公开(公告)号：US07948772B2

公开(公告)日：2011-05-24

申请号：US12371794

申请日：2009-02-16

申请人： Yueh-Ming Tung ,  Kuo-Yang Sun ,  Chia-Ming Yang ,  Chung-Lun Lee ,  Jin-Chun Wen ,  Yuan-Wei Liu ,  Wei-Mao Hung

发明人： Yueh-Ming Tung ,  Kuo-Yang Sun ,  Chia-Ming Yang ,  Chung-Lun Lee ,  Jin-Chun Wen ,  Yuan-Wei Liu ,  Wei-Mao Hung

IPC分类号： H05K9/00

CPC分类号： H05K1/0259 ,  H05K2201/09336 ,  H05K2201/09354 ,  H05K2201/10159 ,  Y10T29/4913

摘要： A memory card with electrostatic discharge (ESD) protection and a manufacturing method thereof are provided. The memory card includes a circuit board, a set of contacts, at least one chip and an ESD protection path. The signal paths of the board is not exposed at the edge of the circuit board. The ESD protection path for transmitting ESD current is disposed on the circuit board. Furthermore, a part of the ESD protection path extends to the edge of the circuit board.

摘要翻译： 提供一种具有静电放电（ESD）保护的存储卡及其制造方法。 存储卡包括电路板，一组触点，至少一个芯片和ESD保护路径。 板的信号路径不暴露在电路板的边缘。 用于传输ESD电流的ESD保护路径设置在电路板上。 此外，ESD保护路径的一部分延伸到电路板的边缘。

公开(公告)号：US20090253230A1

公开(公告)日：2009-10-08

申请号：US12486256

申请日：2009-06-17

申请人： Yueh-Ming TUNG ,  Chia-Ming Yang ,  Shu-Hui Lin ,  Ta-Fa Lin ,  Mien-Fang Sung

发明人： Yueh-Ming TUNG ,  Chia-Ming Yang ,  Shu-Hui Lin ,  Ta-Fa Lin ,  Mien-Fang Sung

IPC分类号： H01L21/50

CPC分类号： H01L25/0657 ,  H01L23/3121 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a stack chip package structure is disclosed. The method comprises: providing a first substrate; disposing a first chip on the first substrate; disposing a second chip and at least one second substrate on the first chip, wherein the second substrate is electrically connected to the first chip; bonding at least one first connecting wire connected between the second chip and the second substrate; bonding at least one second connecting wire connected between the first substrate and the second substrate; and forming a package body on the first substrate to encapsulate the first chip, the second chip, the second substrate, the first connecting wire and the second connecting wire.

摘要翻译： 公开了一种制造堆叠芯片封装结构的方法。 该方法包括：提供第一衬底; 在第一基板上设置第一芯片; 在第一芯片上设置第二芯片和至少一个第二基板，其中第二基板电连接到第一芯片; 接合连接在第二芯片和第二基板之间的至少一个第一连接线; 接合连接在第一基板和第二基板之间的至少一个第二连接线; 以及在所述第一基板上形成封装体以封装所述第一芯片，所述第二芯片，所述第二基板，所述第一连接线和所述第二连接线。

公开(公告)号：US07197007B2

公开(公告)日：2007-03-27

申请号：US10063771

申请日：2002-05-11

申请人： Guu-Chang Yang ,  Chia-Ming Yang ,  Pei-Hsuan Lin

发明人： Guu-Chang Yang ,  Chia-Ming Yang ,  Pei-Hsuan Lin

IPC分类号： H04J11/00

CPC分类号： H04J13/0044 ,  H04J13/12 ,  H04L5/026

摘要： A code tree of two-dimensional orthogonal variable spreading factor (2D-OVSF) code matrices for a multicarrier direct-sequence code-division multiple-access (MC-DS/CDMA) communications system is generated by providing two sets of 2×2 orthogonal matrices {A(1)(2×2), A(2)(2×2)} and {B(1)(2×2), B(2)(2×2)}. The first set of 2×2 matrices is used to generate a pair of sibling nodes in the code tree that respectively represent matrices A(1)(2×2α) and A(2)(2×2α) by iterating the relationship: A(1)(2×21+β)=[A(1)(2×2β)A(2)(2×2β)], The matrices A(1)(2×2α) and A(2)(2×2α) are A(2)(2×21+β)=[A(1)(2×2β)−A(2)(2×2β)]. used to generate a child node of one of the sibling nodes. The child node contains an M×N matrix, which is found by iterating the relationship: A(i−1)(O×P)=[B(1)(2×2){circle around (×)}A(i/2)(0/2×P/2)] where {circle around (×)} indicates a Kronecker product. A(i)(O×P)=[B(2)(2×2){circle around (×)}A(i/2)(0/2×P/2)],

