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17 条记录 (耗时 0.028 秒)

    Microporous high density polyethylene film and method of producing the same
    3.
    发明申请
    Microporous high density polyethylene film and method of producing the same 有权
    微孔高密度聚乙烯薄膜及其制造方法

    公开(公告)号：US20050277702A1

    公开(公告)日：2005-12-15

    申请号：US10964639

    申请日：2004-10-15

    申请人： Young Lee ,  Jang Rhee ,  Won Cho ,  Jung Sung ,  Byoung Jo ,  Chol Lee ,  In Jung ,  Byung Jung

    发明人： Young Lee ,  Jang Rhee ,  Won Cho ,  Jung Sung ,  Byoung Jo ,  Chol Lee ,  In Jung ,  Byung Jung

    IPC分类号： C08J5/22 ,  C08J9/00

    CPC分类号： C08J5/18 ,  C08J2323/06 ,  C08L23/06 ,  C08L91/00 ,  H01M2/145 ,  H01M2/1653 ,  C08L91/06

    摘要： Disclosed is a microporous high density polyethylene film for a battery separator and a method of producing the same. The microporous high density polyethylene film includes high density polyethylene with a weight average molecular weight of 2×105-5×105, containing 5 wt % or less molecule with a molecular weight of 1×104 or less. The microporous high density polyethylene film has tensile strengths of 1,100 kg/cm2 or more in transverse and machine directions respectively, a puncture strength of 0.22 N/μm or more, a gas permeability (Darcy's permeability constant) of 1.3×10−5 Darcy or more, and shrinkages of 5% or less in machine and transverse directions, respectively. Particularly, the microporous high density polyethylene film has an excellent extrusion-compoundabiliy and stretchability and a high productivity, and can improve the performances and stability of a battery produced using the same.

    摘要翻译： 公开了一种用于电池隔膜的微孔高密度聚乙烯膜及其制造方法。 微孔高密度聚乙烯膜包括重均分子量为2×10 5 -5×10 5的高密度聚乙烯，其含有5重量％或更少的分子量为1×10 5 4以下。 微孔高密度聚乙烯膜的横向和机械方向的拉伸强度分别为1100kg / cm 2以上，穿刺强度为0.22N / m 2以上，透气度（达西渗透率常数） 分别为1.3×10 -5以上的达西或以上，并且在纵向和横向上分别为5％以下的收缩。 特别地，微孔高密度聚乙烯膜具有优异的挤出复合性和拉伸性和高生产率，并且可以提高使用其制造的电池的性能和稳定性。

    ARTIFICIAL SOLAR LIGHT SYSTEM USING A LIGHT EMITTING DIODE
    4.
    发明申请
    ARTIFICIAL SOLAR LIGHT SYSTEM USING A LIGHT EMITTING DIODE 审中-公开
    人造太阳光系统使用发光二极管

    公开(公告)号：US20090251057A1

    公开(公告)日：2009-10-08

    申请号：US12306656

    申请日：2007-06-27

    申请人： Won Kuk Son ,  Seok Jin Kang ,  Won Cho

    发明人： Won Kuk Son ,  Seok Jin Kang ,  Won Cho

    IPC分类号： H05B37/02 ,  F21V9/00

    CPC分类号： A01K63/06 ,  A01G7/045 ,  A61N5/0616 ,  A61N2005/0642 ,  A61N2005/0652 ,  A61N2005/0661 ,  F21K9/00 ,  F21S8/006 ,  F21Y2115/10 ,  H05B33/0863 ,  H05B33/0866

    摘要： The present invention relates to an artificial solar light system, and more particularly, to an artificial solar light system using light emitting diodes. The present invention can provide an artificial solar light system using light emitting diodes, which can represent the same light emission effects as the sun with time. Further, the present invention can provide an artificial solar light system using light emitting diodes, which is inexpensive and is not affected by positions or climate.

    摘要翻译： 人造太阳光系统技术领域本发明涉及人造太阳能光系统，更具体地，涉及使用发光二极管的人造太阳能光系统。 本发明可以提供一种使用发光二极管的人造太阳光系统，其可以随着时间表现出与太阳相同的发光效果。 此外，本发明可以提供一种廉价且不受位置或气候影响的发光二极管的人造太阳光系统。

    Disk protection casing and drive for receiving the same
    5.
    发明申请
    Disk protection casing and drive for receiving the same 有权
    磁盘保护套和驱动器接收相同

    公开(公告)号：US20050120364A1

    公开(公告)日：2005-06-02

    申请号：US11033623

    申请日：2005-01-13

    申请人： Jong Lim ,  Won Cho

    发明人： Jong Lim ,  Won Cho

    IPC分类号： G11B17/04 ,  G11B23/03

    CPC分类号： G11B17/057 ,  G11B23/0317

    摘要： The disc protection casing includes a disc protection casing body having a disc receiving space therein. A disc holder, insertable into the interior of the disc protection casing body, has an elastic member formed at one end of the same for supporting a disc. When the disc holder is inserted into the casing body, a shoulder on the elastic member contacts a guide member in the casing body and the elastic member releases a disc supported thereby.

