摘要:
The invention provides a compound semiconductor multilayer structure having a two-dimensional electron gas, which is applicable to field effect transistors. A ternary compound InGaAs planar channel layer serving as a quantum well has a variation of an In (indium) fraction in a perpendicular direction to a heterojunction interface. The variation has a step-graded profile with taking a maximum value at or in the vicinity of a portion where the two-dimensional electron gas takes a maximum density. Such quantum well has most large depth at a portion except for adjacent portions to the heterojunction interfaces. Such multilayer structure provides a great electron mobility and a strong electron confinement to major electrons at a high electron density portion. Such multilayer structure provides the large effective electron mobility and the large sheet electron density to the two-dimensional electron gas without a gain of the average of the In (indium) fractions, thereby suppressing the enlargement of the lattice mismatch which causes misfit dislocations in crystals.
摘要:
A two dimensional electron gas field effect transistor comprising a buffer layer, a channel layer and an N-type electron supply layer formed on a semi-insulating, InP substrate in the named order. The channel layer is formed of an In.sub.1-x Ga.sub.x As.sub.y P.sub.1-y layer, the composition ratios "x" and "y" changing in a depth direction.
摘要:
A field effect transistor (20) comprises a first semiconductor layer (24) and a second semiconductor layer (25) formed on the first semiconductor layer. The first semiconductor layer is an undoped layer and is composed of InGaAs. The second semiconductor layer is composed of InAlGaP and is a doped layer in which an n-type impurity is doped. A heterojunction structure is formed between the first semiconductor layer and the second semiconductor layer.
摘要:
In a field effect transistor having a channel layer interposed between heterojunctions, the channel layer has an intermediate layer of undoped InGaAs interposed between first and second channel layers each of which has a composition different from the intermediate layer. The composition of each of the first and the second channel layers may be composed of either InP or InGaAs. The intermediate layer may be formed either by a single layer of InGaAs or by a plurality of intermediate films of InGaAs which have In compositions different from one another when each of the first and the second channel layers is composed of InP. A maximum one of the In compositions is assigned to a selected one of the intermediate films. Alternatively, a selected one of the intermediate films includes a maximum In composition when each of the first and the second channel layers is formed by InGaAs.
摘要:
A field plate portion (5) overhanging a drain side in a visored shape is formed in a gate electrode (2). A multilayered film including a SiN film (21) and a SiO2 film (22) is formed beneath the field plate portion (5). The SiN film (21) is formed so that a surface of an AlGaN electron supply layer (13) is covered therewith.
摘要:
A field effect transistor includes a semiconductor layer structure including GaN channel layer 12 and AlGa electron supply layer 13, source electrode 1 and drain electrode 3 which are formed on electron supply layer 13 so as to be separated from each other, gate electrode 2 formed between source electrode 1 and drain electrode 3, and SiON film 23 formed on electron supply layer 13. Gate electrode 2 has a field plate portion 5 that projects toward drain electrode 3 in the form of an eave on SiON film 23. The thickness of a portion (field plate layer 23a) of SiON film 23 lying between field plate portion 5 and electron supply layer 13 gradually increases from gate electrode 2 to drain electrode 3.
摘要:
An electric-field control electrode (5) is formed between a gate electrode (2) and a drain electrode (3). A multilayered film including a SiN film (21) and a SiO2 film (22) is formed below the electric-field control electrode (5). The SiN film (21) is formed so that a surface of an AlGaN electron supply layer (13) is covered with the SiN film (21).
摘要:
An object of the present invention is to improve, in a group III nitride semiconductor device, the productivity, heat radiation characteristic and performance in the element high speed operation; upon a sapphire substrate in which an A plane (an (11-20) plane) is set to be the basal plane, an epitaxial growth layer of a group III nitride semiconductor is formed and, thereon, a gate electrode 16, a source electrode 15 and a drain electrode 17 are formed; these electrodes are disposed in such a way that a direction along which they are laid makes an angle within 20° with respect to a C axis of sapphire.
摘要:
The present invention provides a semiconductor device capable of suppressing current collapse, and also of preventing dielectric breakdown voltage and gain from lowering so as to perform high-voltage operation and realize an ideal high output. On a substrate (101), there are formed a buffer layer (102) made of a first GaN-based semiconductor, a carrier traveling layer (103) made of a second GaN-based semiconductor and a carrier supplying layer (104) made of a third GaN-based semiconductor. A recess structure (108) is made by eliminating a part of a first insulation film (107) and a part of the carrier supplying layer (104). Next, a gate insulation film (109) is deposited, and then a gate electrode (110) is formed so as to fill up the recess portion (108) and cover on over an area where the first insulation film (107) remains so that its portion on the drain electrode side is longer than that on the source electrode side. Such a recess structure is employed so as to provide the high-output semiconductor device capable of performing the high-voltage operation.
摘要:
An ohmic electrode structure of a nitride semiconductor device having a nitride semiconductor. The ohmic electrode structure is provided with a first metal film formed on the nitride semiconductor and a second metal film formed on the first metal film. The first metal film is composed of at least one material selected from a group consisting of V, Mo, Ti, Nb, W, Fe, Hf, Re, Ta and Zr. The second metal film is composed of at least one material different from that of the first metal film (102), selected from a group consisting of V, Mo, Ti, Nb, W, Fe, Hf, Re, Ta, Zr, Pt and Au.