Electrical conduction path structure and wiring harness incorporating the same
    1.
    发明授权
    Electrical conduction path structure and wiring harness incorporating the same 有权
    导电路径结构和包括其的线束

    公开(公告)号:US09358936B2

    公开(公告)日:2016-06-07

    申请号:US13980275

    申请日:2012-01-18

    IPC分类号: B60R16/02 B60L3/00

    CPC分类号: B60R16/0207 B60L3/0069

    摘要: A wiring harness can include a plurality of high-voltage electrical conduction paths, a motor connector provided at one ends of the high-voltage electrical conduction paths, and an inverter connector provided at the other ends of the high-voltage electrical conduction paths. An extra-length portion can be provided at an intermediate portion of the conductor. The extra-length portion can be configured to absorb displacement caused by a force acting upon the wiring harness and forcing it to be extended. The extra-length portion can take a folded shape obtained by folding the conductor.

    摘要翻译: 线束可以包括多个高压导电路径,设置在高压导电路径的一端的马达连接器,以及设置在高压导电路径的另一端的反相器连接器。 可以在导体的中间部分设置超长部分。 超长部分可以被配置为吸收由作用在线束上的力引起的位移并迫使其延伸。 超长部分可以采取通过折叠导体获得的折叠形状。

    STACKED COOLER
    2.
    发明申请
    STACKED COOLER 审中-公开
    堆垛机

    公开(公告)号:US20130003301A1

    公开(公告)日:2013-01-03

    申请号:US13581296

    申请日:2010-11-24

    IPC分类号: H05K7/20

    摘要: A stacked cooler includes a plurality of refrigerant flow passages and a plurality of semiconductor modules. The refrigerant flow passages and the semiconductor modules are stacked alternately, and each of opposite surfaces in a stacking direction of each of the semiconductor modules is in contact with a corresponding one of the refrigerant flow passages, thereby cooling the semiconductor modules. The semiconductor modules generate different amounts of heat. One or a plurality of the semiconductor modules and one or a plurality of the semiconductor modules are arranged in each of arrangement spaces adjacent to the refrigerant flow passages so that a difference in amount of heat generated between the respective arrangement spaces becomes small. Consequently, cooling capability is equalized throughout the respective arrangement spaces, enabling reduction in waste due to excessive cooling.

    摘要翻译: 堆叠冷却器包括多个制冷剂流动通道和多个半导体模块。 制冷剂流动通道和半导体模块交替堆叠,并且每个半导体模块的层叠方向上的每个相对表面与相应的一个制冷剂流动通道接触,从而冷却半导体模块。 半导体模块产生不同的热量。 一个或多个半导体模块和一个或多个半导体模块布置在与制冷剂流动通道相邻的每个布置空间中,使得在各个排列空间之间产生的热量差异变小。 因此,冷却能力在整个相应的布置空间中是相等的,从而能够减少由于过度冷却造成的浪费。

    Connection structure and inverter
    5.
    发明授权
    Connection structure and inverter 有权
    连接结构和变频器

    公开(公告)号:US09565792B2

    公开(公告)日:2017-02-07

    申请号:US14082580

    申请日:2013-11-18

    IPC分类号: H05K7/20 F16L5/12 F16L21/02

    摘要: Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to a first opening by a planar seal. Another end of the first connecting pipe is connected to one end of a second connecting pipe by a shaft seal. Another end of the second connecting pipe is connected to a second opening by a planar seal. An axial direction of a shaft seal is perpendicular to a plane that includes the first opening.

