公开(公告)号：US20130176644A1

公开(公告)日：2013-07-11

申请号：US13344081

申请日：2012-01-05

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Hironori ARAKI ,  Shigeki TANEMURA ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Hironori ARAKI ,  Shigeki TANEMURA ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： G11B5/17 ,  G11B5/127 ,  G11B5/48

CPC分类号： G11B5/1278 ,  G11B5/3116 ,  G11B5/3163 ,  Y10T29/49021

摘要： A thin-film magnetic head is constructed such that a main magnetic pole layer, a write shield layer, a gap layer, a thin-film coil and a shield magnetic layer are laminated on a substrate. The thin-film magnetic head has a shield magnetic layer. This thin-film magnetic head has a hard guard frame layer surrounding an equidistant coil part, disposed at a position equidistant from the substrate, from outside and being in direct contact with almost a whole outside surface defining an outer shape of the equidistant coil part.

摘要翻译： 薄膜磁头被构造成使得主磁极层，写入屏蔽层，间隙层，薄膜线圈和屏蔽磁性层被层压在基板上。 薄膜磁头具有屏蔽磁性层。 该薄膜磁头具有围绕等离子体线圈部分的等距线圈部分的硬保护框架层，其设置在距离基板等距离的位置，并且与限定等距线圈部分的外部形状的几乎整个外表面直接接触。

公开(公告)号：US20120257304A1

公开(公告)日：2012-10-11

申请号：US13084168

申请日：2011-04-11

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： G11B5/10

CPC分类号： G11B5/315 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/314 ,  G11B5/607

摘要： A magnetic head includes a coil, a main pole, a write shield, and first and second yoke layers. The first and second yoke layers are magnetically connected to the write shield and aligned along the direction of travel of a recording medium such that the main pole is interposed therebetween. The coil includes a winding portion of planar spiral shape that is formed in one or more layers. The magnetic head further includes: a first coupling part located away from the medium facing surface and magnetically coupling the main pole and the second yoke layer to each other; and a second coupling part located away from the medium facing surface and magnetically coupling the first yoke layer and the second yoke layer to each other without touching the main pole. The winding portion is wound around the first coupling part, and a part of the winding portion passes between the first and second coupling parts.

摘要翻译： 磁头包括线圈，主极，写入屏蔽以及第一和第二磁轭层。 第一和第二磁轭层磁性地连接到写入屏蔽并沿着记录介质的行进方向对准，使得主极插入其间。 线圈包括形成为一层或多层的平面螺旋形状的绕组部分。 磁头还包括：第一耦合部件，其远离介质面对表面并将主极和第二磁轭层彼此磁耦合; 以及第二耦合部件，其远离所述介质面对表面并且将所述第一磁轭层和所述第二磁轭层磁耦合到彼此而不接触所述主极。 卷绕部缠绕在第一连接部上，卷绕部的一部分在第一和第二连接部之间通过。

公开(公告)号：US20120170156A1

公开(公告)日：2012-07-05

申请号：US12982349

申请日：2010-12-30

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： G11B5/127

CPC分类号： G11B5/3116 ,  G11B5/1278 ,  G11B5/3146

摘要： A magnetic head includes: a coil; a main pole; a first shield disposed backward of the main pole along a direction of travel of a recording medium; a first return path section connecting the first shield to the main pole; a second shield disposed forward of the main pole along the direction of travel of the recording medium; and a second return path section connecting the second shield to the main pole. An interface between the first return path section and the main pole has an end closest to a medium facing surface, and an interface between the second return path section and the main pole has an end closest to the medium facing surface, the latter being closer to the medium facing surface than the former. The second return path section includes a yoke layer located away from the medium facing surface and in contact with the main pole. The coil includes at least one coil element that passes between the second shield and the yoke layer.

摘要翻译： 磁头包括：线圈; 主杆 第一屏蔽件，沿着记录介质的行进方向设置在所述主极的后方; 将第一屏蔽件连接到主极的第一返回路径部分; 第二屏蔽件，其沿着记录介质的行进方向设置在主极的前方; 以及将第二屏蔽件连接到主极的第二返回路径部分。 第一返回路径部分和主极之间的界面具有最靠近介质面的表面的端部，并且第二返回路径部分和主极之间的界面具有最靠近介质面向表面的一端，后者更靠近 中等面向表面比前者。 第二返回路径部分包括位于远离介质面向表面并与主极接触的磁轭层。 线圈包括在第二屏蔽和轭层之间通过的至少一个线圈元件。

公开(公告)号：US20120086130A1

公开(公告)日：2012-04-12

申请号：US12902600

申请日：2010-10-12

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Hiroshi IKEJIMA ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Hiroshi IKEJIMA ,  Atsushi IIJIMA

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L24/92 ,  H01L22/22 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03009 ,  H01L2224/0362 ,  H01L2224/037 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05011 ,  H01L2224/05012 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/9202 ,  H01L2224/96 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/03 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/05552

摘要： A layered chip package includes a main body. The main body includes a main part, and further includes first terminals and second terminals disposed on the top and bottom surfaces of the main part, respectively. The main part includes first and second layer portions, and through electrodes penetrating them. The through electrodes are electrically connected to the first and second terminals. Each of the layer portions includes a semiconductor chip having a first surface and a second surface opposite thereto, and further includes surface electrodes. The surface electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the surface electrodes of the first layer portion. The second terminals are formed by using the surface electrodes of the second layer portion.

