公开(公告)号：US06525406B1

公开(公告)日：2003-02-25

申请号：US09687049

申请日：2000-10-13

申请人： Young Suk Chung ,  Sung Sik Jang ,  Jae Jin Lee ,  Tae Heon Lee ,  Hyung Ju Lee ,  Jung Woo Lee ,  Mu Hwan Seo ,  Jae Hak Yee ,  Ku Sun Hong

发明人： Young Suk Chung ,  Sung Sik Jang ,  Jae Jin Lee ,  Tae Heon Lee ,  Hyung Ju Lee ,  Jung Woo Lee ,  Mu Hwan Seo ,  Jae Hak Yee ,  Ku Sun Hong

IPC分类号： H01L23495

CPC分类号： H01L23/544 ,  H01L21/4842 ,  H01L23/3114 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a semiconductor package and a method for manufacturing the same. A planar or substantially planar die pad is disposed within a leadframe and is connected to the leadframe by a plurality of tie bars. An perimeter of an upper and lower surface of the die pad is half-etched to increase the moisture-permeation path of the finished package. A plurality of rectangular leads extends from the leadframe toward the die pad without contacting the die pad. A silver-plating layer may be formed on the upper surface of the leadframe. A semiconductor chip is mounted on the upper surface of the die pad in the leadframe. After deflashing, the package is treated with a sulfuric (H2SO4)-based solution to restore the internal leads to their original color. Prior to singulation, the externally exposed bottom surfaces of the leads are plated with copper, gold, solder, tin, nickel, palladium, or an alloy thereof to form a predetermined thickness of a plating layer. The singulation step comprises forming a burr at a peripheral side surface of the leads in the upward direction. The finished package may be marked with a recognition mark to enable a user to more easily identify the first lead.

摘要翻译： 公开了一种半导体封装及其制造方法。 平面或基本上平面的管芯焊盘设置在引线框架内，并且通过多个连接条连接到引线框架。 芯片焊盘的上表面和下表面的周边被半蚀刻以增加成品封装的透湿路径。 多个矩形引线从引线框架朝向管芯焊盘延伸，而不接触管芯焊盘。 可以在引线框架的上表面上形成镀银层。 半导体芯片安装在引线框架中的管芯焊盘的上表面上。 在消融后，将包装用硫酸（H 2 SO 4）的溶液处理，以将内部引线恢复到其原始颜色。 在分割之前，引线的外露的底表面镀有铜，金，焊料，锡，镍，钯或其合金，以形成预定厚度的镀层。 分割步骤包括在引线的周向侧表面沿向上方向形成毛刺。 完成的包装可以标记有识别标记，以使用户能够更容易地识别第一个引线。

公开(公告)号：US06825062B2

公开(公告)日：2004-11-30

申请号：US10152945

申请日：2002-05-22

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US06448633B1

公开(公告)日：2002-09-10

申请号：US09444035

申请日：1999-11-19

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the comers of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US07564122B2

公开(公告)日：2009-07-21

申请号：US11365246

申请日：2006-03-01

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US07057280B2

公开(公告)日：2006-06-06

申请号：US10667227

申请日：2003-09-18

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23/04

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US09893562B2

公开(公告)日：2018-02-13

申请号：US14949100

申请日：2015-11-23

申请人： Jae Jin Lee ,  Kyo Beum Lee

发明人： Jae Jin Lee ,  Kyo Beum Lee

IPC分类号： H02J9/06 ,  H05B37/00 ,  H02J7/00

CPC分类号： H02J9/061 ,  H02J7/0029 ,  H02J2007/004 ,  H05B33/0815 ,  H05B33/0842 ,  H05B37/00 ,  H05B37/0227

摘要： Disclosed herein is a direct current (DC) uninterruptible power supply system. The DC uninterruptible power supply system is connected to a DC power conversion system converting prevailing alternating current (AC) power into DC power, supplies the DC power to a load, charges an internal auxiliary power supply device with the DC power, and continuously supplies power to the load from the auxiliary power supply device while cutting off an electric connection with the DC power conversion system when the DC power conversion system short-circuits due to a leakage current or damage thereof or is disconnected.

公开(公告)号：US20140202521A1

公开(公告)日：2014-07-24

申请号：US14114884

申请日：2012-08-22

申请人： Jae Jin Lee

发明人： Jae Jin Lee

IPC分类号： H01L31/042

CPC分类号： H01L31/042 ,  F24S30/45 ,  F24S50/00 ,  F24S50/20 ,  G01S3/7861 ,  H01L25/042 ,  H02S20/00 ,  H02S20/32 ,  Y02E10/47

摘要： Provided is a self-powered solar tracker, which is a solar tracker for adjusting the altitude of and horizontally rotating a solar collector panel such that the solar collector panel on which a plurality of solar cells are provided can face the sun, wherein the self-powered solar tracker comprises: an altitude adjustment optical sensor unit which has one or more first optical sensors formed by being uniformly spaced on the upper side of convex support surfaces to face the sun and one or more second optical sensors formed by being uniformly spaced on the lower side of the convex support surfaces, and which senses the sunlight so as to adjust the altitude of the solar collector panel; a horizontal rotation optical sensor unit which has one or more third optical sensors formed by being uniformly spaced on the left side of the convex support surfaces to face the sun and one or more fourth optical sensors formed by being uniformly spaced on the right side of the convex support surfaces, and which senses sunlight so as to horizontally rotate the solar collector panel; a passive element circuit which has one or more first comparison circuits for comparing the difference in the quantity of output light between the first optical sensors and the second optical sensors and one or more second comparison circuits for comparing the difference in the quantity of output light between the third optical sensors and the fourth optical sensors, and which outputs a driving value for adjusting the altitude of and horizontally rotating the solar collector panel in the direction having a larger light value; an altitude adjustment driving unit for receiving a driving power source from the solar cells of the solar collector panel and for adjusting the altitude of the solar collector panel according to the driving value of the passive element circuit; and a horizontal rotation driving unit for performing the horizontal rotation.

