L27/12 ,  H01L27/1214 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/185 ,  H05K1/189 ,  H01L2924/00

摘要： To provide a method for manufacturing a highly-reliable semiconductor device, which is not damaged by external local pressure, with a high yield, a semiconductor device is manufactured by forming an element substrate having a semiconductor element formed using a single-crystal semiconductor substrate or an SOI substrate, providing the element substrate with a fibrous body formed from an organic compound or an inorganic compound, applying a composition containing an organic resin to the element substrate and the fibrous body so that the fibrous body is impregnated with the organic resin, and heating to provide the element substrate with a sealing layer in which the fibrous body formed from an organic compound or an inorganic compound is contained.

摘要翻译： 为了提供一种以高产率制造不被外部局部压力损坏的高可靠性半导体器件的方法，通过形成具有使用单晶半导体衬底形成的半导体元件的元件衬底或 SOI衬底，为元件衬底提供由有机化合物或无机化合物形成的纤维体，将含有有机树脂的组合物施加到元件衬底和纤维体上，以使纤维体浸渍有机树脂，以及 加热以向元件基板提供包含由有机化合物或无机化合物形成的纤维体的密封层。

公开(公告)号：US08552418B2

公开(公告)日：2013-10-08

申请号：US13157338

申请日：2011-06-10

申请人： Eiji Sugiyama ,  Yoshitaka Dozen ,  Hisashi Ohtani ,  Takuya Tsurume

发明人： Eiji Sugiyama ,  Yoshitaka Dozen ,  Hisashi Ohtani ,  Takuya Tsurume

IPC分类号： H01L35/24

CPC分类号： H01L27/1266 ,  H01L23/145 ,  H01L23/49855 ,  H01L27/105 ,  H01L27/115 ,  H01L27/1248 ,  H01L27/13 ,  H01L29/78603 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01L2924/00

摘要： The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a method for manufacturing a highly-reliable semiconductor device, which is not destructed by external local pressure, with a high yield. A structure body, in which high-strength fiber of an organic compound or an inorganic compound is impregnated with an organic resin, is provided over an element layer having a semiconductor element formed using a non-single crystal semiconductor layer, and heating and pressure bonding are performed, whereby a semiconductor device is manufactured, to which the element layer and the structure body in which the high-strength fiber of an organic compound or an inorganic compound is impregnated with the organic resin are firmly fixed together.

摘要翻译： 本发明提供一种不容易被外部局部压力损坏的半导体器件。 本发明还提供一种以高产率制造不被外部局部压力破坏的高可靠性半导体器件的方法。 在具有使用非单晶半导体层形成的半导体元件的元件层上设置有机化合物或无机化合物的高强度纤维被有机树脂浸渍的结构体，加热和压接 由此制造半导体器件，将有机化合物或无机化合物的高强度纤维与有机树脂浸渍的元件层和结构体牢固地固定在一起。

公开(公告)号：US20080242005A1

公开(公告)日：2008-10-02

申请号：US12076149

申请日：2008-03-14

申请人： Yoshitaka Dozen ,  Eiji Sugiyama ,  Hisashi Ohtani ,  Takuya Tsurume

发明人： Yoshitaka Dozen ,  Eiji Sugiyama ,  Hisashi Ohtani ,  Takuya Tsurume

IPC分类号： H01L21/56

CPC分类号： H01L27/1266 ,  H01L27/1214 ,  H01L27/1255

摘要： In the present application, is disclosed a method of manufacturing a flexible semiconductor device having an excellent reliability and tolerance to the loading of external pressure. The method includes the steps of: forming a separation layer over a substrate having an insulating surface; forming an element layer including a semiconductor element comprising a non-single crystal semiconductor layer, over the separation layer; forming an organic resin layer over the element layer; providing a fibrous body formed of an organic compound or an inorganic compound on the organic resin layer; heating the organic resin layer; and separating the element layer from the separation layer. This method allows the formation of a flexible semiconductor device having a sealing layer in which the fibrous body is impregnated with the organic resin.

摘要翻译： 在本申请中，公开了一种制造柔性半导体器件的方法，所述柔性半导体器件对外部压力的加载具有优异的可靠性和耐受性。 该方法包括以下步骤：在具有绝缘表面的基底上形成分离层; 在分离层上形成包括非单晶半导体层的半导体元件的元件层; 在元件层上形成有机树脂层; 在有机树脂层上提供由有机化合物或无机化合物形成的纤维体; 加热有机树脂层; 并将元件层与分离层分离。 该方法允许形成具有密封层的柔性半导体器件，其中纤维体浸渍有机树脂。

公开(公告)号：US20080224940A1

公开(公告)日：2008-09-18

申请号：US12073613

申请日：2008-03-07

申请人： Eiji Sugiyama ,  Yoshitaka Dozen ,  Hisashi Ohtani ,  Takuya Tsurume

发明人： Eiji Sugiyama ,  Yoshitaka Dozen ,  Hisashi Ohtani ,  Takuya Tsurume

IPC分类号： H01Q1/40 ,  H01L21/02

CPC分类号： H01L27/1266 ,  H01L23/145 ,  H01L23/49855 ,  H01L27/105 ,  H01L27/115 ,  H01L27/1248 ,  H01L27/13 ,  H01L29/78603 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/07811 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01L2924/00

