公开(公告)号：US09265146B2

公开(公告)日：2016-02-16

申请号：US13925136

申请日：2013-06-24

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Che-Wei Hsu ,  Shih-Ping Hsu

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/42

CPC classification number: H05K1/11 ,  H05K3/429 ,  H05K3/4652 ,  Y10T29/49155

Abstract: A method for manufacturing a multi-layer circuit board includes steps of: providing three copper clad laminates; forming trace layers in each copper clad laminate by selectively removing portions of copper layer of each copper clad laminate to obtain three first circuit substrates; laminating a dielectric layer on two of the first circuit substrates to obtain two second circuit substrates; forming a metal bump on the trace layer he other one of the three first circuit substrate to obtain a third circuit substrate; stacking and laminating the third circuit substrate between the two second circuit substrate to obtain a multi-layer circuit board.

Abstract translation: 一种制造多层电路板的方法包括以下步骤：提供三层覆铜层压板; 通过选择性地去除每个覆铜层压板的铜层的部分，在每个覆铜层压板中形成迹线层，以获得三个第一电路基板; 在两个第一电路基板上层叠电介质层以获得两个第二电路基板; 在三个第一电路基板中的另一个上在迹线层上形成金属凸块，以获得第三电路基板; 在第二电路基板之间堆叠和层叠第三电路基板以获得多层电路板。

公开(公告)号：US09015936B2

公开(公告)日：2015-04-28

申请号：US13891204

申请日：2013-05-10

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Che-Wei Hsu ,  Shih-Ping Hsu

IPC: H01K3/10 ,  H05K3/02 ,  H05K3/10 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H05K3/42

CPC classification number: H05K3/108 ,  H01L21/486 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/0097 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2203/1545 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of IC substrate units; and cutting the sheet of substrate into separate IC substrate units.

Abstract translation: 制造IC基板的方法包括以下步骤：提供一卷双面柔性覆铜层压板; 将双面柔性覆铜层压板卷以卷对卷方式转换成双面柔性布线板卷; 将双面柔性布线板的卷筒切割成多个单独的双面柔性布线板; 在每张双面柔性布线板的第一和第二布线层上形成第一和第二刚性绝缘层; 在第一和第二刚性绝缘层上形成第三和第四布线层，并且电连接第一和第三布线层，并电连接第四和第二布线层，从而获得具有多个IC基板单元的基片; 并将基片切割成单独的IC基片单元。