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17 条记录 (耗时 0.026 秒)

    Digital broadcast receiving unit
    6.
    发明申请
    Digital broadcast receiving unit 审中-公开
    数字广播接收单元

    公开(公告)号：US20070077910A1

    公开(公告)日：2007-04-05

    申请号：US11527175

    申请日：2006-09-26

    申请人： Hiroyuki Imadate ,  Yusuke Kataoka ,  Yuji Umeda ,  Takashi Shimasaki

    发明人： Hiroyuki Imadate ,  Yusuke Kataoka ,  Yuji Umeda ,  Takashi Shimasaki

    IPC分类号： H04B1/08

    CPC分类号： H04N5/50 ,  H04N21/426

    摘要： It is an object of the invention to provide a digital broadcast receiving unit capable of restraining the influence of a noise generated in a digital signal processing circuit to be exerted upon a turner unit, and of arranging a digital signal processing circuit board close to the tuner unit while restraining the influence exerted upon a peripheral circuit thereof and so forth even if the tuner unit is laid out on any location of a main circuit board. Both the tuner unit and the digital signal processing circuit board substantially stand upright on the main circuit board, respectively. The digital signal processing circuit board is disposed close to the tuner unit along the longitudinal direction thereof, and the digital signal processing circuit board has a mounting face on which electronic components such as ICs and so forth are mounted at a side facing tuner unit. Ground patterns are formed on the digital signal processing circuit board at a side opposite to the tuner unit and is rendered in an exposed state having no sealed case.

    摘要翻译： 本发明的目的是提供一种数字广播接收单元，其能够抑制在数字信号处理电路中产生的噪声对特性单元的影响，并且将数字信号处理电路板布置在调谐器附近 同时抑制施加于其外围电路等的影响，即使调谐器单元布置在主电路板的任何位置上。 调谐器单元和数字信号处理电路板分别基本上直立在主电路板上。 数字信号处理电路板沿其长度方向设置在调谐器单元附近，并且数字信号处理电路板具有安装面，电子元件如IC等安装在调谐器单元的一侧。 地面图案形成在数字信号处理电路板的与调谐器单元相对的一侧，并且呈现为没有密封外壳的露出状态。

    Dielectric ceramic composition and electronic component
    8.
    发明授权
    Dielectric ceramic composition and electronic component 有权
    介电陶瓷组合物和电子元件

    公开(公告)号：US08053385B2

    公开(公告)日：2011-11-08

    申请号：US12699427

    申请日：2010-02-03

    申请人： Yuji Umeda ,  Fan Zhang

    发明人： Yuji Umeda ,  Fan Zhang

    IPC分类号： C04B35/468 ,  C04B35/47

    CPC分类号： C04B35/4682 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3236 ,  C04B2235/3241 ,  C04B2235/3262 ,  C04B2235/3272 ,  C04B2235/3277 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/79

    摘要： The dielectric ceramic composition comprising a main component including a compound satisfying a compositional formula of (SrxBa1-x)mTiO3 (“x” in said compositional formula is 0.159≦“x”≦0.238, and “m” is 0.997≦“m”≦1.011), and a subcomponent comprising 11 to 25 weight % of CaTiO3, 0.10 to 0.50 weight % of at least one oxide of element selected from the group consisting of Fe, Co, Ni, Cu, and Zn in terms of FeO3/2, CoO4/3, NiO, CuO, and ZnO, 0.590 to 1.940 mol % of an oxide of element “A” (A is Mn and/or Cr), and an oxide of element “D” where “D” is at least one element selected from a group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, and Y; wherein a ratio (A/D) of the element “A” with respect to element “D” is 2.250 to 7.450. According to the present invention, the dielectric loss (tan δ) at the wide frequency range can be lowered while maintaining a good capacitance temperature characteristic and the specific permittivity, without including Pb and bismuth Bi.

    摘要翻译： 包含满足组成式（SrxBa1-x）mTiO3的化合物的主成分的电介质陶瓷组合物（所述组成式中的“x”为0.159＆nlE;“x”＆nlE; 0.238，“m”为0.997＆ m“＆nlE; 1.011），和包含11-25重量％的CaTiO 3，0.10-0.50重量％的至少一种选自Fe，Co，Ni，Cu和Zn的元素氧化物的次要成分 FeO3 / 2，CoO4 / 3，NiO，CuO和ZnO，元素“A”的氧化物（A为Mn和/或Cr）为0.590〜1.940摩尔％，元素“D”的氧化物为“D” 是选自La，Ce，Pr，Nd，Sm，Eu，Gd，Tb，Dy，Ho和Y中的至少一种元素; 其中元素“A”相对于元素“D”的比率（A / D）为2.250至7.450。 根据本发明，在不包含Pb和Bi的情况下，能够在保持良好的电容温度特性和比介电常数的同时降低宽频率范围的介电损耗（tanδ）。

    Ceramic joined body
    9.
    发明授权
    Ceramic joined body 失效
    陶瓷接合体

    公开(公告)号：US5138426A

    公开(公告)日：1992-08-11

    申请号：US410128

    申请日：1989-09-20

    申请人： Yuji Umeda ,  Tadashi Otagiri ,  Go Suzuki

    发明人： Yuji Umeda ,  Tadashi Otagiri ,  Go Suzuki

    IPC分类号： C04B37/02 ,  C04B37/04 ,  H01L23/10 ,  H01L23/15

    CPC分类号： H01L23/10 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152

    摘要： In a ceramic joined body wherein a first metalizing layer formed on a surface of an aluminum nitride member on which semiconductor elements are installed and a second metalizing layer formed on a surface of an insulation substrate fireable at low temperatures are joined with each other via a solder used at high temperatures, an intermediate layer including a predetermined metal component and a predetermined glass component is arranged between the insulation substrate and the second metalizing layer. The glass component is melted into the insulation substrate during the firing operation, and thus a sufficient connection strength between the insulation substrate and the aluminum nitride member can be obtained. Moreover, the metal component and the glass component function to make the thermal expansion coefficient an intermediate value between the insulation substrate and the first metalizing layer, and thus heat stress generated during the brazing operation can be eliminated.

    摘要翻译： 在陶瓷接合体中，其中形成在其上安装半导体元件的氮化铝构件的表面上的第一金属化层和形成在可在低温下燃烧的绝缘基板的表面上的第二金属化层通过焊料彼此接合 在绝缘基板和第二金属化层之间配置有包含规定的金属成分和规定的玻璃成分的中间层。 在烧制操作期间，玻璃成分熔化成绝缘基板，能够获得绝缘基板与氮化铝部件之间的充分的连接强度。 此外，金属成分和玻璃成分的作用是使热膨胀系数成为绝缘基板与第一金属化层之间的中间值，从而可以消除钎焊操作期间产生的热应力。