摘要:
The present invention proposes a secondary battery structure with a solid electrolyte, which can secure high reliability at a low cost and realize high energy density and high output, and also proposes a method for producing the secondary battery structure simply at a low cost while realizing reduced size and weight. The present invention provides a secondary battery structure of planar, inter digital shape as the one with a solid electrolyte, capable of realizing reduced cost, high safety, high energy density and high output, wherein anode and cathode collectors of pectinate shape are provided to face each other on a flat substrate by patterning, anode and cathode material particles are patterned on the respective anode and cathode collectors by electrophotography in the vertical direction to the collector surface to form the vertical electrodes, and the gap between the adjacent anode and cathode is filled with the solid electrolyte.
摘要:
A droplet generator comprising a first unit having an elongate liquid chamber one end thereof is open and at least one raw of orifices disposed in a line oppositely to the open end in the longitudinal direction of the first unit, a second unit having an elongate diaphragm provided on the bottom of the second unit and a plurality of vibrators provided within the diaphragm area, a vibrating apparatus provided on the top of the vibrators, and a stationary section to fix the vibrating apparatus; whereinthe diaphragm of the second unit is provided closely and oppositely to the open end of the liquid chamber of the first unit.
摘要:
An object is to improve the adhesion strength between a circuit pattern and its substrate without increasing the resistance value of the circuit pattern in preparation of a circuit pattern holding substrate. A circuit pattern formation device 100 forms, after forming a precursor circuit-pattern 12 in the surface of a dielectric thin film body 4, a circuit pattern 14 onto a target substrate 23 from the dielectric thin film body. After forming an electrostatic latent image 2 in the upper surface of the dielectric thin film body, the electrostatic latent image is exposed using an exposure unit 3 to prepare a pattern. A development apparatus 7 supplies a conductive particle dispersion solution 6 to this pattern to form a precursor circuit-pattern. By energizing the circuit pattern holding substrate 8, in which an adhesive layer 22 is formed, the precursor circuit-pattern is temporarily transferred to the circuit pattern holding substrate. The transferred precursor circuit-pattern is heated using the heater 13 to form a circuit pattern. The circuit pattern and the adhesive layer are released from the circuit pattern holding substrate, thereby transferring to the target substrate.
摘要:
An electrically conductive pattern forming apparatus has process disposition which reduces contamination of a pattern or inside of the apparatus due to backflow and leakage of a liquid material such as a developing agent or a cleaning liquid. A developing device and a cleaning device in the electrically conductive pattern forming apparatus using an electrophotographic method are disposed in a lower region about the center of a photoreceptor, a solvent removing process is disposed in a region in which the photoreceptor rotates upward, and a transfer liquid applying process and an electrostatic transfer process are disposed above the center of the photoreceptor and in a region in which the photoreceptor rotates downward.
摘要:
An electrically conductive pattern forming apparatus has process disposition which reduces contamination of a pattern or inside of the apparatus due to backflow and leakage of a liquid material such as a developing agent or a cleaning liquid. A developing device and a cleaning device in the electrically conductive pattern forming apparatus using an electrophotographic method are disposed in a lower region about the center of a photoreceptor, a solvent removing process is disposed in a region in which the photoreceptor rotates upward, and a transfer liquid applying process and an electrostatic transfer process are disposed above the center of the photoreceptor and in a region in which the photoreceptor rotates downward.
摘要:
A droplet generator comprising a first unit having an elongate liquid chamber one end thereof is open and at least one raw of orifices disposed in a line oppositely to the open end in the longitudinal direction of the first unit, a second unit having an elongate diaphragm provided on the bottom of the second unit and a plurality of vibrators provided within the diaphragm area, a vibrating apparatus provided on the top of the vibrators, and a stationary section to fix the vibrating apparatus. The diaphragm of the second unit is provided closely and oppositely to the open end of the liquid chamber of the first unit.
摘要:
An object is to improve the adhesion strength between a circuit pattern and its substrate without increasing the resistance value of the circuit pattern in preparation of a circuit pattern holding substrate. A circuit pattern formation device 100 forms, after forming a precursor circuit-pattern 12 in the surface of a dielectric thin film body 4, a circuit pattern 14 onto a target substrate 23 from the dielectric thin film body. After forming an electrostatic latent image 2 in the upper surface of the dielectric thin film body, the electrostatic latent image is exposed using an exposure unit 3 to prepare a pattern. A development apparatus 7 supplies a conductive particle dispersion solution 6 to this pattern to form a precursor circuit-pattern. By energizing the circuit pattern holding substrate 8, in which an adhesive layer 22 is formed, the precursor circuit-pattern is temporarily transferred to the circuit pattern holding substrate. The transferred precursor circuit-pattern is heated using the heater 13 to form a circuit pattern. The circuit pattern and the adhesive layer are released from the circuit pattern holding substrate, thereby transferring to the target substrate.
摘要:
The purpose of the present invention is to provide a method for transferring a pattern of a circuit pattern precursor formed of electroconductive particles containing no resin component onto an objective substrate with high transfer efficiency while retaining a pattern shape. A method of transferring the circuit pattern precursor formed from an conductive particle dispersed solution on a dielectric thin film body includes the steps of: temporarily removing a liquid film remaining around the circuit pattern precursor right after a development step; subsequently re-electrifying the electroconductive particle pattern by supplying a solvent again to the circuit pattern precursor; and then electrostatically transferring the pattern onto the objective substrate through electrophoresis in the solvent.
摘要:
A conductive pattern forming apparatus using electrostatic force, by which high productivity, application to a large area and pattern change availability are achieved, without limiting a substrate nor increasing extra steps of plating and the like, with easy steps, lower cost, shorter manufacturing time and less environmental load. The conductive pattern forming apparatus is provided with an electrostatic latent image forming means for forming an electrostatic pattern on a dielectric thin film surface, and a developing means for forming the conductive pattern by development by supplying a conductive particle dispersed solution to the electrostatic latent image and bringing the solution into contact with the electrostatic latent image. The conductive particle dispersed solution is provided by dispersing conductive particles, which have ionic organic molecules adsorbed on the surface and a particle diameter of 100 nm or less, in a non-polar solvent.
摘要:
Microscopic particle decentralized solution having microscopic particles with different diameters are decentralized, wherein: the microscopic particle decentralized solution has two peaks in a granularity distribution, at a large diameter and a small diameter; and microscopic particle mixtures satisfying the following relationships are decentralized in the solution; R>r and n>3.84×(R/r)3×N, where R is a large particle diameter, r is a small particle diameter, N is the number of large particles, and n is the number of small particle.