公开(公告)号：US20120261093A1

公开(公告)日：2012-10-18

申请号：US13295593

申请日：2011-11-14

申请人： Yukio Miyachi ,  Hiroshi Osada ,  Norifumi Furuta

发明人： Yukio Miyachi ,  Hiroshi Osada ,  Norifumi Furuta

IPC分类号： F28D15/02

CPC分类号： F28F13/14 ,  F28D15/0233 ,  F28F2270/00

摘要： A heat pipe comprises a housing that has a heating section that is made of metal and is contacted by a heating element, a cooling section that is made of metal and is cooled by a cooling element, and a plurality of refrigerant flow channels formed inside the housing from the heating section to the cooling section; refrigerant that is enclosed inside the plurality of refrigerant flow channels; and heat-insulating layers that are disposed between the plurality of refrigerant flow channels located at least at the heating section in the housing.

摘要翻译： 热管包括壳体，其具有由金属制成并与加热元件接触的加热部分，由金属制成并由冷却元件冷却的冷却部分，以及形成在内部的多个制冷剂流动通道 从加热部到冷却部的壳体; 封闭在多个制冷剂流路内的制冷剂; 以及绝热层，其设置在至少位于壳体内的加热部的多个制冷剂流路之间。

公开(公告)号：US08526189B2

公开(公告)日：2013-09-03

申请号：US13074675

申请日：2011-03-29

申请人： Gentaro Yamanaka ,  Hiroshi Osada ,  Yasushi Yamada ,  Naoto Kikuchi ,  Norifumi Furuta ,  Takashi Ueno

发明人： Gentaro Yamanaka ,  Hiroshi Osada ,  Yasushi Yamada ,  Naoto Kikuchi ,  Norifumi Furuta ,  Takashi Ueno

IPC分类号： H05K5/00

CPC分类号： H05K7/1432 ,  H02M7/003

摘要： A power module includes a semiconductor device having a first and second arms, and gate driving circuit board. The first arm includes a first extending electrode, a first gate electrode of a first power device extending in a direction different from the first extending electrode, and a first output electrode extending in the different direction from the first gate electrode. The second arm stacked on the first arm includes a second extending electrode extending in the first extending electrode extending direction in an insulating state, a second gate electrode of a second power device, extending in the first gate electrode extending direction, and a second output electrode extending in the first output electrode extending direction with electrical connection thereto. The gate driving circuit board is disposed at the first and second gate electrodes extending side so as to face the semiconductor device.

摘要翻译： 功率模块包括具有第一和第二臂的半导体器件和栅极驱动电路板。 第一臂包括第一延伸电极，沿与第一延伸电极不同的方向延伸的第一功率器件的第一栅电极和沿与第一栅电极不同的方向延伸的第一输出电极。 堆叠在第一臂上的第二臂包括在绝缘状态下沿第一延伸电极延伸方向延伸的第二延伸电极，在第一栅电极延伸方向上延伸的第二功率器件的第二栅电极和第二输出电极 在与第一输出电极延伸方向电连接的状态下延伸。 栅极驱动电路板设置在第一和第二栅电极延伸侧以面对半导体器件。

公开(公告)号：US08294272B2

公开(公告)日：2012-10-23

申请号：US12728442

申请日：2010-03-22

申请人： Yasushi Yamada ,  Hiroshi Osada ,  Gentaro Yamanaka ,  Norifumi Furuta ,  Akio Kitami ,  Tadafumi Yoshida ,  Hiromichi Kuno

发明人： Yasushi Yamada ,  Hiroshi Osada ,  Gentaro Yamanaka ,  Norifumi Furuta ,  Akio Kitami ,  Tadafumi Yoshida ,  Hiromichi Kuno

IPC分类号： H01L23/36 ,  H01L23/38 ,  H01L23/34 ,  H01L25/07 ,  H01L23/48 ,  H01L25/16 ,  H01L35/28

CPC分类号： H01L23/38 ,  H01L23/427 ,  H01L23/62 ,  H01L23/642 ,  H01L24/29 ,  H01L24/32 ,  H01L25/074 ,  H01L25/16 ,  H01L2224/73253 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107

摘要： A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.