摘要翻译： 分层芯片封装包括主体。 主体包括主要部分，并且还包括分别设置在主要部分的顶表面和底表面上的第一端子和第二端子。 主要部分包括第一和第二层部分，以及贯穿它们的电极。 通孔电连接到第一和第二端子。 每个层部分包括具有第一表面和与其相对的第二表面的半导体芯片，并且还包括表面电极。 表面电极设置在与第二表面相对的半导体芯片的一侧上。 第一和第二层部分彼此接合，使得相应的第二表面彼此面对。 第一端子通过使用第一层部分的表面电极形成。 第二端子通过使用第二层部分的表面电极形成。

公开(公告)号：US20130308227A1

公开(公告)日：2013-11-21

申请号：US13473159

申请日：2012-05-16

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA ,  Kazuki SATO ,  Yukinori IKEGAWA ,  Atsushi IIJIMA ,  Tatsuya SHIMIZU

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA ,  Kazuki SATO ,  Yukinori IKEGAWA ,  Atsushi IIJIMA ,  Tatsuya SHIMIZU

IPC分类号： G11B5/17 ,  G11B5/127

CPC分类号： G11B5/3116 ,  G11B5/1278 ,  G11B5/3123 ,  G11B5/315 ,  G11B5/3163

摘要： A magnetic head includes a magnetic structure incorporating a write shield. The magnetic structure is formed to include a first magnetic layer, a second magnetic layer stacked on the first magnetic layer, and a seed layer. The first magnetic layer has a front end face located in the medium facing surface and a top surface. The second magnetic layer has a front end face located in the medium facing surface and a bottom surface. The top surface of the first magnetic layer includes a first region including an end located in the medium facing surface and a second region farther from the medium facing surface than the first region. The seed layer is not present on the first region of the top surface of the first magnetic layer but is present on the second region.

摘要翻译： 磁头包括结合有写入屏蔽的磁性结构。 磁结构形成为包括第一磁性层，堆叠在第一磁性层上的第二磁性层和种子层。 第一磁性层具有位于介质相对表面中的前端面和顶面。 第二磁性层具有位于介质面向表面中的前端面和底面。 第一磁性层的顶表面包括第一区域和第二区域，第一区域包括位于介质面向表面中的端部和比介质面向表面比第一区域更远的第二区域。 种子层不存在于第一磁性层的顶表面的第一区域上，但存在于第二区域上。

公开(公告)号：US20130105949A1

公开(公告)日：2013-05-02

申请号：US13286728

申请日：2011-11-01

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： H01L23/48 ,  H01L21/78 ,  H01L21/762

CPC分类号： H01L25/0657 ,  H01L22/32 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L25/50 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06135 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24146 ,  H01L2224/244 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/9202 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions having a semiconductor device formed therein and insulated from each other, and a plurality of wiring electrodes connected to the semiconductor devices respectively formed in the plurality of device regions and extending from the device regions into the inside of the scribe-groove parts. The plurality of wiring electrodes are arranged in a partial arrangement pattern in which the wiring electrodes are arranged along only a part of four boundary sides, corresponding to boundaries between each of the device regions and the scribe-groove parts. Further, the plurality of wiring electrodes extend into the scribe-groove part from only one of two device regions adjacent to each other with the scribe-groove part therebetween.

摘要翻译： 在层叠半导体衬底中层叠多个半导体衬底。 每个半导体衬底具有沿着划线形成的多个划线槽部分。 此外，每个半导体衬底具有多个器件区域，其中形成有彼此绝缘的半导体器件，以及多个布线电极，其连接到分别形成在多个器件区域中并从器件区域延伸的半导体器件 进入划痕槽部分的内部。 多个布线电极以局部布置图案布置，其中布线电极仅沿着四个边界侧的一部分布置，对应于每个装置区域和划线槽部分之间的边界。 此外，多个布线电极仅从彼此相邻的两个器件区域中的一个延伸到划线槽部分中，其间具有划线槽部分。

公开(公告)号：US20120314323A1

公开(公告)日：2012-12-13

申请号：US13156784

申请日：2011-06-09

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： G11B5/17

CPC分类号： G11B5/3123 ,  G11B5/1278 ,  G11B5/315

摘要： A magnetic head includes a coil, a main pole, a gap part, a write shield, and a return path section. The return path section includes a yoke part and first and second coupling layers. The first coupling layer is connected to the write shield. The second coupling layer magnetically couples the first coupling layer to the yoke part, and has an end face facing toward a medium facing surface and located away from the medium facing surface. The coil includes a first coil element and a plurality of second coil elements that each extend to pass through a space defined by the main pole, the gap part, the write shield, and the return path section. The first coil element is disposed with the first coupling layer interposed between the medium facing surface and the first coil element. The second coil elements are disposed with the second coupling layer interposed between the medium facing surface and the second coil elements, and with the first coil element interposed between the main pole and the second coil elements. The second coil elements are aligned perpendicularly to the medium facing surface.

