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公开(公告)号：US4796124A
公开(公告)日：1989-01-03
申请号：US27405
申请日：1987-03-18
申请人： Yukio Yokota , Isao Iwase , Satoshi Uematsu
发明人： Yukio Yokota , Isao Iwase , Satoshi Uematsu
CPC分类号： G11B21/00 , G06K7/015 , G06K7/084 , G06Q20/347 , G07F7/086 , G07F7/0873
摘要： In a conventional cash or credit card, since the magnetization angle between the magnetic head and the recording medium formed on the card is fixed, data recorded on the card can easily be discriminated or copied through a card reader for allowing dishonest use of the card. To overcome these problems, data are written or read on or from the card on the basis of a head motion pattern code recorded at the head area of the recording medium. In operation, the read/write head is moved relative to a moving card in accordance with a head motion signal corresponding to a recorded head motion pattern code so that the magnetization angle between the head and the recording medium is intermittently varied in both data recording and reproducing operations.
摘要翻译： 在传统的现金或信用卡中，由于磁头和形成在卡上的记录介质之间的磁化角度是固定的，所以记录在卡上的数据可以容易地通过读卡器被识别或复制，以允许不诚实地使用卡。 为了克服这些问题，基于记录在记录介质的头部区域的头部运动模式代码，在卡上或从卡上读出数据。 在操作中，读/写头根据对应于记录的头部运动图案代码的头部运动信号相对于移动卡移动，使得头部和记录介质之间的磁化角度在数据记录和 再现操作。
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2.发明授权Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method 有权研磨磨料，研磨剂，磨料溶液，研磨剂制备方法，研磨方法和半导体器件制造方法公开(公告)号：US07267604B2
公开(公告)日：2007-09-11
申请号：US11071589
申请日：2005-03-04
IPC分类号： B24D17/00
CPC分类号： H01L21/30625 , B24B37/044 , C09K3/1409 , C09K3/1463 , H01L21/02013
摘要： Abrasive grains have mainly grains with a roundness of 0.50 or more and 0.75 or less, where the roundness is defined as the ratio of the circumference of a circle having the same area as that of a grain to the perimeter of that grain. An abrasive has the abrasive grains and at least one of an oxidizer, an oxide solution, an abrasive grain dispersion agent and a basic compound. An abrasive solution has the abrasive grains and water or hydrophilic substance.
摘要翻译： 磨粒主要是圆度为0.50以上且0.75以下的圆形，其中圆度被定义为具有与颗粒相同面积的圆的周长与该颗粒的周长的比率。 磨料具有磨粒和氧化剂，氧化物溶液，磨粒分散剂和碱性化合物中的至少一种。 磨料溶液具有磨粒和水或亲水性物质。
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公开(公告)号：US07174873B2
公开(公告)日：2007-02-13
申请号：US11256115
申请日：2005-10-24
申请人： Satoshi Uematsu
发明人： Satoshi Uematsu
IPC分类号： F02M35/10
CPC分类号： F02M35/1036 , B29C65/02 , B29C65/04 , B29C65/06 , B29C65/20 , B29C65/222 , B29C66/1312 , B29C66/301 , B29C66/322 , B29C66/54 , B29C66/972 , B29K2101/12 , B29L2031/749 , B29L2031/7492 , F02M35/10111 , F02M35/10321 , F02M35/112
摘要： A synthetic resin intake manifold body and a synthetic resin passage structural member are respectively provided with a body side joining flange and a structural member side joining flange that are continuously formed along a joining line. A protrusion is provided on the body side joining flange and a welding protrusion and an inside and an outside control wall are provided on the structural member side joining flange. When the synthetic resin passage structural member is positioned and aligned with respect to the synthetic resin intake manifold body along the joining line prior to welding, a volume of an inside burr retaining groove is set to be larger than a volume of an outside burr retaining groove.
摘要翻译： 合成树脂进气歧管体和合成树脂通道结构件分别设置有沿接合线连续形成的主体侧接合凸缘和结构构件侧接合凸缘。 在主体侧接合法兰上设置有突起，在结构构件侧接合法兰上设置有焊接突起，内侧和外侧的控制壁。 当合成树脂通道结构构件在焊接之前沿着接合线相对于合成树脂进气歧管体定位和对准时，内部毛刺保持槽的体积被设定为大于外部毛刺保持槽的体积 。
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4.发明申请Grinding abrasive grains, abrasive, abrasive solution, abrasive solution preparation method, grinding method, and semiconductor device fabrication method 有权研磨磨料，研磨剂，磨料溶液，研磨剂制备方法，研磨方法和半导体器件制造方法公开(公告)号：US20050205836A1
公开(公告)日：2005-09-22
申请号：US11071589
申请日：2005-03-04
IPC分类号： B24B37/00 , B24D99/00 , B44C1/22 , C09K3/14 , C09K13/00 , H01L21/302 , H01L21/304 , H01L21/306
CPC分类号： H01L21/30625 , B24B37/044 , C09K3/1409 , C09K3/1463 , H01L21/02013
摘要： Abrasive grains have mainly grains with a roundness of 0.50 or more and 0.75 or less, where the roundness is defined as the ratio of the circumference of a circle having the same area as that of a grain to the perimeter of that grain. An abrasive has the abrasive grains and at least one of an oxidizer, an oxide solution, an abrasive grain dispersion agent and a basic compound. An abrasive solution has the abrasive grains and water or hydrophilic substance.
