公开(公告)号：US07638367B2

公开(公告)日：2009-12-29

申请号：US11483593

申请日：2006-07-11

申请人： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

发明人： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247

摘要： A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

摘要翻译： 一种树脂密封电子部件的方法，包括以下步骤：提供一个板，其中一个或多个电子部件安装在上模具中; 熔化容纳在形成下模的一部分的腔中的树脂材料; 并将由上模保持的电子部件浸入熔融树脂中，从而实现树脂密封。 在将树脂材料加压并分散在密封树脂供给装置中之后，树脂材料被容纳在形成下模具的腔的部分中。

公开(公告)号：US07923303B2

公开(公告)日：2011-04-12

申请号：US12616691

申请日：2009-11-11

申请人： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

发明人： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247

摘要： A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

摘要翻译： 一种树脂密封电子部件的方法，包括以下步骤：提供一个板，其中一个或多个电子部件安装在上模具中; 熔化容纳在形成下模的一部分的腔中的树脂材料; 并将由上模保持的电子部件浸入熔融树脂中，从而实现树脂密封。 在将树脂材料加压并分散在密封树脂供给装置中之后，树脂材料被容纳在形成下模具的腔的部分中。

公开(公告)号：US20070196957A1

公开(公告)日：2007-08-23

申请号：US11483593

申请日：2006-07-11

申请人： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

发明人： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247

摘要： A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

摘要翻译： 一种树脂密封电子部件的方法，包括以下步骤：提供一个板，其中一个或多个电子部件安装在上模具中; 熔化容纳在形成下模的一部分的腔中的树脂材料; 并将由上模保持的电子部件浸入熔融树脂中，从而实现树脂密封。 在将树脂材料加压并分散在密封树脂供给装置中之后，树脂材料被容纳在形成下模具的腔的部分中。

公开(公告)号：US20100052212A1

公开(公告)日：2010-03-04

申请号：US12616691

申请日：2009-11-11

申请人： Yoshito AKUTAGAWA ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

发明人： Yoshito AKUTAGAWA ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

IPC分类号： B29C45/14

CPC分类号： H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247

摘要： A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

摘要翻译： 一种树脂密封电子部件的方法，包括以下步骤：提供一个板，其中一个或多个电子部件安装在上模具中; 熔化容纳在形成下模的一部分的腔中的树脂材料; 并将由上模保持的电子部件浸入熔融树脂中，从而实现树脂密封。 在将树脂材料加压并分散在密封树脂供给装置中之后，树脂材料被容纳在形成下模具的腔的部分中。

公开(公告)号：US08411197B2

公开(公告)日：2013-04-02

申请号：US10968111

申请日：2004-10-20

申请人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

发明人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

IPC分类号： H04N5/68 ,  H04N5/225 ,  H01L21/00 ,  H01L23/02

CPC分类号： H01L31/0203 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L31/02325 ,  H01L31/02327 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12043 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.

摘要翻译： 公开了一种由用于密封图像拾取元件的透明树脂的热膨胀引起的变形小的图像拾取装置。 图像拾取装置包括具有光接收表面的图像拾取元件，用于将入射光聚焦到图像拾取元件的微透镜，设置在图像拾取元件的光接收表面上的第一透明板，微透镜 密封图像拾取元件的透明树脂和第一透明板，以及设置在透明树脂上以面对第一透明板的第二透明板。

公开(公告)号：US20060023108A1

公开(公告)日：2006-02-02

申请号：US10994634

申请日：2004-11-23

申请人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

发明人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

IPC分类号： G02B13/16

CPC分类号： H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.

公开(公告)号：US07616250B2

公开(公告)日：2009-11-10

申请号：US10994634

申请日：2004-11-23

申请人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

发明人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

IPC分类号： H04N5/225 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.