摘要翻译： 提供了一种自供电的太阳能跟踪器，其是用于调节太阳能收集器板的高度并水平旋转的太阳能跟踪器，使得其上设置有多个太阳能电池的太阳能收集器面板可面向太阳，其中， 具有：高度调节光学传感器单元，其具有一个或多个第一光学传感器，所述第一光学传感器通过在凸起的支撑表面的上侧均匀地间隔开以面对太阳镜，以及一个或多个第二光学传感器，所述第二光学传感器通过在 凸起的支撑表面的下侧，并且感测太阳光以调节太阳能收集器板的高度; 水平旋转光学传感器单元，其具有一个或多个第三光学传感器，所述第三光学传感器通过在凸状支撑表面的左侧均匀地隔开以形成以面对太阳，以及一个或多个第四光学传感器，其通过在 凸起的支撑表面，并且其感测太阳光以水平地旋转太阳能收集器面板; 无源元件电路，其具有用于比较第一光学传感器和第二光学传感器之间的输出光量的差异的一个或多个第一比较电路和用于比较第一光学传感器和第二光学传感器之间的输出光量差异的一个或多个第二比较电路， 第三光传感器和第四光传感器，并且输出用于调节具有较大光值的方向的太阳能收集板的高度和水平旋转的驱动值; 高度调节驱动单元，用于从太阳能收集板的太阳能电池接收驱动电源，并根据无源元件电路的驱动值调节太阳能收集板的高度; 以及水平旋转驱动单元，用于执行水平旋转。

公开(公告)号：US07999611B2

公开(公告)日：2011-08-16

申请号：US12494620

申请日：2009-06-30

申请人： Mi Hye Kim ,  Jae Jin Lee

发明人： Mi Hye Kim ,  Jae Jin Lee

IPC分类号： H03F1/14

CPC分类号： H03F3/45183 ,  H03F2203/45674

摘要： A differential amplifying device includes a first differential amplifying unit that receives an input signal and a reference voltage. The first differential amplifying unit amplifies the input signal to generate an output signal when a sensing signal is at a first level. A second differential amplifying unit is configured to also receive the input signal and the reference voltage. The second differential amplifying unit amplifies the input signal to generate the output signal when the sensing signal is at a second level. The first and second differential amplifying units are configured to take advantage of transistor characteristics.

摘要翻译： 差分放大装置包括接收输入信号和参考电压的第一差分放大单元。 当感测信号处于第一电平时，第一差分放大单元放大输入信号以产生输出信号。 第二差分放大单元被配置为还接收输入信号和参考电压。 当感测信号处于第二电平时，第二差分放大单元放大输入信号以产生输出信号。 第一和第二差分放大单元被配置为利用晶体管特性。

公开(公告)号：US07994948B2

公开(公告)日：2011-08-09

申请号：US12474957

申请日：2009-05-29

申请人： Seung Hyun Cho ,  Moo Kyoung Chung ,  Kyung Su Kim ,  Jae Jin Lee ,  Jun Young Lee ,  Seong Mo Park ,  Nak Woong Eum

发明人： Seung Hyun Cho ,  Moo Kyoung Chung ,  Kyung Su Kim ,  Jae Jin Lee ,  Jun Young Lee ,  Seong Mo Park ,  Nak Woong Eum

IPC分类号： H03M7/40

CPC分类号： H03M7/425

摘要： Provided is a table generation method of decoding a variable-length code. The table generation method includes receiving a variable-length code table and a search width N, generating a K-ary tree from the variable-length code table and the search width N, and generating an N-bit code table from the K-ary tree.

摘要翻译： 提供了对可变长度码进行解码的表生成方法。 表生成方法包括从可变长度代码表和搜索宽度N接收可变长度代码表和搜索宽度N，生成K元树，并从K元生成N位代码表 树。

公开(公告)号：US07821304B2

公开(公告)日：2010-10-26

申请号：US12138554

申请日：2008-06-13

申请人： Mi Hye Kim ,  Jae Jin Lee

发明人： Mi Hye Kim ,  Jae Jin Lee

IPC分类号： H03B1/00

CPC分类号： G11C7/1078 ,  G11C7/1084

摘要： A semiconductor device stabilizes an operation of an input buffer. A semiconductor device includes an input potential detection unit, an input buffer, and a current sink unit. The input potential detection unit outputs a detection signal in response to a level of an input signal. The input buffer buffers the input signal by differentially amplifying the input signal through a first current sink unit. The current sink unit receives the detection signal, and in response to the detection signal, performs an auxiliary differential amplifying operation with respect to the input signal buffered by the input buffer.

摘要翻译： 半导体器件稳定输入缓冲器的操作。 半导体器件包括输入电位检测单元，输入缓冲器和电流吸收单元。 输入电位检测单元响应于输入信号的电平输出检测信号。 输入缓冲器通过第一电流吸收单元对输入信号进行差分放大来缓冲输入信号。 当前的接收单元接收检测信号，并且响应于检测信号，对由输入缓冲器缓冲的输入信号执行辅助差分放大操作。