-
公开(公告)号：US08349393B2
公开(公告)日：2013-01-08
申请号：US10902398
申请日：2004-07-29
申请人： Yung-Herng Yau , Thomas B. Richardson , Joseph A. Abys , Karl F. Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
发明人： Yung-Herng Yau , Thomas B. Richardson , Joseph A. Abys , Karl F. Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
IPC分类号： B05D5/00
CPC分类号： H05K1/09 , C09D1/00 , C23C18/16 , C23C18/1614 , C23C18/1616 , C23C18/1633 , C23C18/1683 , C23C18/1687 , C23C18/42 , C23C18/44 , C23C18/54 , C23C22/06 , C23C22/58 , C25D3/46 , C25D3/56 , C25D3/64 , H05K3/244 , H05K3/422 , H05K2203/0257 , H05K2203/073 , Y10S205/916
摘要： Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
-
公开(公告)号：US20060024430A1
公开(公告)日：2006-02-02
申请号：US10902398
申请日：2004-07-29
申请人： Yung-Herng Yau , Thomas Richardson , Joseph Abys , Karl Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
发明人： Yung-Herng Yau , Thomas Richardson , Joseph Abys , Karl Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
CPC分类号： H05K1/09 , C09D1/00 , C23C18/16 , C23C18/1614 , C23C18/1616 , C23C18/1633 , C23C18/1683 , C23C18/1687 , C23C18/42 , C23C18/44 , C23C18/54 , C23C22/06 , C23C22/58 , C25D3/46 , C25D3/56 , C25D3/64 , H05K3/244 , H05K3/422 , H05K2203/0257 , H05K2203/073 , Y10S205/916
摘要： Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
-
公开(公告)号：US20110097597A1
公开(公告)日：2011-04-28
申请号：US12607375
申请日：2009-10-28
申请人： Yung-Herng Yau , Xingping Wang , Cai Wang , Robert Farrell , Pingping Ye , Edward J. Kudrak, JR. , Karl F. Wengenroth , Joseph A. Abys
发明人： Yung-Herng Yau , Xingping Wang , Cai Wang , Robert Farrell , Pingping Ye , Edward J. Kudrak, JR. , Karl F. Wengenroth , Joseph A. Abys
CPC分类号： C23C18/54 , C23C18/48 , Y10T428/12715
摘要： A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.
摘要翻译： 提供了在铜基板的表面上沉积耐晶须锡基涂层的方法。 该方法可用于制备包含具有表面的铜基材的制品; 以及在所述基板的表面上的锡基涂层，其中所述锡基涂层的厚度为0.5微米至1.5微米，并且具有形成铜 - 锡金属间化合物的阻力，其中所述耐铜 - 锡金属间化合物的特征在于，当制品暴露于至少七个加热和冷却循环时，其中每个循环包括使制品经受至少217℃的温度，然后冷却至约20℃的温度。 并且约28℃，仍然存在不超过至少0.25微米厚的铜的锡涂层的区域。
-
公开(公告)号：US09175400B2
公开(公告)日：2015-11-03
申请号：US12607375
申请日：2009-10-28
申请人： Yung-Herng Yau , Xingping Wang , Cai Wang , Robert Farrell , Pingping Ye , Edward J. Kudrak, Jr. , Karl F. Wengenroth , Joseph A. Abys
发明人： Yung-Herng Yau , Xingping Wang , Cai Wang , Robert Farrell , Pingping Ye , Edward J. Kudrak, Jr. , Karl F. Wengenroth , Joseph A. Abys
CPC分类号： C23C18/54 , C23C18/48 , Y10T428/12715
摘要： A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.
摘要翻译： 提供了在铜基板的表面上沉积耐晶须锡基涂层的方法。 该方法可用于制备包含具有表面的铜基材的制品; 以及在所述基板的表面上的锡基涂层，其中所述锡基涂层的厚度为0.5微米至1.5微米，并且具有形成铜 - 锡金属间化合物的阻力，其中所述耐铜 - 锡金属间化合物的特征在于，当制品暴露于至少七个加热和冷却循环时，其中每个循环包括使制品经受至少217℃的温度，然后冷却至约20℃的温度。 并且约28℃，仍然存在不超过至少0.25微米厚的铜的锡涂层的区域。
-
公开(公告)号：US5538617A
公开(公告)日：1996-07-23
申请号：US400941
申请日：1995-03-08
CPC分类号： C25D3/32
摘要： Incorporating an additive into a tin electroplating bath substantially inhibits soluble ferrous ions, ferric ions, and stannous ions from reacting thus minimizing the formation of stannic tin which is lost in the plating sludge.
摘要翻译： 将添加剂掺入锡电镀浴中基本上抑制可溶性亚铁离子，铁离子和亚锡离子反应，从而最小化在电镀污泥中损失的锡锡的形成。
-
6.发明授权
公开(公告)号：US4840712A
公开(公告)日：1989-06-20
申请号：US256977
申请日：1988-10-13
摘要： The invention relates to an improvement in a process for electrodepositing a protective coating of zinc or a zinc alloy on steel or other metal substrates in which the process utilizes a metal conductor roll or conductor roll with metal sleeves and contains a rinsing bath with a mineral acid solution associated with the roll, the improvement comprises providing at least 50 ppm of hydrogen peroxide or a peroxydisulfate compound in the mineral acid bath.
摘要翻译： 本发明涉及在钢或其他金属基材上电沉积锌或锌合金保护涂层的方法的改进，其中该方法利用金属导体辊或导体辊与金属套筒并且含有无机酸的漂洗浴 与辊相关的溶液，改进包括在无机酸浴中提供至少50ppm的过氧化氢或过氧化二硫酸盐化合物。
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.034 秒)