摘要翻译： 公开了一种图像捕获装置，其包括具有光接收表面的光接收元件，设置在光接收元件的光接收表面上的板状透明构件，以及至少设置在板状透明体的周边的树脂 会员。 板状透明构件包括位于光接收元件侧的第一主平面和与第一主平面相对的第二主平面。 第一主飞机面积比第二主飞机大。

公开(公告)号：US20050275741A1

公开(公告)日：2005-12-15

申请号：US10968111

申请日：2004-10-20

申请人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

发明人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

IPC分类号： H01L27/14 ,  H01L23/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/225 ,  H04N5/257 ,  H04N5/335

CPC分类号： H01L31/0203 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L31/02325 ,  H01L31/02327 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12043 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

摘要： An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.

摘要翻译： 公开了一种由用于密封图像拾取元件的透明树脂的热膨胀引起的变形小的图像拾取装置。 图像拾取装置包括具有光接收表面的图像拾取元件，用于将入射光聚焦到图像拾取元件的微透镜，设置在图像拾取元件的光接收表面上的第一透明板，微透镜 密封图像拾取元件的透明树脂和第一透明板，以及设置在透明树脂上以面对第一透明板的第二透明板。

公开(公告)号：US20070091198A1

公开(公告)日：2007-04-26

申请号：US11338856

申请日：2006-01-25

申请人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Noboru Hayasaka

发明人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Noboru Hayasaka

IPC分类号： H04N5/225

CPC分类号： H04N5/2254

摘要： To provide an image pickup apparatus with excellent optical characteristics as well as high reliability and a method of manufacturing the same, capable of efficiently manufacturing the image pickup apparatus in large quantities. The image pickup apparatus of the present invention includes a support board 10, an image pickup device 20 mounted on the support board 10, and a lens component 30 provided on the light receiving region of the image pickup device 20, wherein the lens component 30 has a protrusion part 33 provided around the lens part 31, and the height of the protrusion part 33 from the surface of image pickup device 20 is greater than that of the top 31A of lens part 31 from the surface of the image pickup device 20.

摘要翻译： 为了提供具有优异的光学特性以及高可靠性的图像拾取装置及其制造方法，能够大量有效地制造图像拾取装置。 本发明的图像拾取装置包括支撑板10，安装在支撑板10上的图像拾取装置20和设置在图像拾取装置20的光接收区域上的透镜部件30，其中透镜部件30具有 设置在透镜部31周围的突出部33以及从摄像装置20的表面突出部33的高度大于透镜部31的顶面31A从摄像装置20的表面的高度。

公开(公告)号：US08009222B2

公开(公告)日：2011-08-30

申请号：US11338856

申请日：2006-01-25

申请人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Noboru Hayasaka

发明人： Naoyuki Watanabe ,  Toshiyuki Honda ,  Noboru Hayasaka

IPC分类号： H04N5/225 ,  H04N11/04

CPC分类号： H04N5/2254

摘要： To provide an image pickup apparatus with excellent optical characteristics as well as high reliability and a method of manufacturing the same, capable of efficiently manufacturing the image pickup apparatus in large quantities. The image pickup apparatus of the present invention includes a support board 10, an image pickup device 20 mounted on the support board 10, and a lens component 30 provided on the light receiving region of the image pickup device 20, wherein the lens component 30 has a protrusion part 33 provided around the lens part 31, and the height of the protrusion part 33 from the surface of image pickup device 20 is greater than that of the top 31A of lens part 31 from the surface of the image pickup device 20.

摘要翻译： 为了提供具有优异的光学特性以及高可靠性的图像拾取装置及其制造方法，能够大量有效地制造图像拾取装置。 本发明的图像拾取装置包括支撑板10，安装在支撑板10上的图像拾取装置20和设置在图像拾取装置20的光接收区域上的透镜部件30，其中透镜部件30具有 设置在透镜部31周围的突出部33以及突出部33与摄像装置20的表面的高度大于透镜部31的顶面31A的从摄像装置20的表面的高度。