摘要:
A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO3/2)x[R1aSiO(4-a)/2]y (where R represents a cycloalkyl group, and R1 represents hydrogen atom or a univalent organic group, except for an aromatic group and a cycloalkyl group, at least one R1 in one molecule being an epoxy-containing univalent organic group, and where the following condition is observed: 0 0; y>0; and x+y=1).
摘要翻译:含有一分子中含有至少一个含环氧基的有机基团的有机聚硅氧烷的可固化有机硅组合物的聚苯乙烯参考重均分子量至少为500,并由以下通式表示:(RSiO3 / 2) x [R1aSiO(4-a)/ 2] y(其中R表示环烷基,R1表示氢原子或一价有机基团,除了芳基和环烷基,一分子中至少一个R 1为 含有环氧基的一价有机基团,其中观察到以下条件:0 0; y> 0; x + y = 1)。
摘要:
A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a[R22SiO2/2]b[R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c equals 1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0.2≦b≦0.8; and, on average, “c” satisfies the following condition: 0.2
摘要翻译:可固化的有机硅组合物包括:(A)由下面给出的硅氧烷单元式(1)表示的具有至少两个含有环氧基并且不含芳环的一价有机基团的有机聚硅氧烷:[R 13 SiO 1/2] a [R 22 SiO 2 / 2] b [R3SiO3 / 2] c(其中R1,R2和R3是一价有机基团,其中至少两个是含有环氧基并且不含芳环的一价有机基团;大于20摩尔%的R3是 芳基; a + b + c等于1;平均而言,“a”满足以下条件:0≦̸ a≦̸ 0.8;平均而言,“b”满足以下条件:0.2≦̸ b≦̸ 0.8; ,“c”满足以下条件:0.2
摘要:
An organotrisiloxane represented by the following general formula (I), wherein R1 and R2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds, with the proviso that at least one of R1 or R2 is an aryl group, and R3 designates an organic group that contains a phenolic hydroxyl group, is a novel compound that possesses good reactivity and excellent compatibility and dispersibility with respect to the curable resins, such as epoxy resin.
摘要:
A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.
摘要:
A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R13SiO1/2)a(R22SiO2/2)b(R3SiO3/2)c(SiO4/2)d (wherein R1, R2, and R3 are each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of R3 are aryl groups, and a, b, c, and d are numbers that satisfy 0≦a≦0.8, 0≦b≦0.8, 0.2≦c≦0.9, 0≦d
摘要翻译:一种可固化有机硅组合物,其包含:(A)由平均单元式表示的有机聚硅氧烷:(R 13 SiO 1/2)a(R 22 SiO 2/2)b(R 3 SiO 3/2)c(SiO 4/2)d(其中R 1,R 2, 和R 3各自独立地选自取代或未取代的单价烃基和环氧官能的一价有机基团,条件是至少20摩尔%的R 3是芳基,a,b,c和d是满足0&nlE的数 ; a&nlE; 0.8,0和nlE; b&nlE; 0.8,0.2&nlE; c&nlE; 0.9,0&amp; nlE; d <0.8,a + b + c + d = 1),并且具有至少两个上述环氧官能单价有机 每个分子中的基团; (B)具有能够与环氧基反应的基团的化合物; (C)固化促进剂; 和(D)导热填料,具有优异的处理特性,并快速固化,得到高导热性,非常柔性,高粘合性和非常阻燃的固化产物。
摘要:
A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.
摘要:
A curable silicone composition comprising: (A) a diorganosiloxane represented by the following general formula: A-R2—(R12SiO)nR12Si—R2-A {wherein R1 represents the same or different optionally substituted univalent hydrocarbon groups that do not have unsaturated aliphatic bonds; R2 represents bivalent organic groups; A designates siloxane residual radicals represented by the following average unit formula: (XR12SiO1/2)a (SiO4/2)b (wherein R1 designates the previously mentioned group; X designates a single bond, hydrogen atom, the previously mentioned group that is designated by R1, an epoxy-containing alkyl group, or an alkoxysilylalkyl group; at least one X in one molecule is a single bond; at least two X's are epoxy-containing alkyl groups; “a” is a positive number, “b” is a positive number; and “a/b” is a positive number within the range of 0.2 to 4), and “n” is an integer which is equal to or greater than 1}; and (B) a curing agent for an epoxy resin, is characterized by excellent handlability and curability and that is suitable for curing into a cured body that has excellent flexibility and adhesive characteristics; to provide a highly reliable electronic device.
摘要:
A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R13SiO1/2)a(R22SiO2/2)b(R3 SiO3/2)c(SiO4/2)d (wherein R1, R2, and R3 are each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of R3 are aryl groups, and a, b, c, and d are numbers that satisfy 0≦a≦0.8, 0≦b≦0.8, 0.2≦c≦0.9, 0≦d
摘要翻译:一种可固化有机硅组合物,其包含:(A)由平均单元式表示的有机聚硅氧烷:(R 13 SiO 1/2)a(R 22 SiO 2/2)b(R 3 SiO 3/2)c(SiO 4/2)d(其中R 1,R 2 和R 3各自独立地选自取代或未取代的单价烃基和环氧官能的一价有机基团,条件是至少20摩尔%的R 3是芳基,a,b,c和d是满足 0 <= a <= 0.8,0 <= b <= 0.8,0.2 <= c <= 0.9,0 <= d <0.8,a + b + c + d = 1),并且具有至少两个 上述环氧官能单价有机基团; (B)具有能够与环氧基反应的基团的化合物; (C)固化促进剂; 和(D)导热填料,具有优异的处理特性,并快速固化,得到高导热性,非常柔性,高粘合性和非常阻燃的固化产物。
摘要:
A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.
摘要:
A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.