摘要翻译： 磨粒主要是圆度为0.50以上且0.75以下的圆形，其中圆度被定义为具有与颗粒相同面积的圆的周长与该颗粒的周长的比率。 磨料具有磨粒和氧化剂，氧化物溶液，磨粒分散剂和碱性化合物中的至少一种。 磨料溶液具有磨粒和水或亲水性物质。
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5.发明申请公开(公告)号：US20060185688A1
公开(公告)日：2006-08-24
申请号：US11324228
申请日：2006-01-04
CPC分类号： H01L21/02052
摘要： A semiconductor wafer cleaning method has steps of cleaning a surface of a semiconductor wafer with a cleaning solution that has an etching function; and cleaning the surface of the semiconductor wafer with a high-purity organic solvent while circulating the high-purity organic solvent so as to remove Ca and Mg on the surface of the semiconductor wafer.
摘要翻译： 半导体晶片清洗方法具有用具有蚀刻功能的清洗液清洗半导体晶片的表面的步骤; 并在循环高纯度有机溶剂的同时用高纯度有机溶剂清洗半导体晶片的表面，以除去半导体晶片表面上的Ca和Mg。
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公开(公告)号：US20060086334A1
公开(公告)日：2006-04-27
申请号：US11256115
申请日：2005-10-24
申请人： Satoshi Uematsu
发明人： Satoshi Uematsu
IPC分类号： F02M35/10
CPC分类号： F02M35/1036 , B29C65/02 , B29C65/04 , B29C65/06 , B29C65/20 , B29C65/222 , B29C66/1312 , B29C66/301 , B29C66/322 , B29C66/54 , B29C66/972 , B29K2101/12 , B29L2031/749 , B29L2031/7492 , F02M35/10111 , F02M35/10321 , F02M35/112
摘要： A synthetic resin intake manifold body and a synthetic resin passage structural member are respectively provided with a body side joining flange and a structural member side joining flange that are continuously formed along a joining line. A protrusion is provided on the body side joining flange and a welding protrusion and an inside and an outside control wall are provided on the structural member side joining flange. When the synthetic resin passage structural member is positioned and aligned with respect to the synthetic resin intake manifold body along the joining line prior to welding, a volume of an inside burr retaining groove is set to be larger than a volume of an outside burr retaining groove.
摘要翻译： 合成树脂进气歧管体和合成树脂通道结构件分别设置有沿接合线连续形成的主体侧接合凸缘和结构构件侧接合凸缘。 在主体侧接合法兰上设置有突起，在结构构件侧接合法兰上设置有焊接突起，内侧和外侧的控制壁。 当合成树脂通道结构构件在焊接之前沿着接合线相对于合成树脂进气歧管体定位和对准时，内部毛刺保持槽的体积被设定为大于外部毛刺保持槽的体积 。
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公开(公告)号：US06619425B2
公开(公告)日：2003-09-16
申请号：US10176610
申请日：2002-06-24
申请人： Shinji Miyakawa , Satoshi Uematsu
发明人： Shinji Miyakawa , Satoshi Uematsu
IPC分类号： F01W106
CPC分类号： F02M35/10321 , F02M35/10301 , F02M35/10334 , F02M35/1272 , F02M35/1277 , F05C2225/08 , G10K11/168
摘要： A soundproof cover includes a sealing layer, a sound insulation layer, and a vibration inhibition layer. The sound insulation layer has a peripheral portion, is to be disposed so as to contact at least the peripheral portion with a noise source, and exhibits elasticity. The sound insulation layer is formed as a hard plate shape, has an installation portion to be fastened to the noise source, and is disposed so as to cover the sealing layer. The vibration inhibition layer is disposed on at least a part of an interface between the sealing layer and the sound insulation layer so as to adhere to the sound insulation layer, and inhibits the sound insulation layer from vibrating.
摘要翻译： 隔音罩包括密封层，隔音层和防振层。 隔音层具有周边部分，其设置成至少与周边部分与噪声源接触，并且具有弹性。 隔音层形成为硬板形状，具有要紧固到噪声源的安装部分，并且被设置成覆盖密封层。 防振层设置在密封层和隔音层之间的界面的至少一部分上以粘附到隔音层，并且抑制隔音层振动。
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