摘要翻译： 通过提供两组2x2正交矩阵来生成用于多载波直接序列码分多址（MC-DS / CDMA）通信系统的二维正交可变扩频因子（2D-OVSF）码矩阵的码树 （2）/（2×2），（2×2），和（B） （1）（2x2），（2）（2x2）}。 第一组2x2矩阵用于在代码树中产生一对分别表示矩阵A 1（2）和（2）的兄弟节点 ＆lt; / SUP2＆gt;＆lt; / SUB＆gt;＆lt; / SUP＆gt;＆lt; / SUP＆gt;（2） SUB> _）

公开(公告)号：US20070032180A1

公开(公告)日：2007-02-08

申请号：US11199607

申请日：2005-08-08

申请人： Chien Hwang ,  Yu-Liang Lin ,  Chia-Ming Yang ,  Cheng Chan ,  Jean Wang ,  Chen-Hua Yu

发明人： Chien Hwang ,  Yu-Liang Lin ,  Chia-Ming Yang ,  Cheng Chan ,  Jean Wang ,  Chen-Hua Yu

IPC分类号： B24B29/00

CPC分类号： B24B57/02 ,  B24B37/04

摘要： A slurry residence time enhancement system for a chemical mechanical polishing apparatus having a base, a platen on the base, a polishing pad on the platen and a polishing head over the polishing pad is disclosed. The system includes at least one slurry distribution unit having a slurry distribution member for positioning on the polishing pad. In operation of the CMP apparatus, the slurry distribution member redirects polishing slurry on the polishing pad to the polishing head. The system may alternatively or additionally include a rim for upward extension from the base and a seal for insertion between the platen and the polishing pad adjacent to the rim.

摘要翻译： 公开了一种用于化学机械抛光设备的浆料停留时间增强系统，其具有底座，底座上的压板，压板上的抛光垫和抛光垫上的抛光头。 该系统包括至少一个浆料分配单元，其具有用于定位在抛光垫上的浆料分配构件。 在CMP装置的操作中，浆料分配构件将抛光垫上的抛光浆料重新定向到抛光头。 系统可以可选地或另外地包括用于从基座向上延伸的边缘和用于插入在压板和与边缘相邻的抛光垫之间的密封件。

公开(公告)号：US20060001134A1

公开(公告)日：2006-01-05

申请号：US10711794

申请日：2004-10-06

申请人： Kuo-Yang Sun ,  Chia-Ming Yang

发明人： Kuo-Yang Sun ,  Chia-Ming Yang

IPC分类号： H01L23/48

CPC分类号： H01L24/16 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package structure includes a lead frame having a plurality of leads, each of which includes a first recession, at least a first device, and a plurality of solder joints respectively positioned in the first recessions for connecting the first device to the lead frame.

摘要翻译： 封装结构包括具有多个引线的引线框架，每个引线包括第一凹陷，至少第一器件和分别位于第一凹部中的多个焊点，用于将第一器件连接到引线框架。

公开(公告)号：US20050270212A1

公开(公告)日：2005-12-08

申请号：US10908743

申请日：2005-05-24

申请人： Sterling Smith ,  Chia-Ming Yang ,  Chih-Shiun Lu

发明人： Sterling Smith ,  Chia-Ming Yang ,  Chih-Shiun Lu

IPC分类号： H03M1/10 ,  H03M1/12

CPC分类号： H03M1/1028 ,  H03M1/1215

摘要： A high-speed video signal processing system, which includes a reception end for receiving analog signals; a plurality of analog to digital converters coupled to the reception end for converting analog signals received from the reception end to digital signals according to control signals; and an interleaving controller coupled to the plurality of analog to digital converters for generating the control signals to selectively enable the plurality of analog to digital converters according to a predetermined sequence.

摘要翻译： 一种高速视频信号处理系统，包括用于接收模拟信号的接收端; 耦合到接收端的多个模数转换器，用于根据控制信号将从接收端接收的模拟信号转换成数字信号; 以及耦合到所述多个模数转换器的交织控制器，用于产生所述控制信号，以根据预定顺序选择性地启用所述多个模数转换器。

公开(公告)号：US09205529B2

公开(公告)日：2015-12-08

申请号：US13165763

申请日：2011-06-21

申请人： Liang-Chuo Ham ,  Chin-Chuan Chih ,  Jiann-Mo Lee ,  Chia-Ming Yang ,  Wen-Yen Chen

发明人： Liang-Chuo Ham ,  Chin-Chuan Chih ,  Jiann-Mo Lee ,  Chia-Ming Yang ,  Wen-Yen Chen

IPC分类号： H01L21/306 ,  B24B57/00 ,  B24B57/02 ,  H01L21/321 ,  H01L21/67 ,  B24B3/02

CPC分类号： B24B57/02 ,  B24B3/02 ,  H01L21/32115 ,  H01L21/3212 ,  H01L21/67051 ,  H01L21/6708

摘要： A dispenser for a chemical-mechanical polishing (CMP) apparatus, includes a delivery arm disposed over a polishing pad of a CMP apparatus, at least a slurry delivery groove formed in the delivery arm and extending along a length of the delivery arm, and a plurality of first openings connected to the slurry delivery groove.

