-
公开(公告)号:US20070079934A1
公开(公告)日:2007-04-12
申请号:US11512431
申请日:2006-08-30
IPC分类号: H01L21/306 , C23F1/00 , C23C16/00
CPC分类号: C23C16/45565 , C04B41/009 , C04B41/53 , C04B41/91 , C04B35/505
摘要: To provide an inexpensive gas dispersion plate having a high corrosion resistance to halogen-based corrosive gasses and a plasma thereof, and capable of preventing particle generation from the gas hole, thereby contributing to an improvement in the production yield of the semiconductor devices. The gas dispersion plate includes one or plural gas holes in a base material formed by a Y2O3 ceramic material having a relative density of 96% or more, in which an edge part of the gas hole is formed by a sand blasting process into a rounded shape with a radius of curvature of 0.2 mm or more.
摘要翻译: 为了提供对卤素类腐蚀性气体和其等离子体具有高耐蚀性的廉价的气体分散板,并且能够防止从气孔产生颗粒,从而有助于提高半导体器件的产量。 气体分散板包括由相对密度为96%以上的Y 2 O 3 O 3陶瓷材料形成的基材中的一个或多个气孔,其中 气孔的边缘部分通过喷砂处理形成为具有0.2mm或更大的曲率半径的圆形。
-
公开(公告)号:US07476634B2
公开(公告)日:2009-01-13
申请号:US11504102
申请日:2006-08-15
IPC分类号: C04B35/505
CPC分类号: C04B35/505 , B22F2998/00 , B22F2998/10 , C04B2235/404 , C04B2235/5436 , C04B2235/5445 , C04B2235/604 , C04B2235/6581 , C04B2235/6582 , C04B2235/77 , C04B2235/96 , C04B2235/9607 , C04B2235/9692 , C22C1/051 , C22C29/005 , C22C29/12 , H01J37/32431 , B22F3/1007 , B22F2201/013 , B22F9/026 , B22F1/0003 , B22F3/04
摘要: To provide a yttria sintered body having an excellent corrosion resistance to halogen-based corrosive gases and plasma and an excellent thermal shock resistance, and adapted for use as a component member in manufacturing apparatuses for semiconductor and liquid crystal devices, particularly in a plasma process apparatus. A yttria sintered body including tungsten of an average particle size of 3 μm or less dispersed in the yttria so that a ratio of the tungsten relative to the yttria is ranging from 1 to 50% in terms of weight, and having an open pore rate of 0.2% or less and a thermal shock resistance by water submersion method of 200° C. or larger.
摘要翻译: 为了提供一种对卤素类腐蚀性气体和等离子体具有优异的耐腐蚀性和优异的耐热冲击性的氧化钇烧结体,适合用作半导体和液晶装置的制造装置中的部件,特别是在等离子体处理装置 。 一种氧化钇烧结体,其包含平均粒度为3μm以下的均匀分布在氧化钇中的钨,使得钨相对于氧化钇的比例为1〜50重量%,开孔率为 0.2%以下,水浸方法的耐热冲击性为200℃以上。
-
公开(公告)号:US20070066478A1
公开(公告)日:2007-03-22
申请号:US11504102
申请日:2006-08-15
IPC分类号: C04B35/505
CPC分类号: C04B35/505 , B22F2998/00 , B22F2998/10 , C04B2235/404 , C04B2235/5436 , C04B2235/5445 , C04B2235/604 , C04B2235/6581 , C04B2235/6582 , C04B2235/77 , C04B2235/96 , C04B2235/9607 , C04B2235/9692 , C22C1/051 , C22C29/005 , C22C29/12 , H01J37/32431 , B22F3/1007 , B22F2201/013 , B22F9/026 , B22F1/0003 , B22F3/04
摘要: To provide a yttria sintered body having an excellent corrosion resistance to halogen-based corrosive gases and plasma and an excellent thermal shock resistance, and adapted for use as a component member in manufacturing apparatuses for semiconductor and liquid crystal devices, particularly in a plasma process apparatus. A yttria sintered body including tungsten of an average particle size of 3 μm or less dispersed in the yttria so that a ratio of the tungsten relative to the yttria is ranging from 1 to 50% in terms of weight, and having an open pore rate of 0.2% or less and a thermal shock resistance by water submersion method of 200° C. or larger.
摘要翻译: 为了提供一种对卤素类腐蚀性气体和等离子体具有优异的耐腐蚀性和优异的耐热冲击性的氧化钇烧结体,适合用作半导体和液晶装置的制造装置中的部件,特别是在等离子体处理装置 。 一种氧化钇烧结体,其包含平均粒度为3μm以下的均匀分布在氧化钇中的钨,使得钨相对于氧化钇的比例为1〜50重量%,开孔率为 0.2%以下,水浸方法的耐热冲击性为200℃以上。
-
公开(公告)号:US20060073354A1
公开(公告)日:2006-04-06
申请号:US11239678
申请日:2005-09-30
CPC分类号: H01J37/3244 , C22C21/00 , C23C4/11 , C25D1/08 , H01J37/32495 , Y10T428/12361 , Y10T428/12493 , Y10T428/12736
摘要: A gas diffusion plate has an alumina or an aluminum base material provided with one or more through holes and an yttria body shrink-fitted to one of the through holes and provided with one or more gas discharge holes.