    摘要翻译: 制冷剂运行的两个开口通过第一连接管和第二连接管连接。 第一连接管的一端通过平面密封件连接到第一开口。 第一连接管的另一端通过轴封连接到第二连接管的一端。 第二连接管的另一端通过平面密封件连接到第二开口。 轴封的轴向垂直于包括第一开口的平面。

    Electrical Conduction Path Structure and Wiring harness Incorporating the Same
    6.
    发明申请
    Electrical Conduction Path Structure and Wiring harness Incorporating the Same 有权
    导电路径结构和配线线束结合在一起

    公开(公告)号:US20130299235A1

    公开(公告)日:2013-11-14

    申请号:US13980275

    申请日:2012-01-18

    IPC分类号: B60R16/02

    CPC分类号: B60R16/0207 B60L3/0069

    摘要: A wiring harness can include a plurality of high-voltage electrical conduction paths, a motor connector provided at one ends of the high-voltage electrical conduction paths, and an inverter connector provided at the other ends of the high-voltage electrical conduction paths. An extra-length portion can be provided at an intermediate portion of the conductor. The extra-length portion can be configured to absorb displacement caused by a force acting upon the wiring harness and forcing it to be extended. The extra-length portion can take a folded shape obtained by folding the conductor.

    摘要翻译: 线束可以包括多个高压导电路径,设置在高压导电路径的一端的马达连接器,以及设置在高压导电路径的另一端的反相器连接器。 可以在导体的中间部分设置超长部分。 超长部分可以被配置为吸收由作用在线束上的力引起的位移并迫使其延伸。 超长部分可以采取通过折叠导体获得的折叠形状。

    CONNECTION STRUCTURE AND INVERTER
    9.
    发明申请
    CONNECTION STRUCTURE AND INVERTER 有权
    连接结构与逆变器

    公开(公告)号:US20140140118A1

    公开(公告)日:2014-05-22

    申请号:US14082580

    申请日:2013-11-18

    IPC分类号: F16L23/16 H05K7/20

    摘要: Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to a first opening by a planar seal. Another end of the first connecting pipe is connected to one end of a second connecting pipe by a shaft seal. Another end of the second connecting pipe is connected to a second opening by a planar seal. An axial direction of a shaft seal is perpendicular to a plane that includes the first opening.

    摘要翻译: 制冷剂运行的两个开口通过第一连接管和第二连接管连接。 第一连接管的一端通过平面密封件连接到第一开口。 第一连接管的另一端通过轴封连接到第二连接管的一端。 第二连接管的另一端通过平面密封件连接到第二开口。 轴封的轴向垂直于包括第一开口的平面。

    COOLING STRUCTURE OF SEMICONDUCTOR DEVICE
    10.
    发明申请
    COOLING STRUCTURE OF SEMICONDUCTOR DEVICE 审中-公开
    半导体器件的冷却结构

    公开(公告)号:US20120228757A1

    公开(公告)日:2012-09-13

    申请号:US13511305

    申请日:2009-11-25

    IPC分类号: H01L23/36

    摘要: A cooling structure of a semiconductor device includes an output electrode, a semiconductor element and a semiconductor element disposed to face each other with the output electrode interposed therebetween, a radiator disposed for the semiconductor element on a side opposite to the output electrode, and a radiator disposed for the semiconductor element on the side opposite to the output electrode. The output electrode includes an element mounting portion and a heat transport portion. The element mounting portion is electrically connected to the semiconductor element and the semiconductor element, and is formed of a conductive material. The heat transport portion is disposed to extend from the element mounting portion toward the radiator and the radiator. With this structure, a cooling structure of a semiconductor device with which excellent cooling efficiency is realized can be provided.

    摘要翻译: 半导体器件的冷却结构包括输出电极,半导体元件和半导体元件,半导体元件和半导体元件设置成彼此相对,输出电极介于其间;散热器,设置在半导体元件的与输出电极相对的一侧,散热器 设置在与输出电极相对的一侧上的半导体元件。 输出电极包括元件安装部分和热传输部分。 元件安装部分电连接到半导体元件和半导体元件,并且由导电材料形成。 热传输部分从元件安装部分朝向散热器和散热器设置。 利用这种结构,可以提供实现优异的冷却效率的半导体器件的冷却结构。