摘要翻译： 磁头包括线圈，主极，间隙部分，写入屏蔽和返回路径部分。 返回路径部分包括轭部分和第一和第二耦合层。 第一耦合层连接到写屏蔽。 第二耦合层将第一耦合层磁耦合到磁轭部分，并且具有面向介质面向表面并远离介质面向表面定位的端面。 线圈包括第一线圈元件和多个第二线圈元件，每个第二线圈元件各自延伸以穿过由主极，间隙部分，写入屏蔽和返回路径部分限定的空间。 第一线圈元件设置有第一耦合层介于介质面对表面和第一线圈元件之间。 第二线圈元件设置有第二耦合层介于介质相对表面和第二线圈元件之间，并且第一线圈元件插入在主极和第二线圈元件之间。 第二线圈元件垂直于面向介质的表面对准。

公开(公告)号：US20120147501A1

公开(公告)日：2012-06-14

申请号：US12964313

申请日：2010-12-09

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： G11B5/10

CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/315

摘要： A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section includes a yoke layer, and first and second coupling layers that magnetically couple the bottom shield and the yoke layer to each other. The first coupling layer is magnetically connected to the bottom shield. The second coupling layer magnetically couples the first coupling layer to the yoke layer. No end faces of the second coupling layer are exposed in the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other.

摘要翻译： 磁头包括屏蔽，以及第一和第二返回路径部分。 屏蔽件具有位于面向介质的表面中以围绕主极端面的端面。 屏蔽包括底部屏蔽，两个侧面屏蔽和顶部屏蔽。 第一返回路径部分包括轭层，以及使底屏蔽和轭层彼此磁耦合的第一和第二耦合层。 第一耦合层磁性地连接到底部屏蔽。 第二耦合层将第一耦合层磁耦合到轭层。 没有第二耦合层的端面在面向介质的表面中露出。 第二返回路径部分将顶部屏蔽和主极彼此磁耦合。

公开(公告)号：US20120147499A1

公开(公告)日：2012-06-14

申请号：US12964345

申请日：2010-12-09

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： G11B5/23

CPC分类号： G11B5/1278 ,  G11B5/3116

摘要： A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section is magnetically connected to the bottom shield and is greater than the bottom shield in length in a direction perpendicular to the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other. The coil includes a first portion that passes through a space defined by the main pole and the first return path section, and a second portion that passes through a space defined by the main pole and the second return path section.

摘要翻译： 磁头包括屏蔽，以及第一和第二返回路径部分。 屏蔽件具有位于面向介质的表面中以围绕主极端面的端面。 屏蔽包括底部屏蔽，两个侧面屏蔽和顶部屏蔽。 第一返回路径部分磁性地连接到底部屏蔽件并且在垂直于介质面向表面的方向上大于底部屏蔽件的长度。 第二返回路径部分将顶部屏蔽和主极彼此磁耦合。 线圈包括通过由主极和第一返回路径部分限定的空间的第一部分和穿过由主极和第二返回路径部分限定的空间的第二部分。

公开(公告)号：US20120142146A1

公开(公告)日：2012-06-07

申请号：US12960921

申请日：2010-12-06

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Hiroshi IKEJIMA ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Hiroshi IKEJIMA ,  Atsushi IIJIMA

IPC分类号： H01L21/78

CPC分类号： H01L25/50 ,  H01L23/49805 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/24137 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/07802 ,  H01L2924/18162 ,  H01L2924/00

摘要： A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of stacked layer portions. A method of manufacturing the layered chip package includes the step of fabricating a layered substructure and the step of cutting the layered substructure. The layered substructure includes: a plurality of arrayed pre-separation main bodies; a plurality of accommodation parts disposed between two adjacent pre-separation main bodies; and a plurality of preliminary wires accommodated in the accommodation parts. The accommodation parts are formed in a photosensitive resin layer by photolithography. In the step of cutting the layered substructure, the plurality of pre-separation main bodies are separated from each other, and the wires are formed by the preliminary wires.

摘要翻译： 分层芯片封装包括主体和布线，其包括布置在主体的侧表面上的多根导线。 主体包括多个堆叠层部分。 制造层状芯片封装的方法包括制造层状子结构的步骤和切割层状子结构的步骤。 分层子结构包括：多个排列的预分离主体; 设置在两个相邻的预分离主体之间的多个容纳部件; 以及容纳在容纳部中的多条初级线。 通过光刻在光敏树脂层中形成住宿部。 在切割层状子结构的步骤中，多个预分离主体彼此分离，并且通过初步线形成电线。