公开(公告)号：US08411197B2

公开(公告)日：2013-04-02

申请号：US10968111

申请日：2004-10-20

Applicant: Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

Inventor： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

IPC: H04N5/68 ,  H04N5/225 ,  H01L21/00 ,  H01L23/02

CPC classification number: H01L31/0203 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L31/02325 ,  H01L31/02327 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12043 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H04N5/2254 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.

Abstract translation: 公开了一种由用于密封图像拾取元件的透明树脂的热膨胀引起的变形小的图像拾取装置。 图像拾取装置包括具有光接收表面的图像拾取元件，用于将入射光聚焦到图像拾取元件的微透镜，设置在图像拾取元件的光接收表面上的第一透明板，微透镜 密封图像拾取元件的透明树脂和第一透明板，以及设置在透明树脂上以面对第一透明板的第二透明板。

公开(公告)号：US07638367B2

公开(公告)日：2009-12-29

申请号：US11483593

申请日：2006-07-11

Applicant: Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

Inventor： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

IPC: H01L21/00

CPC classification number: H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract translation: 一种树脂密封电子部件的方法，包括以下步骤：提供一个板，其中一个或多个电子部件安装在上模具中; 熔化容纳在形成下模的一部分的腔中的树脂材料; 并将由上模保持的电子部件浸入熔融树脂中，从而实现树脂密封。 在将树脂材料加压并分散在密封树脂供给装置中之后，树脂材料被容纳在形成下模具的腔的部分中。

公开(公告)号：US20060023108A1

公开(公告)日：2006-02-02

申请号：US10994634

申请日：2004-11-23

Applicant: Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

Inventor： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

IPC: G02B13/16

CPC classification number: H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.

公开(公告)号：US07923303B2

公开(公告)日：2011-04-12

申请号：US12616691

申请日：2009-11-11

Applicant: Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

Inventor： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

IPC: H01L21/00

CPC classification number: H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract translation: 一种树脂密封电子部件的方法，包括以下步骤：提供一个板，其中一个或多个电子部件安装在上模具中; 熔化容纳在形成下模的一部分的腔中的树脂材料; 并将由上模保持的电子部件浸入熔融树脂中，从而实现树脂密封。 在将树脂材料加压并分散在密封树脂供给装置中之后，树脂材料被容纳在形成下模具的腔的部分中。

公开(公告)号：US07884459B2

公开(公告)日：2011-02-08

申请号：US12210645

申请日：2008-09-15

Applicant: Eiji Yoshida ,  Takao Ohno ,  Yoshito Akutagawa ,  Koji Sawahata ,  Masataka Mizukoshi ,  Takao Nishimura ,  Akira Takashima ,  Mitsuhisa Watanabe

Inventor： Eiji Yoshida ,  Takao Ohno ,  Yoshito Akutagawa ,  Koji Sawahata ,  Masataka Mizukoshi ,  Takao Nishimura ,  Akira Takashima ,  Mitsuhisa Watanabe

IPC: H01L23/02

CPC classification number: H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/13008 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

Abstract translation: 提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。 在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。 通过蚀刻形成孔，电极焊盘用作蚀刻停止层。 埋入电极形成在孔中。 该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。

公开(公告)号：US07616250B2

公开(公告)日：2009-11-10

申请号：US10994634

申请日：2004-11-23

Applicant: Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

Inventor： Naoyuki Watanabe ,  Toshiyuki Honda ,  Yoshito Akutagawa ,  Susumu Moriya ,  Izumi Kobayashi

IPC: H04N5/225 ,  H01L21/00

CPC classification number: H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.

Abstract translation: 公开了一种图像捕获装置，其包括具有光接收表面的光接收元件，设置在光接收元件的光接收表面上的板状透明构件，以及至少设置在板状透明体的周边的树脂 会员。 板状透明构件包括位于光接收元件侧的第一主平面和与第一主平面相对的第二主平面。 第一主飞机面积比第二主飞机大。

公开(公告)号：US20090087984A1

公开(公告)日：2009-04-02

申请号：US12143921

申请日：2008-06-23

Applicant: Yoshito AKUTAGAWA ,  Hiroyuki MATSUI ,  Yutaka MAKINO

Inventor： Yoshito AKUTAGAWA ,  Hiroyuki MATSUI ,  Yutaka MAKINO

IPC: H01L21/44

CPC classification number: H01L24/11 ,  H01L24/742 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/1147 ,  H01L2224/13011 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00014

Abstract: A forming method of an electrode includes the steps of providing an electrode material on a conductive part; exposing the electrode material at a temperature equal to or higher than a melting point of the electrode material in an oxidizing atmosphere; and exposing the melted electrode material, in a reducing atmosphere, at a temperature equal to or higher than the melting point of the electrode material and lower than the temperature at which the electrode material is exposed in the oxidizing atmosphere.

Abstract translation: 电极的形成方法包括以下步骤：在导电部件上提供电极材料; 在氧化气氛中，在电极材料的熔点以上的温度下使电极材料露出; 在还原性气氛中，在等于或高于电极材料的熔点的温度下暴露熔融的电极材料，并且低于在氧化气氛中电极材料暴露的温度。

公开(公告)号：US20070196957A1

公开(公告)日：2007-08-23

申请号：US11483593

申请日：2006-07-11

Applicant: Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

Inventor： Yoshito Akutagawa ,  Izumi Kobayashi ,  Naoyuki Watanabe ,  Susumu Moriya ,  Toshiyuki Honda ,  Noboru Hayasaka

IPC: H01L21/00

CPC classification number: H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract translation: 一种树脂密封电子部件的方法，包括以下步骤：提供一个板，其中一个或多个电子部件安装在上模具中; 熔化容纳在形成下模的一部分的腔中的树脂材料; 并将由上模保持的电子部件浸入熔融树脂中，从而实现树脂密封。 在将树脂材料加压并分散在密封树脂供给装置中之后，树脂材料被容纳在形成下模具的腔的部分中。

公开(公告)号：US20120251968A1

公开(公告)日：2012-10-04

申请号：US13523007

申请日：2012-06-14

Applicant: Hiroyuki MATSUI ,  Yutaka Makino ,  Yoshito Akutagawa

Inventor： Hiroyuki MATSUI ,  Yutaka Makino ,  Yoshito Akutagawa

IPC: F27D1/00

CPC classification number: H01L21/67098 ,  H01L21/67115 ,  H01L24/11 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81012 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/05599

Abstract: A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump.

Abstract translation: 一种制造半导体器件的方法，包括：首先通过仅加热形成在半导体衬底的一个主表面上的电极上的凸起的上部来进行熔融; 并且还通过加热凸块的下部来熔化整个凸块。

公开(公告)号：US20110092065A1

公开(公告)日：2011-04-21

申请号：US12976089

申请日：2010-12-22

Applicant: Eiji YOSHIDA ,  Takao OHNO ,  Yoshito AKUTAGAWA ,  Koji SAWAHATA ,  Masataka MIZUKOSHI ,  Takao NISHIMURA ,  Akira TAKASHIMA ,  Mitsuhisa WATANABE

Inventor： Eiji YOSHIDA ,  Takao OHNO ,  Yoshito AKUTAGAWA ,  Koji SAWAHATA ,  Masataka MIZUKOSHI ,  Takao NISHIMURA ,  Akira TAKASHIMA ,  Mitsuhisa WATANABE

IPC: H01L21/44

CPC classification number: H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/13008 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

Abstract translation: 提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。 在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。 通过蚀刻形成孔，电极焊盘用作蚀刻停止层。 埋入电极形成在孔中。 该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。