摘要翻译: 气体扩散板具有设置有一个或多个通孔的氧化铝或铝基材料,并且将氧化钇体收缩配合到一个通孔并且设置有一个或多个排气孔。
-
公开(公告)号:US20090226699A1
公开(公告)日:2009-09-10
申请号:US12394943
申请日:2009-02-27
申请人: Yukitaka MURATA , Keisuke Watanabe
发明人: Yukitaka MURATA , Keisuke Watanabe
CPC分类号: C04B35/50 , C04B35/505 , C04B41/009 , C04B41/5045 , C04B41/87 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/656 , C04B2235/6582 , C04B2235/72 , C04B2235/77 , C04B2235/963 , H01J37/32495 , Y10T428/24997 , Y10T428/31 , C04B41/4527 , C04B35/10
摘要: The present invention aims to provide a sintered body and a component used in a plasma processing apparatus. The sintered body and the component are mainly composed of a cerium oxide, which is excellent in corrosion resistance to halogen-based gas or plasma, and can reduce resistance. The cerium oxide can also suppress contamination of metal due to impurity caused by the constituent material of the ceramic even in a halogen plasma process, so that it can preferably be used, as a substitute of an yttria, for a component in a plasma processing apparatus for manufacturing a semiconductor or liquid crystal.A sintered body is used, wherein at least the portion exposed to plasma is formed by adding an yttria with a purity of 99% or more in an amount of 3 parts by weight or more and 100 parts by weight or less to 100 parts by weight of a cerium oxide having purity of 99% or more. Alternatively, a component covered by a sprayed film having the composition same as described above is used. Alternatively, a sintered body that is formed by adding a lanthanum oxide with a purity of 99% or more to a cerium oxide with a purity of 99% or more in an amount of 1 to 50 mol % in the total composition is used, wherein the surface roughness Ra of the portion at least exposed to plasma is less than 1.6 μm.
摘要翻译: 本发明的目的在于提供一种用于等离子体处理装置的烧结体和部件。 烧结体及其成分主要由氧化铈构成,其对卤素系气体或等离子体的耐腐蚀性优异,能够降低电阻。 即使在卤素等离子体工艺中,氧化铈也可以抑制由于陶瓷构成材料引起的杂质而导致的金属污染,因此优选使用等离子体处理装置中的成分作为氧化钇的替代物 用于制造半导体或液晶。 使用烧结体,其中至少暴露于等离子体的部分通过以3重量份以上且100重量份以下至100重量份的量添加纯度为99%以上的氧化钇而形成 的纯度为99%以上的氧化铈。 或者,使用由具有上述组成相同的喷涂膜覆盖的部件。 或者,使用通过向总组合物中的纯度为99%以上的氧化铈添加1〜50摩尔%的纯度为99%以上的氧化镧而形成的烧结体,其中, 至少暴露于等离子体的部分的表面粗糙度Ra小于1.6μm。
-
公开(公告)号:US20140156181A1
公开(公告)日:2014-06-05
申请号:US14130417
申请日:2011-11-10
申请人: Keisuke Watanabe , Yuki Furumoto
发明人: Keisuke Watanabe , Yuki Furumoto
IPC分类号: G01C21/36
CPC分类号: G01C21/3608 , G01C21/3632 , G08G1/096872 , G09B29/106
摘要: Because a navigation device or method according to the present invention extracts only route guidance expressions which a speaking person, such as a fellow passenger, provides for the driver, interprets the abstract route guidance expressions to determine a concrete route guidance expression, and outputs information to be presented corresponding to the concrete route guidance expression, the navigation device enables the driver to understand the content intuitively and can prevent the driver from mishearing the speaking person's utterance and from driving the vehicle toward a direction which the speaking person does not intend.
摘要翻译: 因为根据本发明的导航装置或方法仅提取诸如乘客等的说话人为驾驶员提供的路线引导表达,解释抽象路线指导表达式以确定具体的路线指导表达,并将信息输出到 根据具体的路线指导表达方式呈现,导航装置使驾驶员能够直观地了解内容,可以防止驾驶员误解说话人的话语和驾驶车辆朝向讲话者不打算的方向。
-
公开(公告)号:US20140079433A1
公开(公告)日:2014-03-20
申请号:US14024695
申请日:2013-09-12
申请人: Keisuke Watanabe
发明人: Keisuke Watanabe
IPC分类号: G03G15/00
CPC分类号: G03G15/80 , G03G21/1619
摘要: An image forming apparatus includes an image forming portion, a first side frame and a second side frame facing each other and supporting a part of the image forming portion, a lower frame connecting the first side frame and the second side frame below the image forming portion, a lower voltage power supply board including a low voltage circuit configured to lower a voltage from an external power supply to a specified voltage and supply the specified voltage to other units, and a cover. The lower frame has an upper surface facing upward and includes a plurality of fixing portions. The low voltage power supply board is fixed to the fixing portions of the lower frame. The cover covers the lower voltage power supply board on a side thereof opposite to the lower frame.
