APPARATUS AND METHOD TO GENERATE PLASMA
    1.
    发明申请
    APPARATUS AND METHOD TO GENERATE PLASMA 有权
    装置和方法生成等离子体

    公开(公告)号:US20080061702A1

    公开(公告)日:2008-03-13

    申请号:US11684199

    申请日:2007-03-09

    IPC分类号: H05H1/00

    CPC分类号: H01J37/321 H01J37/32091

    摘要: An apparatus and method to generate plasma which can be applied to semiconductor processing. The apparatus includes a chamber having a plasma generating space defined therein, a lower electrode positioned within the chamber, an upper electrode facing the lower electrode and disposed within the chamber to constitute a first plasma generating source, a second plasma generating source positioned at a higher location than that of a lower surface of the upper electrode and disposed at an outer circumference of the upper electrode, and a power supply to supply power to the first and second plasma generating sources.

    摘要翻译: 一种可应用于半导体处理的等离子体生成装置和方法。 该装置包括具有限定在其中的等离子体产生空间的腔室,位于腔室内的下部电极,面对下部电极的上部电极,并设置在腔室内以构成第一等离子体发生源,第二等离子体发生源位于较高 位于上电极的下表面,并且设置在上电极的外周;以及电源,用于向第一和第二等离子体发生源供电。

    Apparatus and method to generate plasma
    2.
    发明授权
    Apparatus and method to generate plasma 有权
    用于产生等离子体的装置和方法

    公开(公告)号:US07804250B2

    公开(公告)日:2010-09-28

    申请号:US11684199

    申请日:2007-03-09

    IPC分类号: H05B6/00

    CPC分类号: H01J37/321 H01J37/32091

    摘要: An apparatus and method to generate plasma which can be applied to semiconductor processing. The apparatus includes a chamber having a plasma generating space defined therein, a lower electrode positioned within the chamber, an upper electrode facing the lower electrode and disposed within the chamber to constitute a first plasma generating source, a second plasma generating source positioned at a higher location than that of a lower surface of the upper electrode and disposed at an outer circumference of the upper electrode, and a power supply to supply power to the first and second plasma generating sources.

    摘要翻译: 一种可应用于半导体处理的等离子体生成装置和方法。 该装置包括具有限定在其中的等离子体产生空间的腔室,位于腔室内的下部电极,面对下部电极的上部电极,并设置在腔室内以构成第一等离子体发生源,第二等离子体发生源位于较高 位于上电极的下表面,并且设置在上电极的外周;以及电源,用于向第一和第二等离子体发生源供电。

    Ion beam extractor
    4.
    发明申请
    Ion beam extractor 失效
    离子束提取器

    公开(公告)号:US20060152164A1

    公开(公告)日:2006-07-13

    申请号:US11208728

    申请日:2005-08-23

    IPC分类号: H01J1/46

    CPC分类号: H01J37/08 H01J27/024

    摘要: An ion beam extractor controls a direction and an intensity of ion beams by adjusting a voltage applied to a grid having slits formed therein, thereby enhancing uniformity of an etching rate of a wafer, leading to an increase of productivity of semiconductor diodes. The ion beam extractor comprises an ion source to produce an ion beam and at least one grid located at a rear end of the ion source in a progressing path of the ion beam produced by the ion source to adjust a direction of the ion beam by controlling a voltage applied to the at least one grid.

    摘要翻译: 离子束提取器通过调节施加到其上形成有狭缝的栅格的电压来控制离子束的方向和强度,从而提高晶片的蚀刻速率的均匀性,从而提高半导体二极管的生产率。 离子束提取器包括离子源以产生离子束和位于离子源的后端处的离子源的至少一个格栅,在由离子源产生的离子束的前进路径中,通过控制离子束来调节离子束的方向 施加到所述至少一个栅格的电压。

    ETCHING APPARATUS USING NEUTRAL BEAM AND METHOD THEREOF
    7.
    发明申请
    ETCHING APPARATUS USING NEUTRAL BEAM AND METHOD THEREOF 审中-公开
    使用中性光束的蚀刻装置及其方法

    公开(公告)号:US20080156771A1

    公开(公告)日:2008-07-03

    申请号:US11965956

    申请日:2007-12-28

    IPC分类号: C23F1/00 B44C1/22

    CPC分类号: H01J37/3233 H01J37/32357

    摘要: An etching apparatus using a neutral beam includes an electron emission unit to convert an ion beam, extracted from plasma by a plurality of grids, into a neutral beam by colliding the ion beam with electrons to prevent the ion beam from physically colliding with the electron emission unit, thus preventing the damage to a neutralization unit and generation of foreign substances with a simple structure. Further, the etching apparatus converts the ion beam into the neutral beam at a high neutralizing efficiency without causing directionality and energy losses, and generates a neutral beam having a large area, thus uniformly etching a semiconductor wafer.

    摘要翻译: 使用中性光束的蚀刻装置包括电子发射单元,用于通过使离子束与电子碰撞来将通过多个栅极从等离子体提取的离子束转换成中性束,以防止离子束与电子发射物理碰撞 单元,从而防止中和单元的损坏和结构简单的异物的产生。 此外,蚀刻装置以高中和效率将离子束转换成中性光束,而不引起方向性和能量损失,并且产生具有大面积的中性光束,因此均匀地蚀刻半导体晶片。

    Ion beam extractor
    8.
    发明授权
    Ion beam extractor 失效
    离子束提取器

    公开(公告)号:US07285788B2

    公开(公告)日:2007-10-23

    申请号:US11208728

    申请日:2005-08-23

    IPC分类号: H01J27/00 H01J49/42

    CPC分类号: H01J37/08 H01J27/024

    摘要: An ion beam extractor controls a direction and an intensity of ion beams by adjusting a voltage applied to a grid having slits formed therein, thereby enhancing uniformity of an etching rate of a wafer, leading to an increase of productivity of semiconductor diodes. The ion beam extractor comprises an ion source to produce an ion beam and at least one grid located at a rear end of the ion source in a progressing path of the ion beam produced by the ion source to adjust a direction of the ion beam by controlling a voltage applied to the at least one grid.

    摘要翻译: 离子束提取器通过调节施加到其上形成有狭缝的栅格的电压来控制离子束的方向和强度,从而提高晶片的蚀刻速率的均匀性,从而提高半导体二极管的生产率。 离子束提取器包括离子源以产生离子束和位于离子源的后端处的离子源的至少一个格栅,在由离子源产生的离子束的前进路径中,通过控制离子束来调节离子束的方向 施加到所述至少一个栅格的电压。