摘要翻译： 一种用于化学机械抛光（CMP）设备的分配器，包括设置在CMP设备的抛光垫上的输送臂，至少形成在输送臂中并沿着输送臂的长度延伸的浆料输送槽， 连接到浆料输送槽的多个第一开口。

公开(公告)号：USD647097S1

公开(公告)日：2011-10-18

申请号：US29379019

申请日：2010-11-12

申请人： Yueh Ming Tung ,  Chia Ming Yang ,  Hsiu Fang Tsai ,  Shu Hui Lin ,  Hung Lin Chiang

设计人： Yueh Ming Tung ,  Chia Ming Yang ,  Hsiu Fang Tsai ,  Shu Hui Lin ,  Hung Lin Chiang

公开(公告)号：US20100133434A1

公开(公告)日：2010-06-03

申请号：US12385356

申请日：2009-04-06

申请人： Hsin-Fei Meng ,  Sheng-Fu Horng ,  Hsin-Rong Tseng ,  Chia-Ming Yang ,  En-Chen Chen

发明人： Hsin-Fei Meng ,  Sheng-Fu Horng ,  Hsin-Rong Tseng ,  Chia-Ming Yang ,  En-Chen Chen

IPC分类号： H01L27/14

CPC分类号： H01L27/305 ,  B82Y10/00 ,  H01L27/322 ,  H01L51/0036 ,  H01L51/0047 ,  H01L51/4253

摘要： An organic semiconductor infrared distance sensing apparatus and an organic infrared emitting apparatus thereof are disclosed. The organic semiconductor infrared distance sensing apparatus comprises an organic infrared emitting apparatus and an organic infrared receiving apparatus. The organic infrared emitting apparatus has a positive electrode layer and a negative electrode layer to form an electric field, and organic light emitting molecules are sandwiched between the two layers and correspond to the positive electrode layer and the negative electrode layer. Under a positive bias, a plurality of electrons and holes are respectively injected from electrodes and recombine with each other to emit photons. An infrared organic conversion layer absorbs and transfers the energy to infrared emitting molecules to emit infrared light. The organic infrared receiving apparatus receives the infrared light reflected by an obstacle to generate photocurrent which varies with distance, thereby sensing the distance between the obstacle and the apparatus.

摘要翻译： 公开了一种有机半导体红外距离感测装置及其有机红外发射装置。 有机半导体红外距离感测装置包括有机红外发射装置和有机红外线接收装置。 有机红外线发射装置具有形成电场的正极层和负极层，并且有机发光分子夹在两层之间，并且对应于正极层和负极层。 在正偏压下，分别从电极注入多个电子和空穴并彼此重组以发射光子。 红外有机转化层吸收并将能量转移到红外发射分子以发射红外光。 有机红外线接收装置接收由障碍物反射的红外光，以产生随距离变化的光电流，从而感测障碍物与装置之间的距离。

公开(公告)号：US20090289247A1

公开(公告)日：2009-11-26

申请号：US12385967

申请日：2009-04-24

申请人： Hsin-Fei Meng ,  Sheng-Fu Horng ,  Chia-Ming Yang

发明人： Hsin-Fei Meng ,  Sheng-Fu Horng ,  Chia-Ming Yang

IPC分类号： H01L51/46

CPC分类号： H01L51/4253 ,  B82Y10/00 ,  H01L51/0036 ,  H01L51/0047 ,  Y02E10/549 ,  Y02P70/521

摘要： An organic-semiconductor-based infrared receiving device comprises an electrode layer having a positive layer and a negative layer to form an electric field, and a transport layer located between the positive and negative layers and having a first and a second predetermined material combined in a predetermined ratio. The energy of infrared light from a light source is received at an interface between the first and second materials. The thickness of the transport layer can be increased to enhance the light absorbance in the infrared light range to form electron-hole pairs, which are then parted to form a plurality of electrons and holes driven by the electric field to move to the negative layer and the positive layer, respectively, so that a predetermined photocurrent is generated.

摘要翻译： 基于有机半导体的红外线接收装置包括具有正层和负层以形成电场的电极层，以及位于正层和负层之间的传输层，并且具有第一和第二预定材料 预定比例。 来自光源的红外光的能量被接收在第一和第二材料之间的界面处。 可以增加输送层的厚度，以增强红外光范围内的光吸收，形成电子 - 空穴对，然后将其分开以形成由电场驱动的多个电子和空穴移动到负层， 正层，从而产生预定的光电流。