摘要:
In an optical waveguide device, a rectangle, which uses a filter insertion groove as its diagonal line and uses points on filter insertion grooves adjacent to the above filter insertion groove as its apexes, is assumed as a unit rectangle, and the size of the optical waveguide device is set to an integer multiple of the unit rectangle. In this case, even if filter insertion grooves are formed in a state in which a plurality of the optical waveguide devices are disposed in matrix, the respective optical waveguide devices can be formed in the same shape. Further, the filter insertion grooves formed to the respective optical waveguide devices do not divide portions other than the target portion of other optical waveguide devices. Therefore, the manufacturing processes of the optical waveguide device can be simplified and are suitable for mass production, and manufacturing cost can be suppressed thereby.
摘要:
A semiconductor laser drive apparatus comprises a bias current setting section (232) which sets a bias current value on the basis of the drive temperature so that the temperature characteristic of the bias current value with respect to the drive temperature may be a linear function having a slope except zero and a drive current setting section (233) for setting the drive current value on the basis of the drive temperature so that the temperature characteristic of the drive current value with respect to the drive temperature may be a function having a slope except zero. The temperature characteristic of the bias current and that of the drive current are functions different from each other. With this, low cost, space-saving, and power-saving of a semiconductor laser are achieved, and a semiconductor laser drive apparatus enabling a good transmission characteristic on the reception side and a high optical output over the whole drive temperature range when driving the semiconductor laser can be provided.
摘要:
The spacers 3 and 4 and the recess is formed on the supporting substrate 2 to support the upper cladding layer 7. The intermediate surface 22 and 23 lower than the top surface of the spacers 3 and 4 and higher than the inner bottom surface of the recess is formed on the supporting substrate 2. Each of the height between the top surface of the spacers 3 and 4 and the intermediate surfaces 22 and 23, and the height between the intermediate surfaces 22 and 23 and the inner bottom surface of the recess of the second substrate 2 becomes thin compared with the total thickness of the lower cladding layer. Thus, when the resin for the lower cladding layer 9 is cured to shrinkage, the inner stress in the resin is dispersed and the occurrence of the wrinkle 12 and the void decreases.
摘要:
On a front wall of a mold resin (13) sealing a light emitter (12), a direct emission region (18), through which the light emitted from the light emitter (12) directly passes to the outside, and a total reflection region (19), by which the light emitted from the light emitter (12) is totally reflected, are formed. The direct emission region (18) is formed into a shape of a convex lens. A light reflection portion (20) which is made of a concave mirror is provided on the rear face of the mold resin (13). When a part of the light emitted from the light emitter (12) passes through the direct emission region (18), it is affected by the lens to be emitted to the front direction. After another part of the light emitted from the light emitter (12) is totally reflected by the total reflection region (19), it is reflected by the light reflection portion (20) to be emitted to the front direction through the total reflection region (19).
摘要:
A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.
摘要:
An optical wave guide has a lower cladding layer formed on a substrate, and a Y-branched optical wave guide arranged on the lower cladding layer. The optical wave guide is covered with an upper cladding layer. Curved portions of the optical wave guide are tapered at the external circumferential sides and formed into a trapezoidal cross sectional shape, and effective refractive index of the optical wave guide is made small at the tapered external circumferential sides. Meanwhile, end surfaces of the optical wave guide are formed into a rectangular shape, thereby joint efficiency with optical fibers is increased.
摘要:
A light transmission path package includes first and sealing surface adjustment members, which are arranged with facing each other by way of a light emitting/receiving element on a lead frame substrate, having a length in a normal direction of the substrate surface from the substrate surface of H2; wherein a relational expression H3
摘要:
This invention improves the use efficiency of light emitted by a solid light emitter such as a light emitting diode, and realizes a desired directional pattern. On a front boundary surface of a mold resin 13 sealing a light emitter 12, there are formed a direct emission region 18 for emitting the light from the light emitter 12 and a total reflection region 19 for totally reflecting the light from the light emitter 12. The direct emission region 18 is convex lens-shaped. A light reflecting portion 20 having a concave mirror shape is disposed on a rear wall of the mold resin 13. A part of light emitted from the light emitter 12 is emitted forward by receiving an optical lens action when it passes through the direct emission region 18. Another part of the light emitted by from the light emitter 12 is totally reflected by the total reflection region 19, and is reflected by the light reflecting portion 20, and emitted forward from the total reflection region 19.
摘要:
A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.