公开(公告)号：US09099450B2

公开(公告)日：2015-08-04

申请号：US14084627

申请日：2013-11-20

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Shih-Ping Hsu

IPC: H01L23/48 ,  H01L23/49 ,  H01L23/00 ,  H05K3/46

CPC classification number: H01L23/49 ,  H01L24/16 ,  H01L24/32 ,  H01L24/43 ,  H01L24/48 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/43 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83104 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/4691 ,  H05K2201/10977 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A package structure includes a flexible-rigid PCB and a chip. The flexible PCB includes a flexible PCB, a glue piece and an outer trace layer. The flexible PCB includes two bending portions and a fixing portion connected between the two bending portions, and includes an insulating layer and an inner trace layer formed on the insulating layer. The glue piece is adhered to the fixing portion. The outer trace layer is adhered to the glue piece and includes conductive pads. The fixing portion, the glue piece and the outer trace layer form a rigid portion, the bending portions form flexible portions. The chip is packaged on the rigid portion and includes electrode pads electrically connected to the conductive pads.

Abstract translation: 封装结构包括柔性刚性PCB和芯片。 柔性PCB包括柔性PCB，胶片和外部迹线层。 柔性PCB包括两个弯曲部分和连接在两个弯曲部分之间的固定部分，并且包括形成在绝缘层上的绝缘层和内部迹线层。 胶片粘附到固定部分。 外部痕迹层粘附到胶合片上并且包括导电垫。 固定部分，胶片和外部迹线层形成刚性部分，弯曲部分形成柔性部分。 芯片被封装在刚性部分上，并且包括电连接到导电焊盘的电极焊盘。

公开(公告)号：US09265146B2

公开(公告)日：2016-02-16

申请号：US13925136

申请日：2013-06-24

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Che-Wei Hsu ,  Shih-Ping Hsu

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/42

CPC classification number: H05K1/11 ,  H05K3/429 ,  H05K3/4652 ,  Y10T29/49155

Abstract: A method for manufacturing a multi-layer circuit board includes steps of: providing three copper clad laminates; forming trace layers in each copper clad laminate by selectively removing portions of copper layer of each copper clad laminate to obtain three first circuit substrates; laminating a dielectric layer on two of the first circuit substrates to obtain two second circuit substrates; forming a metal bump on the trace layer he other one of the three first circuit substrate to obtain a third circuit substrate; stacking and laminating the third circuit substrate between the two second circuit substrate to obtain a multi-layer circuit board.

Abstract translation: 一种制造多层电路板的方法包括以下步骤：提供三层覆铜层压板; 通过选择性地去除每个覆铜层压板的铜层的部分，在每个覆铜层压板中形成迹线层，以获得三个第一电路基板; 在两个第一电路基板上层叠电介质层以获得两个第二电路基板; 在三个第一电路基板中的另一个上在迹线层上形成金属凸块，以获得第三电路基板; 在第二电路基板之间堆叠和层叠第三电路基板以获得多层电路板。

公开(公告)号：US09089082B2

公开(公告)日：2015-07-21

申请号：US14109913

申请日：2013-12-17

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Shih-Ping Hsu

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H05K3/4697 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09072 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of the second surface of the first insulating layer to the outside. The second wiring layer includes electrical contact pads. The conductive blind vias are formed in the first insulating layer. Each electrical contact pad is electrically connected to an end of the corresponding conductive blind via. The other ends of the conductive blind vias are adjacent to the first surface. A filling through hole is formed in the double-sided wiring board. The conductive pastes are respectively electrically connected to the conductive blind vias. The electronic component is adhered to and electrically connected to the conductive paste.

Abstract translation: 具有嵌入式部件的印刷电路板包括双面布线板，电子部件和许多导电浆料。 布线基板包括第一布线层，基底层，第一绝缘层和第二布线层。 底层具有将第一绝缘层的第二表面的一部分暴露于外部的开口。 第二布线层包括电接触垫。 导电盲孔形成在第一绝缘层中。 每个电接触垫电连接到相应的导电盲孔通孔的一端。 导电盲孔的另一端与第一表面相邻。 填充通孔形成在双面布线板中。 导电膏分别电连接到导电盲孔。 电子部件粘附并电连接到导电膏。

公开(公告)号：US09357647B2

公开(公告)日：2016-05-31

申请号：US13971854

申请日：2013-08-21

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Chu-Chin Hu ,  Shih-Ping Hsu ,  E-Tung Chou ,  Chih-Jen Hsiao

IPC: H05K1/11 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H05K1/112 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73104 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads.

Abstract translation: 包装基板包括支撑片，铜箔，多个连接焊盘，多个焊球，树脂层，布线层和焊料掩模层。 铜箔通过粘合片附着在支撑片材的表面上。 连接焊盘形成在铜箔上。 焊球形成在连接焊盘上。 树脂层填充焊球之间的间隙。 布线层形成在树脂层和焊球上。 焊料球的背离连接焊盘的端子部分电连接到布线层。 在布线层上形成焊料掩模层。 焊接掩模层限定暴露部分布线层的多个开口。 通过开口露出的布线层的部分作为接触垫。

公开(公告)号：US08853000B2

公开(公告)日：2014-10-07

申请号：US13777043

申请日：2013-02-26

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Chien-Chih Chen ,  Hong-Xia Shi ,  Shih-Ping Hsu

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/498 ,  H01L25/10 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L25/105 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/11 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for manufacturing a package on package structure includes the steps of: providing a connection substrate comprising a main body and electrically conductive posts, the main body comprising a first surface and an opposite second surface, each electrically conductive post passing through the first and second surfaces, and each end of the two ends of the electrically conductive post protruding from the main body; arranging a first package device on a side of the first surface of the connection substrate, arranging a package adhesive on a side of the second surface of the connection substrate, thereby obtaining a semi-finished package on package structure; and arranging a second package device on a side of the package adhesive furthest from the first package device, thereby obtaining a package on package structure.