摘要： The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a manufacturing method of a highly-reliable semiconductor device, which is not destroyed by external local pressure, with a high yield. A structure body, in which high-strength fiber of an organic compound or an inorganic compound is impregnated with an organic resin, is provided over an element substrate having a semiconductor element formed using a single crystal semiconductor region, and heating and pressure bonding are performed, whereby a semiconductor device is manufactured, to which the element substrate and the structure body in which the high-strength fiber of an organic compound or an inorganic compound is impregnated with the organic resin are fixed together.

摘要翻译： 本发明提供一种不容易被外部局部压力损坏的半导体器件。 本发明还提供了一种高可靠性的半导体器件的制造方法，其不被外部局部压力破坏，而且产率高。 在具有使用单晶半导体区域形成的半导体元件的元件基板上设置有有机化合物或无机化合物的高强度纤维被有机树脂浸渍的结构体，进行加热和压接 由此制造半导体器件，元件基板和有机化合物的高强度纤维或无机化合物浸渍有机树脂的结构体固定在一起。

公开(公告)号：US07968427B2

公开(公告)日：2011-06-28

申请号：US12073617

申请日：2008-03-07

申请人： Eiji Sugiyama ,  Yoshitaka Dozen ,  Hisashi Ohtani ,  Takuya Tsurume

发明人： Eiji Sugiyama ,  Yoshitaka Dozen ,  Hisashi Ohtani ,  Takuya Tsurume

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L27/1266 ,  H01L23/145 ,  H01L23/49855 ,  H01L27/105 ,  H01L27/115 ,  H01L27/1248 ,  H01L27/13 ,  H01L29/78603 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01L2924/00

摘要： The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a method for manufacturing a highly-reliable semiconductor device, which is not destructed by external local pressure, with a high yield. A structure body, in which high-strength fiber of an organic compound or an inorganic compound is impregnated with an organic resin, is provided over an element layer having a semiconductor element formed using a non-single crystal semiconductor layer, and heating and pressure bonding are performed, whereby a semiconductor device is manufactured, to which the element layer and the structure body in which the high-strength fiber of an organic compound or an inorganic compound is impregnated with the organic resin are firmly fixed together.

摘要翻译： 本发明提供一种不容易被外部局部压力损坏的半导体器件。 本发明还提供一种以高产率制造不被外部局部压力破坏的高可靠性半导体器件的方法。 在具有使用非单晶半导体层形成的半导体元件的元件层上设置有机化合物或无机化合物的高强度纤维被有机树脂浸渍的结构体，加热和压接 由此制造半导体器件，将有机化合物或无机化合物的高强度纤维与有机树脂浸渍的元件层和结构体牢固地固定在一起。

公开(公告)号：US07808098B2

公开(公告)日：2010-10-05

申请号：US12073613

申请日：2008-03-07

申请人： Eiji Sugiyama ,  Yoshitaka Dozen ,  Hisashi Ohtani ,  Takuya Tsurume

发明人： Eiji Sugiyama ,  Yoshitaka Dozen ,  Hisashi Ohtani ,  Takuya Tsurume

IPC分类号： H01L23/14 ,  H01Q1/40

CPC分类号： H01L27/1266 ,  H01L23/145 ,  H01L23/49855 ,  H01L27/105 ,  H01L27/115 ,  H01L27/1248 ,  H01L27/13 ,  H01L29/78603 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/07811 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01L2924/00

摘要： The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a manufacturing method of a highly-reliable semiconductor device, which is not destroyed by external local pressure, with a high yield. A structure body, in which high-strength fiber of an organic compound or an inorganic compound is impregnated with an organic resin, is provided over an element substrate having a semiconductor element formed using a single crystal semiconductor region, and heating and pressure bonding are performed, whereby a semiconductor device is manufactured, to which the element substrate and the structure body in which the high-strength fiber of an organic compound or an inorganic compound is impregnated with the organic resin are fixed together.