摘要翻译: 图像形成装置包括图像形成部分,第一侧框架和第二侧框架,其彼此面对并支撑图像形成部分的一部分;下框架,其将第一侧框架和第二侧框架连接在图像形成部分下方 低电压电源板,包括低压电路,其被配置为将来自外部电源的电压降低到指定电压,并将指定的电压提供给其它单元,以及盖。 下框架具有面向上的上表面并且包括多个固定部分。 低压电源板固定在下框架的固定部分上。 盖子在与下框架相对的一侧覆盖低压电源板。
-
公开(公告)号:US08277679B2
公开(公告)日:2012-10-02
申请号:US13024675
申请日:2011-02-10
申请人: Akihiko Nakamura , Keisuke Watanabe
发明人: Akihiko Nakamura , Keisuke Watanabe
IPC分类号: H01F1/147
CPC分类号: H01F1/14766 , B22F1/004 , B32B15/01 , C22C9/00 , C22C33/0257 , C22C38/02 , C22C38/04 , C22C38/34 , C22C38/38 , C22C2202/02 , H01F1/26 , H01F41/0246
摘要: The object of the present invention is to provide a composite magnetic material having well-balanced magnetic properties and chemical properties, and a magnetic element using thereof. Concretely, the present provides the composite magnetic material comprising a binder and a magnetic powder contains followings: Mn not less than 0.25 wt % and not larger than 3 wt %, Si not less than 1 wt % and not larger than 7 wt %, Cr not less than 2 wt % and not larger than 8 wt %, and the rest of Fe and inevitable impurities with respect to the total weight of a magnetic powder material, and a ratio of powder particles having the major/minor axis is not less than 2 is not larger than 5% of the total powder particles.
摘要翻译: 本发明的目的是提供具有良好平衡的磁性能和化学性质的复合磁性材料,以及使用它的磁性元件。 具体地,本发明提供了包含粘合剂的复合磁性材料和含有以下的磁性粉末:Mn不低于0.25重量%且不大于3重量%,Si不小于1重量%且不大于7重量%,Cr 不小于2重量%且不大于8重量%,其余的Fe和不可避免的杂质相对于磁粉末材料的总重量,并且具有主轴/短轴的粉末颗粒的比例不小于 2不大于总粉末颗粒的5%。
-
9.
公开(公告)号:US20110275179A1
公开(公告)日:2011-11-10
申请号:US13144581
申请日:2010-07-26
申请人: Tomohiro Oomure , Keisuke Watanabe , Masakazu Morimoto , Masayoshi Natsume , Tsutomu Shimura , Tsuyoshi Habu , Masayuki Yamamoto
发明人: Tomohiro Oomure , Keisuke Watanabe , Masakazu Morimoto , Masayoshi Natsume , Tsutomu Shimura , Tsuyoshi Habu , Masayuki Yamamoto
CPC分类号: H01L21/67132 , Y10T428/2848
摘要: Provided is an improved method of joining a protective tape having one object to suppress generation of bending of a semiconductor wafer after a back-grinding process. The protective tape is supplied toward the semiconductor wafer suction-held on a chuck table, and an intermediate sheet is supplied along an upper side of the protective tape. Then, the intermediate sheet is interposed between a joining member and the protective tape along a surface of a base material in the protective tape so as to be movable. Under this state, the joining member and the semiconductor wafer move relative to each other in a horizontal direction, whereby the protective tape is joined to a surface of the semiconductor wafer.
摘要翻译: 提供了一种改进的方法,其连接具有一个物体的保护带,以在后磨削过程之后抑制半导体晶片的弯曲产生。 将保护带供给到被夹持在卡盘台上的半导体晶片,沿着保护带的上侧供给中间片。 然后,中间片沿着保护带中的基材的表面介于接合构件和保护带之间,以便可移动。 在该状态下,接合部件和半导体晶片在水平方向上相对移动,由此将保护带接合到半导体晶片的表面。
-
公开(公告)号:US07809196B2
公开(公告)日:2010-10-05
申请号:US11509061
申请日:2006-08-24
申请人: Keisuke Watanabe , Tatsushi Ohyama
发明人: Keisuke Watanabe , Tatsushi Ohyama
IPC分类号: G06K9/46
CPC分类号: G06K9/4647
摘要: In an object recognition apparatus, a first division unit and a second division unit each partitions an image into a plurality of regions. A first calculation and a second calculation unit each derives, for each of the plurality of regions partitioned. A first comparison unit and a second comparison unit each compares the derived characteristic quantities in between at least two images, for each of the plurality of regions. A recognition unit recognizes a region where the object is located, based on the comparison result.
摘要翻译: 在物体识别装置中,第一分割单元和第二分割单元将图像分割成多个区域。 对于分割的多个区域中的每一个,第一计算和第二计算单元各自导出。 第一比较单元和第二比较单元各自对于多个区域中的每一个区别在至少两个图像之间的导出的特征量。 基于比较结果,识别单元识别对象所在的区域。
-
-
-
-
-
-
-
-
-