Abstract translation: 一种用于制造封装结构上的封装的方法包括以下步骤：提供包括主体和导电柱的连接衬底，所述主体包括第一表面和相对的第二表面，每个导电柱穿过第一和第二表面 表面，并且导电柱的两端的每个端部从主体突出; 在连接基板的第一表面的一侧上布置第一封装器件，在连接衬底的第二表面的一侧上布置封装粘合剂，从而获得封装结构上的半成品封装; 以及在距离所述第一包装装置最远的所述包装粘合剂的一侧布置第二包装装置，从而获得包装结构上的包装。

公开(公告)号：US09271388B2

公开(公告)日：2016-02-23

申请号：US14064202

申请日：2013-10-28

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Shih-Ping Hsu

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H05K1/14 ,  H05K3/28

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0209 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/042 ,  H01L2924/00014

Abstract: A heat-dissipating interposer includes an insulating base, a plurality of conductive pillars and a thermal conducting frame. The insulating base includes a first surface and an opposite second surface. The conductive pillars are arranged on the insulating base. The conductive pillars protrude from the second surface. The height of the conductive pillars relative to the second surface is greater than the thickness of the insulating base. The thermal conducting frame is placed on the second surface and receives a heat-generating component. The interposer can be used in a package on package structure.

Abstract translation: 散热插入件包括绝缘基座，多个导电支柱和导热框架。 绝缘基座包括第一表面和相对的第二表面。 导电柱布置在绝缘基底上。 导电柱从第二表面突出。 导电柱相对于第二表面的高度大于绝缘基底的厚度。 导热框架放置在第二表面上并且接收发热部件。 内插器可用于封装结构上的封装。

公开(公告)号：US09015936B2

公开(公告)日：2015-04-28

申请号：US13891204

申请日：2013-05-10

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Che-Wei Hsu ,  Shih-Ping Hsu

IPC: H01K3/10 ,  H05K3/02 ,  H05K3/10 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H05K3/42

CPC classification number: H05K3/108 ,  H01L21/486 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/0097 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2203/1545 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method for manufacturing an IC substrate includes following steps: providing a roll of double-sided flexible copper clad laminate; converting the roll of double sided flexible copper clad laminate into a roll of double sided flexible wiring board in a roll to roll manner; cutting the roll of double-sided flexible wiring board into a plurality of separate sheets of double sided flexible wiring board; forming first and second rigid insulating layers on the first and second wiring layers of each sheet of double sided flexible wiring board; forming third and fourth wiring layers on the first and second rigid insulating layers, and electrically connecting the first and third wiring layers, and electrically connecting the fourth and second wiring layers, thereby obtaining a sheet of substrate having a plurality of IC substrate units; and cutting the sheet of substrate into separate IC substrate units.

Abstract translation: 制造IC基板的方法包括以下步骤：提供一卷双面柔性覆铜层压板; 将双面柔性覆铜层压板卷以卷对卷方式转换成双面柔性布线板卷; 将双面柔性布线板的卷筒切割成多个单独的双面柔性布线板; 在每张双面柔性布线板的第一和第二布线层上形成第一和第二刚性绝缘层; 在第一和第二刚性绝缘层上形成第三和第四布线层，并且电连接第一和第三布线层，并电连接第四和第二布线层，从而获得具有多个IC基板单元的基片; 并将基片切割成单独的IC基片单元。

公开(公告)号：US09730328B2

公开(公告)日：2017-08-08

申请号：US14138126

申请日：2013-12-23

Applicant: Qi Ding Technology Qinhuangdao Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Shih-Ping Hsu

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H05K1/186 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09072 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A printed circuit board with embedded component includes a double-sided printed circuit board, an electronic component, a plurality of conductive paste blocks, an insulating layer and a wiring layer near the first wiring layer, an insulating layer and a wiring layer near the second wiring layer. The double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer. The first wiring layer and the second wiring layer are arranged on opposite sides of the base. The second wiring layer includes a plurality of electrical contact pads. The base defines a number of conductive vias. Each electrical contact pad is aligned with and electrically connected to one corresponding conductive via. The conductive paste blocks are electrically connecting to the conductive vias. The electronic component is electrically connected to the conductive paste blocks. The two insulating layers cover the electronic component and the second wiring layer.

公开(公告)号：US09000573B2

公开(公告)日：2015-04-07

申请号：US14477888

申请日：2014-09-05

Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Zhen Ding Technology Co., Ltd.

Inventor： Chien-Chih Chen ,  Hong-Xia Shi ,  Shih-Ping Hsu

IPC: H01L23/02 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L25/105 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/11 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A package on package structure includes a connection substrate having a main body and electrically conductive posts, the main body includes a first surface and an opposite second surface, and each electrically conductive post passes through the first and second surfaces, and each end of the two ends of the electrically conductive post protrudes from the main body; a first package device arranged on a side of the first surface of the connection substrate; a package adhesive arranged on a side of the second surface of the connection substrate; and a second package device arranged on a side of the package adhesive furthest away from the first package device.

Abstract translation: 封装结构的封装包括具有主体和导电柱的连接基板，主体包括第一表面和相对的第二表面，并且每个导电柱穿过第一和第二表面，并且两端的每一端 导电柱的端部从主体突出; 布置在连接基板的第一表面侧的第一封装装置; 包装粘合剂，其布置在所述连接基板的所述第二表面的一侧上; 以及布置在最远离所述第一包装装置的所述包装粘合剂的侧面上的第二包装装置。