    摘要翻译： 盘保护壳体包括其中具有盘容纳空间的盘保护壳体。 可插入盘保护壳体的内部的盘保持器具有形成在其一端的用于支撑盘的弹性构件。 当盘保持器插入到壳体中时，弹性构件上的肩部接触壳体中的引导构件，并且弹性构件释放由其支撑的盘。

    Heat conducting slug having multi-step structure and light emitting diode package using the same
    6.
    发明授权
    Heat conducting slug having multi-step structure and light emitting diode package using the same 有权
    具有多级结构的导热块和使用其的发光二极管封装

    公开(公告)号：US09236549B2

    公开(公告)日：2016-01-12

    申请号：US12519954

    申请日：2007-12-18

    申请人： Jong Kook Lee ,  Byoung Ki Pyo ,  Hyuck Jung Choi ,  Kyung Nam Kim ,  Won Cho

    发明人： Jong Kook Lee ,  Byoung Ki Pyo ,  Hyuck Jung Choi ,  Kyung Nam Kim ,  Won Cho

    IPC分类号： F21V29/00 ,  H01L33/64 ,  B29C45/14 ,  B29C45/26 ,  B29C45/34

    CPC分类号： H01L33/642 ,  B29C45/14655 ,  B29C45/14836 ,  B29C45/2669 ,  B29C45/34 ,  B29K2995/0013 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug.

    摘要翻译： 本发明提供一种具有多级结构的导热块，其被安装到LED封装以将从发光芯片产生的热量散发到外部。 导热块包括形成在第一块上的第一块，第二块和形成在第二块上的第三块，其中发光芯片安装到第三块，第二和第三块分别成形为具有 边缘布置成彼此交叉。 在这种配置中，从发光芯片产生的热量遵循散热路径，其中热量集中在一个芯块的边缘并从其散发并且然后聚集在另一个芯块的边缘，被布置成跨越一个芯块。 因此，整个散热路径不集中在特定区域，而是广泛分布，从而提高导热块的散热效果。

    HEAT CONDUCTING SLUG HAVING MULTI-STEP STRUCTURE AND THE LIGHT EMITTING DIODE PACKAGE USING THE SAME
    7.
    发明申请
    HEAT CONDUCTING SLUG HAVING MULTI-STEP STRUCTURE AND THE LIGHT EMITTING DIODE PACKAGE USING THE SAME 有权
    具有多级结构的热导管和使用其的发光二极管封装

    公开(公告)号：US20100091504A1

    公开(公告)日：2010-04-15

    申请号：US12519954

    申请日：2007-12-18

    申请人： Jong Kook Lee ,  Byoung Ki Pyo ,  Hyuck Jung Choi ,  Kyung Nam Kim ,  Won Cho

    发明人： Jong Kook Lee ,  Byoung Ki Pyo ,  Hyuck Jung Choi ,  Kyung Nam Kim ,  Won Cho

    IPC分类号： F21V29/00 ,  F28F7/00

    CPC分类号： H01L33/642 ,  B29C45/14655 ,  B29C45/14836 ,  B29C45/2669 ,  B29C45/34 ,  B29K2995/0013 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug.

    摘要翻译： 本发明提供一种具有多级结构的导热块，其被安装到LED封装以将从发光芯片产生的热量散发到外部。 导热块包括形成在第一块上的第一块，第二块和形成在第二块上的第三块，其中发光芯片安装到第三块，第二和第三块分别成形为具有 边缘布置成彼此交叉。 在这种配置中，从发光芯片产生的热量遵循散热路径，其中热量集中在一个芯块的边缘并从其散发并且然后聚集在另一个芯块的边缘，被布置成跨越一个芯块。 因此，整个散热路径不集中在特定区域，而是广泛分布，从而提高导热块的散热效果。

    Backlight unit
    10.
    发明授权
    Backlight unit 有权
    背光单元

    公开(公告)号：US08193721B2

    公开(公告)日：2012-06-05

    申请号：US12415381

    申请日：2009-03-31

    申请人： Won Cho ,  Bi-Yong Jeong

    发明人： Won Cho ,  Bi-Yong Jeong

    IPC分类号： H05B41/16

    CPC分类号： H05B33/0821 ,  G02F1/133603 ,  G02F1/133609 ,  H01L25/0753 ,  H01L33/50 ,  H01L2924/0002 ,  H05B33/0857 ,  H01L2924/00

    摘要： The present invention relates to a backlight unit that includes at least one first light emitting diode (LED) package and at least one second LED package, wherein the first LED package includes a blue LED chip, a green LED chip, and a first phosphor, the first phosphor being excited by blue light and to emit light to be mixed with blue light and green light respectively emitted from the blue LED chip and the green LED chip, the first LED package to thereby emit white light; the second LED package includes a blue LED chip, a red LED chip, and a second phosphor, the second phosphor being excited by blue light and to emit light to be mixed with blue light and red light respectively emitted from the blue LED chip and the red LED chip, the second LED package to thereby emit white light; and the first LED package and the second LED package are alternately arranged.

    摘要翻译： 本发明涉及一种背光单元，其包括至少一个第一发光二极管（LED）封装和至少一个第二LED封装，其中所述第一LED封装包括蓝色LED芯片，绿色LED芯片和第一荧光体， 第一荧光体被蓝光激发，并且发射与蓝色LED芯片和绿色LED芯片分别发射的蓝色光和绿色光混合的光，该第一LED封装从而发出白色光; 所述第二LED封装包括蓝色LED芯片，红色LED芯片和第二荧光体，所述第二荧光体被蓝色光激发并发射与蓝色LED芯片分别发出的蓝色光和红色光混合的光， 红色LED芯片，第二个LED封装，从而发出白光; 并且第一LED封装和第二LED封装交替布置。