摘要翻译： 功率模块包括堆叠有布置在其间的板状输出电极的一对功率器件，以及配置在其间的一对功率器件堆叠的N电极和P电极。 输出电极是各向异性的，使得与层叠方向正交的方向的导热率大于层叠方向的导热率。 此外，输出电极从堆叠的一对功率器件的堆叠区域沿正交方向延伸。 N电极和P电极在正交方向上延伸，同时保持相对的位置关系。

公开(公告)号：US07671458B2

公开(公告)日：2010-03-02

申请号：US11367272

申请日：2006-03-06

申请人： Norifumi Furuta ,  Noriyuki Masuda

发明人： Norifumi Furuta ,  Noriyuki Masuda

IPC分类号： H01L23/02

CPC分类号： H01L25/117 ,  H01L2924/0002 ,  H01L2924/00

摘要： A connector includes a fitting hole into which a signal line is fitted, a tapered portion formed to lead a tip portion of the signal line to the fitting hole, and a bonded portion for bonding the connector to a control substrate. The tapered portion has a tapered shape on a side where the signal line is inserted. The tapered shape is tilted from a peripheral portion of the tapered portion to the fitting hole in a direction along which the signal line is inserted, with the fitting hole set as a center.

摘要翻译： 连接器包括装配有信号线的装配孔，形成为将信号线的前端部分引导到装配孔的锥形部分，以及用于将连接器接合到控制基板的接合部分。 锥形部分在信号线插入的一侧具有锥形形状。 锥形形状从嵌合孔设置为中心的锥形部分的周边部分沿着插入信号线的方向倾斜到装配孔。

公开(公告)号：US20060226450A1

公开(公告)日：2006-10-12

申请号：US11367272

申请日：2006-03-06

申请人： Norifumi Furuta ,  Noriyuki Masuda

发明人： Norifumi Furuta ,  Noriyuki Masuda

IPC分类号： H01L27/10

CPC分类号： H01L25/117 ,  H01L2924/0002 ,  H01L2924/00

摘要： A connector includes a fitting hole into which a signal line is fitted, a tapered portion formed to lead a tip portion of the signal line to the fitting hole, and a bonded portion for bonding the connector to a control substrate. The tapered portion has a tapered shape on a side where the signal line is inserted. The tapered shape is tilted from a peripheral portion of the tapered portion to the fitting hole in a direction along which the signal line is inserted, with the fitting hole set as a center.

摘要翻译： 连接器包括装配有信号线的装配孔，形成为将信号线的前端部分引导到装配孔的锥形部分，以及用于将连接器接合到控制基板的接合部分。 锥形部分在信号线插入的一侧具有锥形形状。 锥形形状从嵌合孔设置为中心的锥形部分的周边部分沿着插入信号线的方向倾斜到装配孔。

公开(公告)号：US07687901B2

公开(公告)日：2010-03-30

申请号：US11795132

申请日：2006-01-20

申请人： Norifumi Furuta

发明人： Norifumi Furuta

IPC分类号： H01L23/46 ,  H01L23/433

CPC分类号： H01L23/433 ,  H01L23/367 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

摘要： Electrode plates acting as a heat sink are arranged to sandwich a power transistor and a diode. Electrode plates at their surfaces opposite cooling elements at a portion opposite power transistor and diode are formed to be smaller in thickness at a portion adjacent to power transistor and diode substantially at the center than at a periphery. Cooling elements are disposed geometrically along electrode plates to sandwich electrode plates.

摘要翻译： 作为散热器的电极板被布置成夹着功率晶体管和二极管。 在与功率晶体管和二极管相对的部分处的与冷却元件相反的表面处的电极板形成为在与功率晶体管和二极管相邻的部分处的厚度比在周边处基本上在中心处的厚度更小。 冷却元件沿着电极板几何地布置以夹持电极板。

公开(公告)号：US07508097B2

公开(公告)日：2009-03-24

申请号：US10665159

申请日：2003-09-22

申请人： Norifumi Furuta ,  Masami Inagaki ,  Masaaki Kaneko ,  Tatsuya Kawai

发明人： Norifumi Furuta ,  Masami Inagaki ,  Masaaki Kaneko ,  Tatsuya Kawai

IPC分类号： F16P3/20

CPC分类号： B60L11/1887 ,  B60L1/003 ,  B60L3/0069 ,  B60L3/04 ,  B60L11/123 ,  B60L2240/34 ,  H01R13/518 ,  H01R13/641 ,  H01R13/713 ,  H01R2201/26 ,  Y02T10/6217 ,  Y02T10/7077 ,  Y02T90/34

摘要： A PCU having an inverter and the like includes a connector electrically connecting the PCU and external equipment located outside the PCU, a safety bar attaching the connector for preventing the connector from being touched, and an ECU detecting that an interlock circuit is opened via an interlock signal line in response to detachment of the safety bar to shut off supply of electric power to the PCU.