摘要翻译： 本发明提供一种不容易被外部局部压力损坏的半导体器件。 本发明还提供了一种高可靠性的半导体器件的制造方法，其不被外部局部压力破坏，而且产率高。 在具有使用单晶半导体区域形成的半导体元件的元件基板上设置有有机化合物或无机化合物的高强度纤维被有机树脂浸渍的结构体，进行加热和压接 由此制造半导体器件，元件基板和有机化合物的高强度纤维或无机化合物浸渍有机树脂的结构体固定在一起。

公开(公告)号：US08558370B2

公开(公告)日：2013-10-15

申请号：US12892961

申请日：2010-09-29

申请人： Eiji Sugiyama ,  Yoshitaka Dozen ,  Hisashi Ohtani ,  Takuya Tsurume

发明人： Eiji Sugiyama ,  Yoshitaka Dozen ,  Hisashi Ohtani ,  Takuya Tsurume

IPC分类号： H01L23/44

CPC分类号： H01L27/1266 ,  H01L23/145 ,  H01L23/49855 ,  H01L27/105 ,  H01L27/115 ,  H01L27/1248 ,  H01L27/13 ,  H01L29/78603 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/07811 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01L2924/00

摘要： The present invention provides a semiconductor device which is not easily damaged by external local pressure. The present invention further provides a manufacturing method of a highly-reliable semiconductor device, which is not destroyed by external local pressure, with a high yield. A structure body, in which high-strength fiber of an organic compound or an inorganic compound is impregnated with an organic resin, is provided over an element substrate having a semiconductor element formed using a single crystal semiconductor region, and heating and pressure bonding are performed, whereby a semiconductor device is manufactured, to which the element substrate and the structure body in which the high-strength fiber of an organic compound or an inorganic compound is impregnated with the organic resin are fixed together.

摘要翻译： 本发明提供一种不容易被外部局部压力损坏的半导体器件。 本发明还提供了一种高可靠性的半导体器件的制造方法，其不被外部局部压力破坏，而且产率高。 在具有使用单晶半导体区域形成的半导体元件的元件基板上设置有有机化合物或无机化合物的高强度纤维被有机树脂浸渍的结构体，进行加热和压接 由此制造半导体器件，元件基板和有机化合物的高强度纤维或无机化合物浸渍有机树脂的结构体固定在一起。

公开(公告)号：US07785933B2

公开(公告)日：2010-08-31

申请号：US12076148

申请日：2008-03-14

申请人： Yoshitaka Dozen ,  Eiji Sugiyama ,  Hisashi Ohtani ,  Takuya Tsurume

发明人： Yoshitaka Dozen ,  Eiji Sugiyama ,  Hisashi Ohtani ,  Takuya Tsurume

IPC分类号： H01L21/16

CPC分类号： H01L23/293 ,  H01L27/12 ,  H01L27/1214 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/185 ,  H05K1/189 ,  H01L2924/00

摘要： To provide a method for manufacturing a highly-reliable semiconductor device, which is not damaged by external local pressure, with a high yield, a semiconductor device is manufactured by forming an element substrate having a semiconductor element formed using a single-crystal semiconductor substrate or an SOI substrate, providing the element substrate with a fibrous body formed from an organic compound or an inorganic compound, applying a composition containing an organic resin to the element substrate and the fibrous body so that the fibrous body is impregnated with the organic resin, and heating to provide the element substrate with a sealing layer in which the fibrous body formed from an organic compound or an inorganic compound is contained.

摘要翻译： 为了提供一种以高产率制造不被外部局部压力损坏的高可靠性半导体器件的方法，通过形成具有使用单晶半导体衬底形成的半导体元件的元件衬底或 SOI衬底，为元件衬底提供由有机化合物或无机化合物形成的纤维体，将含有有机树脂的组合物施加到元件衬底和纤维体上，以使纤维体浸渍有机树脂，以及 加热以向元件基板提供包含由有机化合物或无机化合物形成的纤维体的密封层。

公开(公告)号：US07736958B2

公开(公告)日：2010-06-15

申请号：US12076149

申请日：2008-03-14

申请人： Yoshitaka Dozen ,  Eiji Sugiyama ,  Hisashi Ohtani ,  Takuya Tsurume

发明人： Yoshitaka Dozen ,  Eiji Sugiyama ,  Hisashi Ohtani ,  Takuya Tsurume

IPC分类号： H01L21/84

CPC分类号： H01L27/1266 ,  H01L27/1214 ,  H01L27/1255

摘要： In the present application, is disclosed a method of manufacturing a flexible semiconductor device having an excellent reliability and tolerance to the loading of external pressure. The method includes the steps of: forming a separation layer over a substrate having an insulating surface; forming an element layer including a semiconductor element comprising a non-single crystal semiconductor layer, over the separation layer; forming an organic resin layer over the element layer; providing a fibrous body formed of an organic compound or an inorganic compound on the organic resin layer; heating the organic resin layer; and separating the element layer from the separation layer. This method allows the formation of a flexible semiconductor device having a sealing layer in which the fibrous body is impregnated with the organic resin.

摘要翻译： 在本申请中，公开了一种制造柔性半导体器件的方法，所述柔性半导体器件对外部压力的加载具有优异的可靠性和耐受性。 该方法包括以下步骤：在具有绝缘表面的基底上形成分离层; 在分离层上形成包括非单晶半导体层的半导体元件的元件层; 在元件层上形成有机树脂层; 在有机树脂层上提供由有机化合物或无机化合物形成的纤维体; 加热有机树脂层; 并将元件层与分离层分离。 该方法允许形成具有密封层的柔性半导体器件，其中纤维体浸渍有机树脂。