摘要翻译： 具有逆变器等的PCU包括电连接PCU和位于PCU外部的外部设备的连接器，安装连接器以防止连接器被触摸的安全杆，以及检测互锁电路通过互锁而打开的ECU 信号线响应于安全杆的拆卸而切断对PCU的电力供应。

公开(公告)号：US20130308272A1

公开(公告)日：2013-11-21

申请号：US13982543

申请日：2012-02-01

申请人： Norifumi Furuta

发明人： Norifumi Furuta

IPC分类号： F28D15/04 ,  H05K7/20

CPC分类号： F28D15/04 ,  F28D15/0233 ,  F28D15/0275 ,  H01F27/18 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20336 ,  H01L2924/00

摘要： A heat pipe includes a laminate formed by laminating a plurality of flat plates and having capillary tubes formed in the interior thereof, and a working fluid contained in the capillary tubes and operable to transfer heat. In the heat pipe, the laminate has insulating layers made of an insulating material and metal layers made of a metal material, which are alternately laminated.

摘要翻译： 热管包括通过层叠多个平板并且在其内部形成有毛细管而形成的层压体，以及容纳在毛细管中并可操作以传递热量的工作流体。 在热管中，层压体具有由绝缘材料制成的绝缘层和交替层压的由金属材料制成的金属层。

公开(公告)号：US20080192437A1

公开(公告)日：2008-08-14

申请号：US11886264

申请日：2006-03-16

申请人： Norifumi Furuta

发明人： Norifumi Furuta

IPC分类号： H05K7/00 ,  H05K7/20

CPC分类号： H01L25/162 ,  H01C3/06 ,  H01L23/473 ,  H01L24/33 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A power semiconductor element and a capacitor have their electrodes joined to each other in a module. The power semiconductor element is formed on a semiconductor substrate having first and second main surfaces. A power semiconductor module includes an electrode through which a main current flows, joined to the first main surface, an electrode through which the main current flows, joined to the second main surface, and a resin portion sealing the semiconductor substrate, the capacitor and the electrodes. The capacitor includes electrodes. The electrode of the capacitor and the electrode of the semiconductor element are joined to each other by solder such that surfaces exposed through the resin portion are arranged on one continuous surface on which a cooler can be attached. Therefore, a power semiconductor module can be provided in which the capacitor and the power semiconductor element can effectively be cooled and the surge voltage can be reduced.

摘要翻译： 功率半导体元件和电容器的电极在模块中彼此连接。 功率半导体元件形成在具有第一和第二主表面的半导体衬底上。 功率半导体模块包括主电流流过的电极，与第一主表面接合，主电流流过的电极连接到第二主表面，以及密封半导体衬底，电容器和 电极。 电容器包括电极。 电容器的电极和半导体元件的电极通过焊料彼此接合，使得通过树脂部分暴露的表面被布置在可连接冷却器的一个连续表面上。 因此，可以提供能够有效地冷却电容器和功率半导体元件的功率半导体模块，并且可以降低浪涌电压。

公开(公告)号：US08269331B2

公开(公告)日：2012-09-18

申请号：US11886264

申请日：2006-03-16

申请人： Norifumi Furuta

发明人： Norifumi Furuta

IPC分类号： H01L25/07

CPC分类号： H01L25/162 ,  H01C3/06 ,  H01L23/473 ,  H01L24/33 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A power semiconductor element and a capacitor have their electrodes joined to each other in a module. The power semiconductor element is formed on a semiconductor substrate having first and second main surfaces. A power semiconductor module includes an electrode through which a main current flows, joined to the first main surface, an electrode through which the main current flows, joined to the second main surface, and a resin portion sealing the semiconductor substrate, the capacitor and the electrodes. The capacitor includes electrodes. The electrode of the capacitor and the electrode of the semiconductor element are joined to each other by solder such that surfaces exposed through the resin portion are arranged on one continuous surface on which a cooler can be attached. Therefore, a power semiconductor module can be provided in which the capacitor and the power semiconductor element can effectively be cooled and the surge voltage can be reduced.

摘要翻译： 功率半导体元件和电容器的电极在模块中彼此连接。 功率半导体元件形成在具有第一和第二主表面的半导体衬底上。 功率半导体模块包括主电流流过的电极，与第一主表面接合，主电流流过的电极连接到第二主表面，以及密封半导体衬底，电容器和 电极。 电容器包括电极。 电容器的电极和半导体元件的电极通过焊料彼此接合，使得通过树脂部分暴露的表面被布置在可连接冷却器的一个连续表面上。 因此，可以提供能够有效地冷却电容器和功率半导体元件的功率半导体模块，并且可以降低浪涌电压。